Printer Friendly

The IEEE Components, Packaging, and Manufacturing Technology Society Announces its 2003 Award Winners.

PISCATAWAY, N.J. -- PISCATAWAY, N.J., May 6 /PRNewswire/ -- The IEEE Components, Packaging and Manufacturing Technology Society (CPMT) is pleased to announce its annual honors to individuals, teams and chapters for their technical excellence, achievement, leadership and service.

"These individuals represent excellence in the industry. Their contributions are furthering today's technologies, and ultimately improve the quality of life for everyone," stated Rao Bonda, Ph.D. Chair, CPMT Society Awards Program.
 The following is a detailed listing of the awards and award winners:
 * Dr. Dennis Olsen (Consultant, Scottsdale, Ariz.) -- The David Feldman
 Outstanding Contribution Award -- for his exceptional service to the
 IEEE and the CPMT Society and its conferences for over 20 years.
 Formerly with Motorola, he earned recognition through a variety of
 distinguished awards, such as the Patent of the Year Award in 1993.
 Over the years, Dr. Olsen was issued five patents covering a broad
 spectrum of electronic packaging, ranging from a state-of-matter patent
 for lead-free solder alloy to a proke card for testing unencapsulated
 semiconductors for known good die applications. He continues to
 demonstrate exceptional service to the Society, the industry and its
 technology through active leadership in organizing conference programs,
 serving on numerous committees, and organizing and being elected as the
 1st chair of the CPMT Society Phoenix, Ariz. Chapter. He is also a past
 president of the CPMT Society.
 * Dr. Thiam Beng Lim (Deputy Director, Institute of Microelectronics,
 Singapore) -- Outstanding Sustained Technical Contribution Award -- for
 his leading edge research in advanced packaging technologies, and for
 managing and transferring the electronic packaging research and
 development to the industry and other research organizations worldwide.
 Dr. Lim has championed Singapore's influence in the electronics
 industry. His work and dedication have helped it evolve from a low-end
 high volume manufacturing industry to the development and manufacturing
 of leading-edge products competing with the best in the world. He is
 also a founding committee member of the prestigious IEEE CPMT Society's
 Electronics Packaging Technology Conference (EPTC) held in Singapore.
 * Mr. Bruce Freyman (Amkor Technology, Chandler, Ariz.) -- Electronics
 Manufacturing Technology Award -- for his pioneering work in developing
 the PBGA package and for his vision and drive in making the PBGA package
 and its format commercially successful. Mr. Freyman is the co-inventor
 and co-developer of the overmolded plastic ball grid array and holds 13
 patents pertaining to array. He is a recognized leader in the sub-
 contract packaging industry with over 20 years in the industry, the last
 ten with Amkor Technology. He was formerly Motorola's Communications
 Sector's I.C. Packaging Manager. It was his leadership, vision and hard
 work that drove he and his sales team at Amkor to be the messengers of
 PBGA technology at virtually every semiconductor company in the world in
 1993 and 1994, changing the way the technology is applied today.
 * Mr. Michael B. McShane, Mr. Paul Lin and Mr. Howard Wilson (Motorola,
 Austin, Tex. -- Paul and Howard were formerly with Motorola) --
 Exceptional Technical Achievement Award -- for co-inventing the PBGA
 package that resulted in new and revolutionary applications for the
 electronic packaging technologies. In fact, this innovation is now
 accepted worldwide as the preferred packaging technology for new
 products. The PBGA package technology has also driven a new supporting
 infrastructure, such as assembly and test equipment. In 2001, Mr.
 McShane was recognized as the Microelectronic Packaging Technologist of
 the Year by Advanced Packaging Magazine and MEPTEC. Mr. McShane was
 most recently the General Chairman of the 2002 ECTC, and an active
 senior member of IEEE for 13 years. He is also on a past member of the
 CPMT Society's Board of Governors.
 * Prof. Emmanouil (Manos) Tentzeris (Georgia Institute of Technology,
 Atlanta, Ga.) -- Outstanding Young Engineer Award -- for his
 contributions to RF circuit design of high performance IC devices and to
 IEEE and CPMT Society sponsored conferences and activities. His
 numerous contributions include the development of the wavelet-based
 MultiResolution Time-Domain (MRTD) technique that allows for the system-
 level simulation of RF-Packaging structures with demonstrated
 significant savings in memory and execution time requirements on one and
 two order of magnitude, respectively with respect to the conventional
 full-wave simulation tools. MRDT was applied for the modeling and the
 evaluation of the most popular RF packaging structures, mainly of flip-
 chip, wirebonds and embedded passives, that led to the full-wave system-
 level analysis of packaged wireless multilayer modules for the first
 time ever. Prof. Tentzeris is a member of the CPMT Society, and a
 member of IEEE for over 13 years. He remains active in reviewing
 technical papers, organizing conferences and other volunteer-leader

The awards will be presented at the 53rd Electronics Components & Technology Conference (ECTC) in New Orleans, Louisiana, USA, during the CPMT Society luncheon on May 29, 2003. The exception is the Electronics Manufacturing Technology Award, which will be presented at the International Electronics Manufacturing Technology (IEMT) Symposium and SEMICON West 2003 in San Jose, California, USA, July 16 - 18.

About the CPMT Society

IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture. Members include world-renowned authorities in microelectronics, optoelectronics, semiconductor processing, materials and connector technologies at companies, universities, government research centers and allied enterprises around the globe. The CPMT Society ( promotes technical excellence and professional development, information exchange and networking opportunities through its journals, conferences and workshops, committee activities, chapter events, educational programs and awards. The Institute of Electrical and Electronics Engineers, Inc. (IEEE), CPMT Society's parent organization, is the world's largest international technical professional society with more than 360,000 members in over 150 countries.

CONTACT: Bob Conrad, +1-202-466-7391, ext. 1123, for IEEE Components, Packaging and Manufacturing Technology Society

Web site:
COPYRIGHT 2003 PR Newswire Association LLC
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2003 Gale, Cengage Learning. All rights reserved.

Article Details
Printer friendly Cite/link Email Feedback
Publication:PR Newswire
Date:May 6, 2003
Previous Article:Statement by the White House Press Secretary; Ambassador L. Paul Bremer as Presidential Envoy to Iraq.
Next Article:AIM 86 Reports First Quarter Net Earnings of Four Cents Per Unit.

Related Articles
NEMI's Director of Operations Receives IEEE Packaging Award.
Industry. (Personals/Personnalites).
Wescon Evolves Into 'Can't Miss' Show for Engineers; New Pavilions, New Exhibitors, New Excitement.
Autodesk Executive Receives IEEE Award for Leadership and Vision.
QUALCOMM Chairman and CEO Receives Prestigious Industry Award for Contribution and Leadership in the Wireless Communications Industry; - IEEE...
Amkor's Bruce Freyman Receives Electronics Manufacturing Technology Award.
EoPlex CEO Arthur L. Chait Will Speak on the Topic of Filling the Gap Between Nano and 'Just Plain Miniature' Devices at the IEEE Meeting February...
Vectron International's Dan Stevens Honored with 2008 IEEE W.G. Cady Award.
EE Times Announces 2009 ACE Awards Winners.

Terms of use | Copyright © 2017 Farlex, Inc. | Feedback | For webmasters