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1-76 out of 76 article(s)
Title Author Type Date Words
Properties and Microstructures of Sn-Bi-X Lead-Free Solders. Yang, Fan; Zhang, Liang; Liu, Zhi-quan; Zhong, Su-juan; Ma, Jia; Bao, Li Report Jan 1, 2017 13270
Lead-free solder bump plating. Brief article Nov 1, 2015 163
Research of wettability of in solder on Al2O3 ceramic during laser beam heating. Kostolny, Igor; Kolenak, Roman; Barta, Jozef Report Jan 1, 2015 1446
Physical and mechanical properties enhancement of lead free solders reinforced with carbon nanotubes: a critical review. Dele-Afolabi, T.T.; Hanim, M.A. Azmah; Norkhairunnisa, M.; Yusoff, H.M. Report Jun 5, 2014 4457
Synthesis and characterization trihydroxyl polybenzoxazine precursor for post-polymer modifications. Nordin, Razif; Nazir, M.B. Mohd; Thirmizir, M.Z. Ahmad; Jani, A.M. Md. Report Jun 5, 2014 1503
Effects of solder temperature on pin through-hole during wave soldering: thermal-fluid structure interaction analysis. Aziz, M.S. Abdul; Abdullah, M.Z.; Khor, C.Y. Report Jan 1, 2014 5223
Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-I censored data. Mi, Jinhua; Li, Yan-Feng; Yang, Yuan-Jian; Peng, Weiwen; Huang, Hong-Zhong Report Jan 1, 2014 6779
Study on mitigation method of solder corrosion for crystalline silicon photovoltaic modules. Kim, Ju-Hee; Park, Jongsung; Kim, Donghwan; Park, Nochang Report Jan 1, 2014 3427
Finite element modeling of mechanical stresses to IC bond pads. Hunter, Stevan; Warnick, Rob; Gohnert, Ryan; Dutson, Alan Author abstract Jun 1, 2013 192
Solderabilty of high-purity aluminium with the lead-free solders. Hlavaty, Ivo Report Jan 1, 2011 1351
Interaction of BiAg11 solder with Cu, Ag and Ni substrates. Chachula, Michal; Kolenak, Roman; Kolenakova, Monika Report Jan 1, 2011 1363
Formation of IMC the interface of SnAgCu1, 0Bi solder with CU substrate. Kovarikova, Ingrid; Simekova, Beata; Hodulova, Erika; Ulrich, Koloman Report Jan 1, 2011 1216
Study the growth of intermetallic phases in Sn 3.5Ag XCU (X = 0.3, 0.7, 1.0)/Cu solder joints. Szewczykova, Beata; Lechovic, Emil; Hodulova, Erika; Ulrich, Koloman Report Jan 1, 2010 1334
Effect of isothermal aging on the interfacial reactions between Sn1.5AG0.7Cu9.5In solder and Cu substrate. Lechovic, Emil; Szewczykova, Beata; Hodulova, Erika; Ulrich, Koloman Report Jan 1, 2010 1252
Newspapers Look At Fifth Year Iraq War Anniversary Coverage. Vaughan, Emily Mar 18, 2008 364
Top secret: an American girl reflects on her father's military service. Bing, Keelie Oct 16, 2006 173
Spin it. Absher, Frank Brief Article Feb 1, 2005 135
Soldering at O-level: led down the wrong path. Thompson, Todd Brief Article Jun 22, 2004 307
Alloy verdict: 'no difference'. Brief Article Oct 1, 2003 242
The status of lead-free standards: lead-free standards are difficult to develop without a consensus. Crawford, Jack Oct 1, 2003 1091
Selective soldering--the future is now: optimize your through-hole soldering process down to the pin level. Klenke, Bob Apr 1, 2003 984
Selecting solder mask material: how to avoid falling in the cracks. Huemoeller, Ron Apr 1, 2003 2199
You can't hang 'em out to dry; the rinse and dry steps are critical to the aqueous cleaning process. Hymes, Les Mar 1, 2003 652
Reflow atmospheres in the lead-free era: a recent study examined the effects of several process variables on tin/silver and tin/silver/copper solder pastes. Mackie, Andy C. Mar 1, 2003 2185
NPL launches reports on CD. Hamburg, Lisa Brief Article Jan 1, 2003 103
Activate your solderability testing program: a summary of the decision to use ROL1 flux for solderability testing standards. Crawford, Jack Jan 1, 2003 1161
Concerned about stencil life? Use care--don't abrade, bend, staple, twist, mishandle or overheat the stencil! Hymes, Les Jan 1, 2003 667
Spray fluxing--it's not the same old game: spray fluxing has advanced to become a versatile technique, capable of performing a variety of tasks. Berger, Harvey L. Jan 1, 2003 2569
Wave and Reflow Soldering Workshop. Brief Article Oct 1, 2002 158
Valor set to deploy software. Brief Article Oct 1, 2002 112
MLF assembly challenges: high-yield MLF assembly is possible with proper process controls. Westby, George Oct 1, 2002 722
Ensuring reproducibility in selective soldering: quality tools like FMEA and machine capability analysis are needed for effective process control of selective soldering. Schouten, Gert Oct 1, 2002 2750
All solder pastes are not created equal: several in-house tests will reveal if you are using the right solder paste for your application. Zarrow, Phil Sep 1, 2002 1819
Making selective soldering work for you: dip or drag? Which process to choose depends entirely on your product. Diepstraten, Gerjan Sep 1, 2002 2372
Hand soldering in the 21st century: state-of-the-art hand soldering systems offer improved temperature control, increased process speeds and repeatable process control. Huerta, Leo Sep 1, 2002 2212
Surface-Mount Solder attachments: due to questionable test regimens and extravagant claims, IPC developed a standard to ensure proper solder joint reliability tests. Engelmaier, Werner Jul 1, 2002 1312
Lead-free wave soldering: with the adoption of lead-free alloys in the electronics industry, soldering is the most critical assembly process! Westby, George Apr 1, 2002 690
Selective fluxing comes of age: a new fluxing technology offers advantages over conventional foam, spray and ultrasonic nozzle fluxers in wave soldering. Cote, Christopher Apr 1, 2002 1407
AIM expands in Australia. Shedd, John Brief Article Mar 1, 2002 120
Beware of "dry joints" and bad glue: solderability is key when avoiding "dry joints.". Hymes, Les Mar 1, 2002 552
Selective soldering: wave soldering redefined: the emergence of surface-mount technology forced engineers to rethink the wave soldering process. Zarrow, Phil Feb 1, 2002 993
Even small things count! Readers with questions concerning 0201 components and ceramic capacitors are given some helpful advice. Hymes, Les Feb 1, 2002 567
Remember Baby Bear! Just like Baby Bear's porridge from the classic tale, water used in the cleaning process should be neither too hot nor too cold. Hymes, Les Jan 1, 2002 660
Improving the reflow process with SPC: a successful SPC program can identify potential problems in the reflow process, thereby reducing rework costs. Worsley, Charles Jan 1, 2002 2340
Solutions in solder paste: new stencil developments make the BGA rework process more reliable. Ferry, Jeff Jan 1, 2002 694
Using Solder Fountains -- A complicated, time-consuming procedure is transformed into a quick and easy fix. Ferry, Jeff Brief Article Nov 1, 2001 698
Lead-Free Becoming a Reality. Brief Article Oct 1, 2001 220
AIM Opens China Office. Shedd, John Brief Article Oct 1, 2001 114
Be Gentle and Persistent in All Things -- Attention to details can often combat common problems in the assembly process and in equipment selection. Hymes, Les Brief Article Oct 1, 2001 727
High temperature lead-free solders. (News Briefs). Brief Article Sep 1, 2001 360
5 Steps to Successful Lead-Free Soldering: Step 5. Diepstraten, Gerjan Brief Article Aug 1, 2001 2345
NIST COLLABORATES WITH NEMI ON STANDARDS PROJECT FOR LEAD-FREE SOLDERS. Brief Article Jul 1, 2001 244
Five Steps to Successful Lead-Free Soldering: Step 4. Diepstraten, Gerjan Jul 1, 2001 2621
Laser Soldering Applications for RF Shield Rework -- By using one-piece RF shields and lasers for rework, throughput can be increased while significantly reducing the number of rework technicians. Watson, Neil Jun 1, 2001 2008
5 Steps to Successful Lead-Free Soldering: Step 3. Diepstraten, Gerjan Jun 1, 2001 2354
The True Cost of Lead Free -- Get the facts on lead free straight-less isn't always more. Zarrow, Phil Brief Article Jun 1, 2001 757
Q & A and Sanity Checks -- Welcome to the first installment of "Ask Les," where your technical and training questions are answered. Hymes, Les Brief Article Jun 1, 2001 739
Implementing Selective Soldering -- Selective soldering significantly improves the conversion cost and quality of through-hole interconnections in complex PCB assemblies. Klenke, Bob May 1, 2001 1444
Temperature Selection for Wave Soldering with Lead-Free Alloys -- Wetting balance testing established the best wave soldering temperatures for several lead-free alloys with a typical low-solids, no-clean flux. Schneider, Al May 1, 2001 1163
Five Steps To Successful lead-Free Soldering: Step 2. Diepstraten, Gerjan May 1, 2001 1873
Paste Measurement System. Brief Article May 1, 2001 84
On The Road To Lead Free -- Several studies report benefits of using lead-free solders, but certain technical issues must be considered before lead free can be implemented in electronics assembly. Dunford, Steven O. Apr 1, 2001 3491
Implementing Lead Free. Barbini, Denis Apr 1, 2001 2992
The Saga of the Heavy-Handed No-Clean Flux -- An investigation into the interactions of water-based flux andalternative board finishes. Kane, Pat Brief Article Apr 1, 2001 719
Soldering System. Evaluation Apr 1, 2001 102
ELECTRODEPOSITED Pb-FREE SOLDER AND WHISKER PREVENTION. Mar 1, 2001 408
Stencil Technology and Design Guidelines for Print Performance. Coleman, William E. Mar 1, 2001 2538
NIST HELPS MANUFACTURERS PREPARE FOR CONVERSION TO LEAD-FREE SOLDER. Brief Article Nov 1, 2000 277
DATABASE ON LEAD-FREE SOLDERS. Brief Article Nov 1, 2000 212
Process Gets The Lead Out Of Solder Materials. Jul 1, 1999 336
Tips for better soldering. Wentz, Mac Jul 1, 1998 798
Vacuum process cuts BGA rework. Studt, Tim May 1, 1997 1284
Soldering wires. Prestly, Don Dec 1, 1996 917
Soldering copper pipe: perfect leak-free plumbing joints - every time! Prestly, Don May 1, 1994 1309
Soldering without lead. Brief Article Jul 17, 1993 365
Sweating copper pipe. Pamphlet Dec 1, 1990 515

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