Tokyo Electron, Sematech Partner on 3D Interconnect and High-Mobility Channel Materials.
These programs mark the beginning of a new collaboration in which Sematech will partner with leading suppliers to address key technology challenges that are important to semiconductor customers. This offers suppliers lower R&D costs, accelerated results in technology development, and more efficient and effective technology implementation into leading-edge production fabs.
Under agreements involving an exchange of intellectual property and funding, Sematech and TEL engineers will collaborate on two separate projects, one a three-year effort to transcend the barriers to 3D processing in volume manufacturing, and the other a two-year project to advance the feasibility of using silicon-germanium in transistor gate stacks to increase processing speed.
Copyright [c] 2007 Japan Corporate News Network. All rights reserved.
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|Publication:||JCNN News Summaries|
|Date:||Feb 6, 2007|
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