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Plate cleaning equipment 200 mm.

Contract notice: Plate cleaning equipment 200 mm

CEA / LETI research equipment for the cleaning of silicon wafers in particular for decontamination of their rear face. The equipment must be able to process fully automatically batches of 25 plates 200 mm diameter by processing the plates one by one (single type of equipment WAFER). It must allow the treatment of the plates with several different types of chemistry (HNO3 / HCl / DI water, HF, HNO3 / HF, H202 / H2SO4 / DI water, etc.)It will be installed in clean rooms microelectronic CEA-LETI, where it will be used 7 days on 7 and 24 hours on 24. Delivery Date: Delivery imperative before 12/18/2015.

This contract is divided into lots: no

Deposits and Guarantees required: The CEA will require a holdback.

Time limit for receipt of tenders or requests to participate: 9.11.2015 - 16:00

Language(s) in which tenders or requests to participate may be drawn up: French.

Major organization : CEA/GRENOBLE

Address : 17 rue des Martyrs

38054 Grenoble Cedex 9

For the attention of: Madame Myriam Philippe

Country :France

Email : myriam.philippe@cea.fr

Url : www.cea.fr

Address : EA/Grenoble

17 rue des Martyrs

For the attention of: Service achats Mme Myriam Philippe, bat C4 piece 422/prescripteur technique Monsieur Pascal Besson

38054 Grenoble Cedex 9

FRANCE

Telephone: +33 438781938/4081

E-mail: myriam.philippe@cea.fr, pascal.besson@cea.fr

Fax: +33 438785063

Tender notice number : 356416-2015

Notice type : Tender Notice

Open date : 2015-11-09

Tender documents : T29803707.html

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Publication:Mena Report
Date:Oct 10, 2015
Words:261
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