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Reportlinker Adds Design Analysis Nokia Siemens Networks Flexi W-CDMA 2100MHz RF Module Model 082849A.103 FSMB Core.

NEW YORK, Feb. 16 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

Design Analysis Nokia Siemens Networks Flexi W-CDMA 2100MHz RF Module Model 082849A.103 FSMB Core

http://www.reportlinker.com/p0177164/Design-Analysis-Nokia-Siemens-Networks-Flexi-W-CDMA-2100MHz-RF-Module-Model-082849A103-FSMB-Core.html

This report covers the design analysis of an Nokia Siemens Networks Flexi W-CDMA 2100MHz RF Module Model 082849A.103 FSMB Core. This unit is an integral part of a Flexi W-CDMA base transmitting station (BTS). The unit was manufactured in mid 2007.

The following semiconductor & passive component suppliers are included in this report: Altera, AMCC, Analog Devices, Cortina Systems, Cypress Semiconductor, Emerson/Artesyn Technologies, Fairchild Semiconductor, IDT, International Rectifier, Lattice Semiconductor, Linear Technology, Marvell, Maxim Integrated Products, Micron, National Semiconductor, NEC, NXP Semiconductor, Samsung Electric, Spansion STMicroelectronics, Texas Instruments, Vishay Semiconductors, Xilinx, Zarlink Semiconductor

Features

Complete Part Number/Marking

Component Manufacturer Identification

Function Component Description

Package Type

Total Pages: 72

Total Tables: 14

Total Exhibits: 63

Important Note: There is NO component pricing contained within the report.

TABLE OF CONTENTS

EXECUTIVE SUMMARY ...........6

Active/Passive Component Summary .... 6

Important Note: .. 6

CHAPTER 1: FLEXI W-CDMA NODEB SYSTEM ............7

1.1 Overview of Nokia Siemens Networks Flexi NodeB Platform 7

CHAPTER 2: MECHANICAL ANALYSIS ....... 11

2.1 Exterior Mechanical Analysis ..........11

CHAPTER 3: DIGITAL BASEBAND SUBSYSTEM (RRU) .. 30

3.1 RRU Sector BBU System 31

3.2 Area A: FPGA/Microprocessor Section ............32

3.3 Area B: DSPs/ASICs for Chip Rate/Symbol Rate Processing Section .34

3.4 Area C: SRAM Memory Section ......36

3.5 Area D: FPGA/Microprocessor Support Section 38

3.6 1/8 Brick 75W DC-DC Converter Module ........41

3.7 22W DC-DC Converter Module .......41

3.8 55W DC-DC Converter Module .......42

CHAPTER 4: DIGITAL BASEBAND SUBSYSTEM (MAIN NODEB) ....... 43

4.1 NodeB BBU System .......44

4.2 Area E: Ethernet Transport Section 45

4.3 Area F: RRU Interface Section .......47

4.4 Area G: FPGA/ASIC/Microprocessor Support Section .......50

4.5 Area H: Ethernet Transport Support Section ...52

CHAPTER 5: POWER ENTRY MODULE ....... 54

CHAPTER 6: COOLING FAN UNIT ........... 63

APPENDIX A - PASSIVE CASE SIZE ANALYSIS ............ 65

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS ....... 68

TABLES

Table 1: Area A Bill of Materials ........... 33

Table 2: Area B Bill of Materials ........... 35

Table 3: Area C Bill of Materials ........... 37

Table 4: Area D Bill of Materials ........... 40

Table 5: Area E Bill of Materials ........... 46

Table 6: Area F Bill of Materials ........... 48

Table 7: Area F Bill of Materials (con't) . 49

Table 8: Area G Bill of Materials ........... 51

Table 9: Area H Bill of Materials ........... 53

Table 10: Flexi NodeB Power Entry Module Top Section Bill of Materials . 59

Table 11: Flexi NodeB Power Entry Module Bottom Section Bill of Materials ........... 61

Table 12: Passive Component Case Size Distribution by System Subsection .......... 66

Table 13: Active/Passive Component Distribution by System Subsection 67

Table 14: Active Semiconductor Vendor Distribution by System Subsection ........... 69

EXHIBITS

Exhibit 1: Generic First Generation W-CDMA Base Station Diagram .........7

Exhibit 2: Mounted Flexi Base Station w/Single RF Module Example ........8

Exhibit 3: Flexi 3 Sector W-CDMA Base Station Site Example ..9

Exhibit 4: Flexi System Level Basic Block Diagram 10

Exhibit 5: Flexi Digital BBU Module with Side Plates Attached 11

Exhibit 6: Flexi Digital BBU Module with Front Cover and Side Plates Removed ...... 12

Exhibit 7: Flexi Digital BBU Module Front Cover with and w/o Side Plates, Top View . 13

Exhibit 8: Flexi Digital BBU Module Front Cover, Internal View . 13

Exhibit 9: Flexi Digital BBU Module Front Cover with Side Plates, Side View ........... 13

Exhibit 10: Flexi Digital BBU Module Side Plate Cover, External and Internal Views 15

Exhibit 11: Flexi Digital BBU Module Side Plate Cover Disassembled, Internal View 15

Exhibit 12: Flexi Digital BBU Module Rear Cover, External and Internal Views ........ 16

Exhibit 13: Flexi Digital BBU Module Metal Case, Top View .... 17

Exhibit 14: Flexi Digital BBU Module Metal Case, Bottom View . 17

Exhibit 15: Flexi Digital BBU Module Metal Case, Front/Back Views ........ 17

Exhibit 16: Flexi Digital BBU Module Metal Case, Side Views .. 18

Exhibit 17: Flexi Digital BBU Module with Case Partially Removed ......... 19

Exhibit 18: Flexi Digital BBU Module with Case Fully Removed . 19

Exhibit 19: Flexi Digital BBU Module System Frame, Top External View .. 20

Exhibit 20: Flexi Digital BBU Module System Frame, Bottom External View ............ 21

Exhibit 21: Flexi Digital BBU Module System, Exploded Side View ......... 22

Exhibit 22: Flexi Digital BBU Module System Frame, Top Internal View with Sector C & Main NodeB PCBs22

Exhibit 23: Flexi Digital BBU Module System Frame, Top Internal View with Sector C & Main NodeB PCBs

Removed ........... 23

Exhibit 24: Flexi Digital BBU Module System Frame, Internal Shield (Top View) ..... 25

Exhibit 25: Flexi Digital BBU Module System Frame, Internal Shield (Bottom View Attached) .. 26

Exhibit 26: Flexi Digital BBU Module System Frame, Internal Shield (Bottom View) 27

Exhibit 27: Flexi Digital BBU Module System Frame, Bottom Internal View with Sector A & B PCBs......... 28

Exhibit 28: Flexi Digital BBU Module System Frame, Bottom Internal View with Sector A & B PCB Removed

29

Exhibit 29: RRU Sector BBU System PCB Top (Area A/B Diagram) ......... 30

Exhibit 30: RRU Sector BBU System PCB Bottom (Area C/D Diagram) ... 30

Exhibit 31: RRU Sector BBU System Block Diagram . 31

Exhibit 32: Area A Component Diagram 32

Exhibit 33: Area B Component Diagram 34

Exhibit 34: Area C Component Diagram 36

Exhibit 35: Area C Test Connector Component Locations ....... 36

Exhibit 36: Area D Component Diagram 38

Exhibit 37: Area D Test Connector Component Locations ...... 39

Exhibit 38: LES15A48-5V0RANJ ........... 41

Exhibit 39: PTH05050 .......... 41

Exhibit 40: PTH 08T240 ....... 42

Exhibit 41: Main NodeB BBU Subsystem PCB Top (Area E/F Diagram) ... 43

Exhibit 42: Main NodeB BBU Subsystem PCB Bottom (Area G/H Diagram) ............ 43

Exhibit 43: NodeB BBU System Block Diagram ..... 44

Exhibit 44: Area E Component Diagram 45

Exhibit 45: Area F Component Diagram 47

Exhibit 46: Area G Component Diagram 50

Exhibit 47: Area H Component Diagram 52

Exhibit 48: Flexi Digital Module with Power Distribution Subsystem Location ......... 55

Exhibit 49: Flexi NodeB Power Entry Module (Top/Bottom Views) .......... 56

Exhibit 50: Flexi NodeB Power Entry Module Component Diagram (Internal View) .. 56

Exhibit 51: Flexi NodeB Power Entry Module Component Diagram (Internal View, Top) .......... 57

Exhibit 52: Flexi NodeB Power Entry Module Component Diagram (Internal View, Top Disassembled)..... 58

Exhibit 53: Flexi NodeB Power Entry Module Component Diagram (Internal View, Bottom) ..... 60

Exhibit 54: RRU DC Power Cable .......... 62

Exhibit 55: Flexi Digital Module Fan Unit Location Diagram .... 63

Exhibit 56: Flexi Digital Module Fan Unit Assembly, External View ......... 64

Exhibit 57: Flexi Digital Module Fan Unit Assembly, Internal View ......... 64

Exhibit 58: Passive Component Case Size Distribution .......... 65

Exhibit 59: Identified Passive Component Market Share by Vendor ....... 67

Exhibit 60: Active Semiconductor Component Share 68

Exhibit 61: Active Semiconductor Market Share by Vendor .... 70

Exhibit 62: IC (>8 pin) vs. Discrete Active Semiconductor Share .......... 70

Exhibit 63: High Pin Count (64+) Active Semiconductor Market Share by Vendor ... 71

To order this report:

Electronic Component and Semiconductor Industry: Design Analysis Nokia Siemens Networks Flexi W-CDMA 2100MHz RF Module Model 082849A.103 FSMB Core

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