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Samsung Package-on-Package Device Provides Complete Processor and Memory System for New Wireless HP iPAQ Pocket PC.

SAN JOSE, Calif. -- Samsung Semiconductor, Inc., a leader in advanced semiconductor technology, today announced that their SC32442 MSP package-on-package (PoP) device is integrated into the new HP iPAQ rx1950 handheld. By enabling a high-performance, low-power processor to be combined with all required system memory in a small footprint package, Samsung's PoP is helping to transform mobile handheld devices into feature-rich, sleek, and cost-competitive mobile information and entertainment platforms.

"The race to own the value-added features in next-generation mobile devices is driving the development of innovative stacked packaging solutions," said Dr. Stephen Oh, vice president of Mobile Platform Development, Samsung Electronics' System LSI Division. "Our customers will benefit from our expertise in this area because no other semiconductor manufacturer has cutting-edge technology for all the core components -- logic, DRAM and Flash -- in-house to build these types of compact system solutions for mobile handset and handheld applications."

Leveraging its expertise in deep sub-micron design and packaging technology, Samsung has stacked together a highly integrated 300MHz ARM9-based mobile application processor with a memory multi-chip package (MCP), which contains high-density NAND Flash and low-power mobile SDRAM. With dimensions of 14x14mm(2), Samsung's PoP device offers tremendous flexibility with regards to space on the printed circuit board (PCB). In addition, the combination of low-power processor with low-power memory allows flexibility in the size of the battery needed to power the device.

Achieves Low Power Leakage

Samsung's Power Gating technology creates breakthroughs in lowering leakage current for a high-performance processor, while also enabling the fast wake-up time critical to devices that need to be "always on".

In the past, the design trade off for selecting a processor was either higher MHz with high leakage current or slower performance and low leakage. Through its Power Gating technology and process expertise, Samsung has been able to provide a processor that achieves the best of both worlds with 300MHz and 400MHz performance at low power while also reducing leakage current in idle mode by up to 90 percent. This provides another key benefit for designers, which is achieving smaller form factors due to smaller battery size requirements.

"HP values Samsung's strong expertise in logic and memory technology," said Rick Roesler, vice president, Handheld Division, HP. "With each new generation of HP iPAQ handhelds, we're offering consumers a sleek, wireless device with outstanding graphics and multimedia performance at an exceptional price."

The SC32442 MSP

With an uncommon blend of technologies, the SC32442 MSP solution can also lower the total number of PCB layers by two or more. Routing of address and data lines between the processor and memory components are internal to the package, which dramatically reduces the routing requirements of the PCB. The use of NAND Flash supports those smart phone and handheld designers who are looking for a high-density, non-volatile storage solution for the OS image and MP3, imaging, and video files.

The SC32442 MSP comes in four different configurations. Now, the first available volume production combines Samsung's S3C2442 mobile application processor with a memory MCP consisting of 32MB of mobile SDRAM and 64MB of NAND Flash. The following three versions will have the same mobile application processor stacked with 32MB SDRAM and 128MB NAND, 64MB SDRAM and 128MB NAND, and 64MB SDRAM and 256MB NAND, respectively.

In addition to supporting major 3rd party open software platforms, Samsung's new SC32442 MSP has a number of other features that make it an appealing solution for design engineers. The SC32442 MSP can significantly reduce electromagnetic interference (EMI) within smart phones and has a highly integrated ARM9 application processor. The application processor section in the PoP device includes the following features: separate 16KB instruction and 16KB data cache; a TFT and STN LCD controller; NAND Flash boot loader; USB Host and Device; a touch screen and camera interface; several UARTs; a SD host and MMC interface; IIC and IIS interfaces; and, PLL for clock generation.

About Samsung Electronics

Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2004 parent company sales of US$55.2 billion and net income of US$10.3 billion. Employing approximately 113,000 people in over 90 offices in 48 countries, the company consists of five main business units: Digital Appliance Business, Digital Media Business, LCD Business, Semiconductor Business and Telecommunication Network Business. Recognized as one of the fastest growing brands, Samsung Electronics is the world's largest producer of color monitors, color TVs, memory chips and TFT-LCDs. For more information, please visit
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Publication:Business Wire
Geographic Code:1USA
Date:Sep 26, 2005
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