Thermoplastics Aim for Electronic Encapsulation.
Matrix resins in the "([ec).sup.2]" line include PBT, PPS, PEEK, LCP, PPA (polyphthalamide from BP Amoco), thermoplastic polyimide, and syndiotactic polystyrene (SPS), a new crystalline polymer from Dow Plastics.
Blends of chopped glass and non-conductive minerals are used to control the compounds' coefficients of thermal expansion and ensure good adhesion of encapsulant. Colored and laser-markable versions are offered.
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|Title Annotation:||new from RTP Co.|
|Comment:||Thermoplastics Aim for Electronic Encapsulation.(new from RTP Co.)|
|Article Type:||Brief Article|
|Date:||Jun 1, 2001|
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