Articles from Printed Circuit Design & Manufacture (January 1, 2004)

Title	Author	Type	Words
'No license required'.	Buetow, Mike		104
'Spicing' up high speed.	Buetow, Mike		322
'Used to' doesn't live here anymore: you're never too old to get an education.	Daywalt, Ted		639
2003: a blueprint for collaboration: thoughts on how last year brought out the worst--and the best--in us.	Bigelow, Peter		898
2004 buyer's guide: suppliers.			6252
2004 buyers' guide: products.			2862
2004 buyers' guide: services.			681
40% growth for wireless base stations.			103
Cadence rolls up SI, PCB tools.	Buetow, Mike		161
Current carrying capacity tool debuted.			94
Events.		Calendar	236
Has the copper interconnect hits its speed limit? Data rates are reaching the unlikely speed of 40 Gbps, yet copper runs on.	Bogatin, Eric	Cover story	2005
How successful people stay successful: take chances, and look for the opportunities wherever they may arise.	Beaulieu, Dan		795
IC a recovery.			164
Mentor, Cadence expand tool interoperability.	Buetow, Mike		157
Methodology for high aspect ratio pulse plating: periodic reverse pulse tanks were once seen as a current density capacity enhancement for "standard thickness" boards. Now they churn out PCBs with aspect ratios of 15:1.	Edwards, Robert D.		3112
Mixed results: revenue reports.			98
POC 'pushing' handset sales.			162
PowerPCB interface added to GerbTool.			133
Resolving component polarity problems: knowing the rotations for each component type can compensate for inconsistencies in orientation between library geometries and component reels.	Olson, Jack C.		2147
Sold out.			145
The end of the PCB is nigh (again!).	Metcalfe, Jamie		454
The great data race.	Buetow, Mike		549
U.S. production reaches 20-year high.			256
UAL flight 896, seat 16G: how a flight from Hong Kong tripped my logic in last month's column.	Snogren, Richard		876
What designers should know about LDI: not just a tool for fine lines, laser direct imaging eliminates phototools and tightens design tolerances. Aspects to consider when designing for LDI.	Barclay, Brewster F.		1911
Zuken, Siemens Ink design tool pact.	Buetow, Mike		86