United States : Nordson YESTECH Highlights M1m Automated Optical Inspection Solution at IMAPS 2012.
Nordson YESTECH s M1m AOI has specific design enhancements to directly address the unique inspection challenges presented by advanced packaging, complex wire bonding, epoxy splash and ever shrinking component sizes. Increased demand for smaller electronics is driving the microelectronics packaging industry to develop smaller, more efficient component level packages. Surface mounted components, such as flip chips, ball grid arrays (BGAs), and chip-scale packages (CSPs), are developed for use in high-volume production.
The M1m is designed for automated inspection of advanced microelectronics and semiconductor packages, with specific inspection algorithms for:
Wire bond inspection, High accuracy die placement metrology, Surface finish inspection for, foreign objects and scratches, Epoxy underfill, Paste, glues and sealants,
Material dimensional metrology.
Nordson YESTECH s advanced megapixel color technology offers high-speed device inspection with exceptional defect coverage all within a footprint less than 1 sq. meter. The M1m can be put in-line or off-line with an optional magazine loader/unloader.
Programming the M1m is fast and intuitive. With CAD data input, a complete recipe can be completed in less than 1 hour. The offline programming option allows the engineer to create complete recipes at any remote location, without affecting production. The M1m also provides SPC data, defect reports, offline defect classification, offline rework capability and even archived images of every device inspected.
"We look forward to attending the IMAPS show this year, and demonstrating our newest generation M1m AOI inspection system." said Nordson YESTECH Manager, Scott Roberson. "With the rise of demanding microelectronics applications, the M1m meets the unique inspection requirements, offering the state-of-the art AOI technology."
2012 Al Bawaba (Albawaba.com)
Provided by Syndigate.info an Albawaba.com company
|Printer friendly Cite/link Email Feedback|
|Date:||Aug 30, 2012|
|Previous Article:||United States : Suntron Corporation Launches New Website.|
|Next Article:||United States : Avnet Technology Solutions' Pepperweed Consulting Selected as HP Cloud Implementation Partner of the Year in North America;...|