Printer Friendly

Ultra Precision Picker At Wafer Level.

Contract notice: ultra precision picker at wafer level.

The fraunhofer isit requires an ultra-precision mounter with laser-based in-situ eutectic ausn soldering for the assembly of active (laser, laser drivers) and passive micro-optical components (lenses, mirrors, filters) on the smallest pitch. the assembly is to be carried out on silicon and glass-silicon wafer substrates. an integrated diode laser is intended to introduce the energy coupling directly into the contact pad metallization from below through the substrate (avoidance of large heat-affected zones).

This contract is divided into lots: no

Time limit for receipt of tenders or requests to participate: date: 11/12/2017

Local time: 12:00

Conditions for opening tenders date: 12/12/2017

Major organization : FRAUNHOFER GESELLSCHAFT ZUR FRDERUNG DER ANGEWANDTEN FORSCHUNG E. V. BER VERGABEPORTAL DEUTSCHE EVERGABE

Address : Hansastr. 27C

Mnchen

80686

Country :Germany

Email : einkauf@zv.fraunhofer.de

Url : http://www.fraunhofer.de

Tender notice number : 452953-2017

Notice type : Tender Notice

Open date : 2017-12-11

Tender documents : T429785474.html

[c] 2017 Al Bawaba (Albawaba.com) Provided by SyndiGate Media Inc. ( Syndigate.info ).

COPYRIGHT 2017 SyndiGate Media Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2017 Gale, Cengage Learning. All rights reserved.

Article Details
Printer friendly Cite/link Email Feedback
Publication:Mena Report
Date:Nov 15, 2017
Words:173
Previous Article:New Building Johannes Neuhusler School With Single Gym - Tga Planning Services 53 Hoai (facility Groups 1, 2, 3, 7, 8 - Hls), Lph 3-9.
Next Article:Construction Of An Institute Building - V_144_756032_06 Screed Floor Coating.
Topics:

Terms of use | Privacy policy | Copyright © 2019 Farlex, Inc. | Feedback | For webmasters