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UHV sputter deposition system.

Tenders are invited for UHV sputter deposition system

This system should be composed of a main UHV sputter deposition chamber, an UHV-compatible Load-Lock, and an optional UHV chamber for sample oxidation. The system will be used for the deposition of ultra-thin films of metals and oxides for the fabrication of magnetic devices (magnetic tunnel junctions, Hall sensors).

Validity of the offer: Three months from the date stated for receipt of tender

Tender documents are available from: 01.11.2013

Desired deadline for written questions: 22/11/2013

Deadline for submitting offers Date: 11/12/2013 Time: 23:59 Specific deadlines and procedural requirements: 1 electronically as a PDF file by e-mail

Tender documents : T19117339.html

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Publication:Mena Report
Date:Nov 1, 2013
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