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Solder city.

The 03.1 Reballing/Prebumping Station is a solution for contractors and OEMs seeking faster turnaround and a less costly alternative than reliance on third parties to BGA and CSP reballing and solder paste prebumping of QFN devices, according to the manufacturer. The 03.1 system includes Rapid IR Heating Technology for lead-free processing temperatures while preventing damage to components and boards. It is also useful in converting BGAs, CSPs, and QFNs from leaded to lead-free devices, or vice versa. The standard system includes tools and accessories for processing most common packages. Manncorp

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Title Annotation:New Products
Publication:Modern Applications News
Date:May 1, 2009
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