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Protective Coating.

ENTEK(r) PLUS Gold copper protective coating is used as an alternative to hot air solder leveling (HASL) and other PWB surface finishes and is specifically formulated for mixed metal surfaces. The aqueous coating provides improved solderability and withstands exposure to multiple heat cycles during surface-mount and mixed technology assembly. The coating is specifically engineered to selectively deposit on copper while ensuring that the secondary metal surface remains contaminate-free.

Enthone, Inc., West Haven, CT

Hall B3, Booth 265 Circle 122

http://www.circuitsassembly.com/

Copyright [copyright] 2001 CMP Media LLC
COPYRIGHT 2001 UP Media Group, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2001, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:Circuits Assembly
Date:Oct 1, 2001
Words:90
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