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Sensor underfill encapsulant.

Hysol FP5110 nonconductive paste underfill encapsulant is formulated for flip-chip image sensor modules and adheres to 2- and 3-layer flexible circuits (polyimide or epoxy adhesive). An alternative to mechanical soldering, bonds bumps to substrates through a Pb-free-compatible thermal compression process, eliminating flux application, reflow and cleaning. Is an automated substitute for manual anisotropic conductive film processes. Enables automated deposition and is compatible with thermal compression and ultrasonic bonding processes. Reportedly cures at 180[degrees]C in 10 sec., and stores at -15[degrees]C.

Henkel Corp.,

Booth 2001
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Title Annotation:Product PREVIEW
Publication:Circuits Assembly
Date:Feb 1, 2007
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