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Ultra clean processing of semiconductor surfaces XI; proceedings.


Ultra clean processing of semiconductor surfaces XI; proceedings.

International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) (11th: 2012: Gent, Belgium) Ed. by Paul Mertens, Marc Meuris and Marc Heyns.

Trans Tech Publications


332 pages


Solid state phenomena; v.195


Since 1992 the bi-annual conference has addressed issues relating to contamination, cleaning, and surface preparation in mainstream large-scale integrated circuit manufacturing. The 73 papers here cover cleaning for front-end-of-the-line applications, wet etching, surface chemistry and functionalization, cleaning for back-end-of-the-line and three-dimensional applications, particles and megasonic cleaning, wetting and drying, metal contamination, and cleaning and wet etching for silicon photo-voltaic applications. Among the topics are selective nitride etch by using fluorides in high boiling point solvent, one-step wet clean removal of post-etch fluropolymer residues, evaluating very dilute alkaline solutions for wafer cleaning with megasonic irradiation, effects of substrate temperature on the learning of micropatterns during the rinse-dry process, and wet cleaning for solar cell manufacturing applications.

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Publication:Reference & Research Book News
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Date:Apr 1, 2013
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