Thermal Interface Materials.
Authors: Masao Tomikawa, Ph.D.; Akira Shimada and Yoichi Shimba.
Abstract: A high thermal conductive adhesive sheet with a dielectric constant (Dk) of 5.0 was developed. To obtain low Dk, a low Dk matrix polyimide resin (Dk of 2.6) was designed to decrease Dk as much as possible. To obtain high thermal conductivity, h-BN sphere-shaped filler was used as a main heat thermal conductive filler. The h-BN sphere-shaped filler shows high thermal conductivity (40W/mK) as a bulk filler and low Dk (4.0). High thermal conductive adhesive was obtained by mixing the h-BN cohesive filler into the low Dk polyimide matrix resin. In addition, to make the heat path in the high thermal conductive adhesive to z-direction, AIN whiskers were oriented in the z-direction in the thermal conductive adhesive. A novel method was developed to disperse AIN whiskers in the z-direction. By utilizing the alignment method, thermal conductivity of the materials increased drastically. As a result, the heat conductive sheet shows the heat conductivity of 15W/mK with a low Dk. In addition, the sheet shows excellent breakdown voltage. The adhesive sheet is suitable for thermal interface materials (TIM) for high-voltage power modules. (2019 Pan Pacific Microelectronics Symposium, February 2019)
|Printer friendly Cite/link Email Feedback|
|Title Annotation:||In Case You Missed It|
|Publication:||Printed Circuit Design & Fab Circuits Assembly|
|Date:||Jun 1, 2019|
|Previous Article:||Solder Reliability.|
|Next Article:||'Huawei' E.O. Portends Total Supply-Chain Chaos.|