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Solder Reliability.

"Experimental and Numerical Investigations of the Vibration Reliability of BGA and LGA Solder Configurations and SAC 105 and 63Sn37Pb Solder Alloys"

Authors: Mohammad Gharaibeh, Aaron J. Stewart, Quang T. Su and James M. Pitarresi; jmp@binghamton.edu.

Abstract: This paper aims to investigate and compare the reliability performance of land grid array (LGA) and ball grid array (BGA) solders, as well as the SAC 105 and 63Sn37Pb solder alloys, in vibration loading conditions. Reliability tests were conducted using a sine dwell with resonance tracking vibration experiment. Finite element simulations were performed to help in understanding the observed failure trends. Reliability results showed the SnPb solders outperform Pb-free solders in vibrations loading. Additionally, the LGA solder type could provide a better vibration reliability performance than BGA solders. Failure analysis results showed that in LGAs the crack is initiated at the printed circuit board side and at the component side in BGAs. In both types, the crack is propagated throughout in the intermetallic compound layer. (Soldering and Surface Mount Technology, vol. 31, no. 2)

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Title Annotation:In Case You Missed It
Publication:Printed Circuit Design & Fab Circuits Assembly
Date:Jun 1, 2019
Words:172
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