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Articles from Printed Circuit Design & Fab (September 1, 2014)

1-27 out of 27 article(s)
Title Author Type Words
Aiming for HF market, Wus takes stake in Schweizer. Buetow, Mike 272
Dieter Bergman, the face of IPC, passes away. Buetow, Mike 231
Driving continuous improvement with an 8D framework: root cause identification and corrective action brought higher yields for an automotive PCB. Upadhyaya, Rajesh 788
In drive for auto sector, Zuken opens wire harness center. Buetow, Mike 341
Journal of Electronic Materials: Review of Capabilities of the ENEPIG Surface Finish. Ratzker, Menahem; Pearl, Adam; Osterman, Michael; Pecht, Michael; Milad, George Reprint 116
Libra acquires Tetrad in deal between Ohioan EMS firms. Buetow, Mike 151
Libra industries finds its balance: changing markets and changing times have brought new management and new vision to the Tier III EMS. Buetow, Mike 1592
Magnification vs. resolution in visual examination specifications: when it comes to defining measurement, industry standards are lacking. Is a solution available? Hart, Louis; Simmons, Robert 2273
Management debacle offers food for thought: worker response to a CEO firing underscores the value of a great leader. Bigelow, Peter 940
Metals index. Drysdale, Chelsey 151
More in storage. Drysdale, Chelsey 160
Passing electrical signoff: the parameters of ESO, and how to efficiently ensure a design will pass. Dudzinski, Rod; Ishikawa, Minoru 1394
Peeling back graping: exhausted flux can cause incomplete reflow. Hunt, Chris 351
Q1 PCB design tool revenue up 1.6%. Drysdale, Chelsey Financial report 125
Setup, tooling and NRE, oh my! Know the differences in one-off startup services, and what each entails. Verbrugge, Mark; Finstad, Mark 767
SMTA International: A Closed-Form Norris-Landzberg Solder Reliability Model. Momani, Emad Al- Reprint 167
SMTA International: Microstructure and Reliability Studies of Mixed SnPb and Pb-free BGA Soldering. Kramer, Ken; Sharan, Alok; Nelson, Corey Reprint 104
SMTA International: QFN Design Considerations to Improve Cleaning --A Follow on Study. Bixenman, Mike; Lee, Dale; Vuono, Bill; Stach, Steve Reprint 248
Solder council paper simplifies Pb-free alloy comparison. Buetow, Mike 196
Study of various PCBA surface finishes: a total of nine groups of PCB surface finish were evaluated for solder spread and voiding performance with assembled BGAs and QFNs. Thein, Georgie; Geiger, David; Kurwa, Murad 1809
TBBPA questions revive halogen-free materials group. Buetow, Mike 199
Ten steps to 10GHz: properly compensating for high-frequency losses in the routed channels. Carrier, Patrick 1159
The basics of flux residue and removal: cleanliness won't guarantee reliability, but contamination does affect performance. Khan, Zulki 1322
The uniter passes away. Buetow, Mike 856
Tin whisker study conclusions: silver is a known whisker promoter but small amounts of bismuth mitigate the problem. Seelig, Karl; O'Neill, Tim 1311
Who replaces the 'old guys'? Boguski, Robert 1195
Will India become a global EMS provider? China's labor problems put India's EMS capability in a new light. Fama, Joseph 1263

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