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TI RECEIVES INTERNATIONAL HISTORIC MECHANICAL ENGINEERING LANDMARK FOR INVENTION THAT REVOLUTIONIZED SEMICONDUCTOR MANUFACTURING

 TI RECEIVES INTERNATIONAL HISTORIC MECHANICAL ENGINEERING LANDMARK
 FOR INVENTION THAT REVOLUTIONIZED SEMICONDUCTOR MANUFACTURING
 DALLAS, March 30 /PRNewswire/ -- A Texas Instruments Incorporated (NYSE: TXN) invention that revolutionized the manufacturing of integrated circuits will be designated an International Historic Mechanical Engineering Landmark by the American Society of Mechanical Engineers (ASME), the company announced today.
 The award will be presented on Tuesday, March 31, at the Stemmons Auditorium, Loews Anatole Hotel in Dallas in conjunction with ASME's Manufacturing International Conference. William P. (Pat) Weber, TI executive vice president, and president of TI's Components Sector, will accept the award. Keynote speaker for the event will be Bill Spencer, president and CEO of Sematech.
 The invention for which TI is receiving the award is the Alloy, Bond, Assembly Concept, Universal System, commonly called the ABACUS II. It was an integrated circuit wire bonder, developed in 1972, and was the first mass-produced, automated production tool for the assembly of integrated circuits. This development made economical mass production of ICs possible.
 The invention of the ABACUS II integrated circuit wire bonder played a major part in bringing the integrated circuit from an expensive electronic specialty to the pervasive microchip of today. It gave the semiconductor industry the ability to build integrated circuits at high volume and low cost, accelerating the acceptance of integrated circuits into the marketplace and making a wide range of new electronic equipment possible. By the end of 1990, the worldwide industry had produced more than 240 billion integrated circuits.
 According to ASME president, Nathan Hurt: "The ABACUS II played a major role in increasing the availability of the integrated circuit, spurring a revolution in assembly factories around the world."
 Prior to the ABACUS, the bonding of the chip's microscopic electrical contacts to the appropriate package connections, using fine (ranging from 1/2 to 2/1000 of an inch) gold wire, was performed manually. These manually controlled methods produced only 60 bonded devices per hour and often resulted in production bottlenecks and unsatisfactory levels of production quality and cost.
 Using computer-controlled positioning (250 millionths of an inch) and automatic wire attachment, the ABACUS II bonded up to 375 16-pin devices in an hour, a sixfold improvement in productivity.
 Later machine improvements, made by TI operations in Asia and the United States, resulted in 800 devices bonded per hour. The current ABACUS III-SR bonds nearly 2,000 devices per hour. One operator, who can effectively run ten machines, can produce 20,000 devices per hour.
 Since 1973, approximately 1,000 ABACUS II wire bonders were built and deployed at TI manufacturing sites worldwide. The first competitive, commercial automatic wire bonders were available in 1977.
 The ABACUS II, Serial No. 1, the machine receiving the landmark designation, was installed in TI's Sherman facility in 1973. During its 13-year production life, it was also used at TI sites in Taiwan and Brazil. It is estimated that it bonded more than 50 million integrated circuits.
 TI's ABACUS II wire bonder is the 35th ASME International Historic Mechanical Engineering Landmark since the program's inception in 1971. The program recognizes sites, collections, and landmarks that represent a progressive step in the evolution of mechanical engineering. TI's wire bonder is being recognized as an international contribution due to its influence on the electronics industry worldwide.
 Other landmarks recognized by the ASME include Thomas A. Edison's experimental recording phonograph, the Penn State ventricular heart pump (surgically implantable blood pump), the Arnold Propulsion Wind Tunnel, the Xerox automated xerographic machine, the Corning ribbon machine (produced 2,000 light bulbs per minute), the 100-inch Mount Wilson telescope, and the Pitney Bowes postage meter.
 TI's ABACUS II wire bonder is one of several technological innovations and industry contributions made by TI, including the invention of the integrated circuit in 1958 (see list below).
 TI INDUSTRY CONTRIBUTIONS/INNOVATION MILESTONES
 -- 1954 First commercial silicon transistor
 -- 1958 Invention/demonstration of first integrated circuit
 -- 1961 First integrated-circuit computer
 -- 1967 First hand-held calculator
 -- 1969 Invention of automated thermocompression wire bonding method
 -- 1970 First single-chip microcomputer and microprocessor
 -- 1972 First ABACUS II wire bonder, which made possible high- volume, low-cost manufacturing of integrated circuits
 -- 1978 First single-chip speech synthesizer
 -- 1982 First advanced, single-chip digital signal processor
 -- 1988 First quantum-effect transistor
 -- 1990 Digital micromirror technology for imaging applications
 -- 1991 Most advanced optoelectronic integrated circuit that combines silicon logic circuitry with a gallium arsenide array of infrared light-emitting diodes
 Texas Instruments Incorporated, headquartered in Dallas, is a high- technology company with sales or manufacturing operations in more than 30 countries. TI develops, manufactures and markets semiconductors, defense electronics systems, software productivity tools, computer systems and peripheral products, custom engineering and manufacturing services, electrical controls, metallurgical materials, and consumer electronic products.
 -0- 3/30/92
 /CONTACT: Sheree G. Fitzpatrick, 214-995-2984, or Terri West, 214-995-3481, both of Texas Instruments/
 (TXN) CO: Texas Instruments Incorporated ST: Texas IN: CPR SU:


GK -- NY072 -- 2943 03/30/92 13:53 EST
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