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TI's New Customizable UMTS Infrastructure Chipset Slashes OEM ASIC Development Costs While Cutting Per-Channel Costs By 50 Percent; Cost Savings Delivered to 3G Base Station Manufacturers Without Sacrificing The Ability to Customize and Differentiate.

In a move that fundamentally changes 3G channel card design, Texas Instruments Incorporated (TI) today introduced a programmable chipset that enables cellular infrastructure manufacturers to create low-cost, differentiated channel cards for 3G base stations without the burden associated with developing their own custom application specific integrated circuits (ASIC). The new chipset features a digital signal processor (DSP) tailored for wireless infrastructure and tightly coupled transmit and receive chip-rate application specific standard products (ASSP). This efficient and customizable combination will speed manufacturers to market with per-channel cost reductions of up to 50 percent. (see www.ti.com/tci1xnr_wi )

Please Note: Texas Instruments is expanding its popular wireless technology portfolio today. This news release is one of three complementary wireless announcements issued this morning. Please visit http://www.ti.com/wirelesspr to view the additional two news releases.

For manufacturers, the new programmable UMTS digital baseband chipset offers a single platform that maintains the same flexibility as the popular DSP-plus-custom-ASIC solution but at a substantially lower cost. The cost savings come in two forms: first, manufacturers don't incur the development expense of creating their own custom ASIC -- typically millions of dollars; and, second, they get a substantial savings on bill of materials (BOM) cost because the TI solution actually doubles channel density to 64 channels.

Of equal importance to cellular infrastructure manufacturers is the fact that the cost savings are delivered without sacrificing the ability to customize and differentiate their solution. In TI's chipset, the receive and transmit chip-rate ASSPs consist of flexible hardware configured via registers and commands under DSP software control, making differentiation not only possible, but simple.

"The new UMTS chipset from TI gives 3G wireless infrastructure OEMs what they want: improved cost and flexibility through the combined attributes of a DSP and a customizable ASIC," said Dr. Jim Gunn, wireless infrastructure analyst for Forward Concepts. "TI's innovative solution will help base station manufacturers drive down the cost of their equipment while giving them the flexibility to incorporate their algorithms and system intellectual property (IP)."

Chipset Features High-Performance DSP and Tightly Coupled ASSPs

The chipset includes the TMS320TCI100 DSP, the TMS320TCI110 receive chip rate coprocessor and the TMS320TCI120 transmit chip rate coprocessor. Together, they deliver all the benefits of a customizable ASIC and a DSP without the cost and time to market disadvantages associated with custom ASIC developments.

The TCI100 DSP is pin and code compatible with the popular TMS3206416 DSP. Like the 6416 DSP, the TCI100 DSP features two high-bandwidth parallel interfaces and Viterbi and Turbo embedded coprocessors.

The TCI110 is a customizable receive chip rate ASSP. With it, designers have a single device for finger de-spreading and random access channel (RACH) preamble detection and searching for 64 users. This is a 2x improvement over solutions available today, which support an average of 32 users. The TCI110 communicates with the TCI100 DSP via a 64-bit memory interface bus that operates at a clock rate of 122.88 MHz, giving the interface itself a bandwidth of 7.8 Gbps.

The TCI120 ASSP is highly flexible and supports a configurable number of sectors and users per sector. It features multiple spreading, scrambling and channel gain blocks, allowing any dedicated channel to be dynamically allocated across any sector. The TCI120 includes a multi channel buffered serial port (McBSP) interface for low-latency transfer of closed-loop data such as power control, closed-loop transmit diversity and acquisition indicator channel (AICH) information. TCI120 supports the newly standardized high-speed downlink packet access UMTS channel, known as HSDPA, with appropriate modulation and slot format options.

The new chipset also is designed to work with TI's recently announced GC5016 digital up/downconverter, the industry's first integrated four-channel wideband digital downconverter and upconverter that is ideal for radios in 3G wireless base transceiver systems.

Software and Development Tools Make The Chipset Easy To Use

The 3G product offering is augmented by development tools, foundation software and modular UMTS chip rate and symbol rate application libraries all geared to make the chipset easier to use and speed time to market. The tools include an evaluation module (EVM), which enables customers to begin early code development, and Code Composer Studio plug-in emulator probes that provide real-time diagnostic visibility into both the TCI110 and TCI120.

TI is committed to the cellular infrastructure market and offers manufacturers a broad product portfolio that includes tailored DSPs, ASSPs, high-performance analog solutions and power management devices.

Chipset Availability

The TCI100 DSP, the TCI110 and the TCI120 are scheduled to be available through TI in the third quarter of 2003. Download a white paper and UMTS chipset product bulletin today at http://www.ti.com/tci1xwp_wi .

Limited preliminary samples of the GC5016 wideband digital downconverter and upconverter are available today from TI. Production devices will be widely available in the third quarter of 2003. Download the GC5016 data sheet today at (http://www.ti.com/GC5016ds_wi ).

Safe Harbor Statement

Statements contained in this press release regarding product performance and other statements of management's beliefs, goals and expectations may be considered "forward-looking statements" as that term is defined in the Private Securities Litigation Reform Act of 1995, and are subject to risks and uncertainties that could cause actual results to differ materially from those expressed or implied by these statements. The following factors and the factors discussed in TI's most recent Form 10-K could cause actual results to differ materially from the statements contained in this press release: delays in implementation of the technology. We disclaim any intention or obligation to update any forward-looking statements as a result of developments occurring after the date of this press release.

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.

Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at http://www.ti.com/ .

TRADEMARKS

All trademarks and registered trademarks are the property of their respective owners.

CONTACT: Becky Nevers of Texas Instruments Incorporated, +1-281-274-2639, or bnevers@ti.com ; or Krista Schuelke, +1-713-513-9565, or kschuelke@golinharris.com , for Texas Instruments Incorporated. Please do not publish these numbers or email addresses.

Web site: http://www.ti.com/tci1xnr_wi http://www.ti.com/wirelesspr http://www.ti.com/tci1xwp_wi http://www.ti.com/GC5016ds_wi http://www.ti.com/
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Date:Feb 3, 2003
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