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STATEMENT OF EIAJ/UCOM'S FUTURE ACTIVITIES UNDER THE U.S.-JAPAN SEMICONDUCTOR ARRANGEMENT

 TOKYO, March 23 /PRNewswire/ -- The leaders of the Japanese and U.S. semiconductor industry associations, Nobuo Kanoi, chairman of the Users' Committee of Foreign Semiconductors of the Electronic Industries Association of Japan (EIAJ/UCOM), and James Norling, chairman of the U.S. Semiconductor Industry Association (SIA), met on March 21 at the Royal Waikoloan Hotel in Hawaii. The chairmen took the opportunity of attending the Joint Working Group meeting on semiconductors, which is attended by representatives of the U.S. and Japanese governments and respective semiconductor industries, to exchange their opinions concerning the activities to be developed jointly by the Japanese and U.S. industries in 1993.
 At this meeting, the leaders of the Japanese and U.S. semiconductor industries valued highly the substantial increase in the 4th quarter 1992 foreign semiconductor market share in the Japanese market. This increase was made possible by a number of factors, including the efforts of both Japanese and U.S. industries based upon the EIAJ-SIA agreement reached in June 1992. In particular, the U.S. industry expressed its strong appreciation for the activities and efforts made to date by the Japanese users. The chairmen also confirmed that the Japanese users and U.S. suppliers will continue, in 1993 and beyond, to cooperate and take constructive measures for further enhancement of foreign semiconductor market access opportunities in Japan. To this end, they recognized the need for both the Japanese and U.S. industries to implement the following four items:
 1. The study of practical approaches to further promote design-
 in;
 2. Analysis and review of how U.S. products fit Japanese market
 needs, broken down by category of semiconductors;
 3. Joint work on developing new markets and new applications,
 such as in multimedia and advanced telecommunications areas;
 and
 4. Examination of areas of potential cooperation in the
 semiconductor industry, such as environmental issues
 (disposal and recycling of industrial wastes) and
 standardization.
 At the meeting, the SIA leaders expressed their hope that it be considered important to set a quantifiable target. In response, the EIAJ leaders stressed that the target-setting approach is not appropriate because market share cannot be fixed by negotiation in a free-market economy, rather that market share is a result of free competition among companies. EIAJ emphasized that it is important to develop close business relationships between users and suppliers and to build long-term relationships based upon mutual trust in order to improve market access. EIAJ/UCOM will support the activities of foreign-based semiconductor suppliers by making continuous efforts at increasing market access opportunities. But it also stressed that results mainly depend on the efforts of suppliers. Accordingly, EIAJ/UCOM requested SIA to encourage its members to fully meet market needs through such efforts as reliable supply of products which suit Japanese users' needs, further enhancement of design centers, and development of surface-mounted devices (SMDs).
 In addition to the chairmen of EIAJ/UCOM and SIA, the following persons attended the meeting:
 From EIAJ/UCOM:
 -- Hidehiko Yoshida, vice chairman of UCOM and senior executive
 vice president of Toshiba Corporation;
 -- Hajime Sasaki, chairman of the Electronic Devices Executive
 Committee of EIAJ and senior vice president of NEC
 Corporation; and
 -- Stanton D. Anderson, counsel to EIAJ/UCOM.
 From SIA:
 -- Dr. Gilbert F. Amello, vice chairman of SIA and president and
 CEO of National Semiconductor Corporation;
 -- Pat Weber, executive vice president of Texas Instruments; and
 -- Alan W. Wolff, counsel to SIA.
 -0- 3/23/93
 /CONTACT: Tamotsu Harada of the Electronic Industries Association of Japan, 03-3213-5861/


CO: Users' Committee of Foreign Semiconductors of the Electronic
 Industries Association of Japan; U.S. Semiconductor Industry
 Association ST: IN: CPR SU:


KD-MH -- DC027 -- 8743 03/23/93 14:41 EST
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Date:Mar 23, 1993
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