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UK SMART Group ( is collaborating on a two-year counterfeit detection research project with the aim of developing a novel automated x-ray inspection system. The project, called Chip-Check, seeks good and faked components to test and calibrate system and software parameters. The target is to develop a system capable of verifying components in their packaging. The main focus will be surface mount, but through-hole parts also will be assessed. Currently, no automatic methods exist to speedily check each single component. The system as conceived would be capable of inspecting PCB components on reels and other component feeding mechanisms, and individual parts as well. The research has received funding from the European Community's Seventh Framework Programme, managed by REA-Research Executive Agency.
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Publication:Printed Circuit Design & Fab
Date:Dec 1, 2010
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