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Plastics in Electronics Components: Technologies and Global Markets.

NEW YORK, May 24, 2012 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

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INTRODUCTION

In addition, key participants in the electronic components industry in terms of resin producers, and molders are identified along with inclusion of key technologies, and the competitive resin scenario.

REASONS FOR DOING THE STUDY

Resin consumption in electronic components had been growing at rates well above the Gross Domestic Product (GDP) for many years. Aside from the recent "economic recovery," there has been continued demand for electronic products, proliferation of new technologies, and "handling" of environmental pressures brought to bear on the industry has resulted in the need, in many instances, for higher performance plastics for many electronic components. Thus, it is appropriate for a new appraisal of this market at this time.

METHODOLOGY

A comprehensive review was undertaken of literature relating to resins used to produce electronic components, their applications, technology, markets and new developments. Included in the review were supplier trade literature, texts, and monographs. Unresolved issues were clarified by contact with those involved in the industry.

ABOUT THE AUTHOR

Research analyst Mel Schlechter has more than 40 years in the chemical industry, and specializes in plastics market research. He has been with BCC Research for more than 10 years and holds a B.S. in chemistry, an M.S. in organic chemistry, and an M.B.A. in marketing.

OBJECTIVES 1

SCOPE AND FORMAT 1

REASONS FOR DOING THE STUDY 1

METHODOLOGY. 1

ABOUT THE AUTHOR 2

RELATED BCC REPORTS 2

BCC ONLINE SERVICES 2

DISCLAIMER. 2

CHAPTER TWO: SUMMARY 3

SUMMARY TABLE GLOBAL ELECTRONIC COMPONENTS MARKET

BY TYPE OF RESIN, THROUGH 2017 (MILLION POUNDS) 3

SUMMARY FIGURE GLOBAL ELECTRONIC COMPONENTS MARKET

BY TYPE OF RESIN, 2011-2017 (MILLION POUNDS) 4

SUMMARY (CONTINUED) . 5

CHAPTER THREE: RESINS USED IN ELECTRONIC COMPONENTS 6

OVERVIEW. 6

TYPES OF RESINS 6

THERMOPLASTICS 7

STYRENICS. 7

High Impact Polystyrene (HIPS) 7

Background. 7

Properties 7

Applications. 7

Reinforced Polystyrene Products 8

Styrenic Polymer Producer Scenario 8

The New Domestic Styrenic Scenario. 9

Processing 9

Overview 9

TABLE 1 FABRICATION METHODS AND USES FOR POLYSTYRENE 10

Injection Molding 10

NYLONS. 10

Background 10

Properties 11

Major Types. 11

Nylon 66 11

Nylon 6 12

Similarities and Difference between Properties of

Nylon 6 and Nylon 66 12

TABLE 2 COMPARISON OF NYLON 6 AND NYLON 66 PROPERTIES. 12

Other Nylons 13

Overview 13

Nylon 46 13

Nylon 6/9 . 13

Nylon 6/10 and Nylon 6/12 . 13

Nylon 11 13

Nylon 12 14

Reinforced Nylons 14

Background. 14

Processing 14

Electric/Electronic Applications 15

TABLE 3 EXAMPLES OF NYLON RESINS USED TO MOLD

ELECTRONIC COMPONENTS. 15

Market Estimates and Forecasts 16

TABLE 4 GLOBAL NYLON MARKET FOR ELECTRONIC

COMPONENTS, THROUGH 2017 (MILLION POUNDS) 16

Recent Developments 17

New Nylon Resins Target Electronic Uses 17

DuPont Expands Asia Nylon Compounding 17

Ascend Performance Materials LLC Plans

Increases in Number of Nylon Plants. 17

DSM Buys Mitsubishi Chemical's Novamid 17

DSM Increases Capacity for New Nylon Grades. 17

New Nylon Grades for High-Current Circuit

Breakers. 17

Arkema Increasing Nylon Production in China 18

Solvay Advanced Polymers Buys Rhodia. 18

THERMOPLASTIC POLYESTERS 18

Background 18

Polybutylene Terephthalate (PBT) . 18

Background. 18

Properties 19

Applications. 19

Selected Key PBT Trade Names 20

New Developments and Products. 20

PBTs Developed for MIDs 20

New Chinese PBT Plant. 21

Non-Halogenated PBTs for E/E Products 21

Polyethylene Terephthalate (PET) . 21

Overview 21

Properties and Grades 21

Modified PET Resins 22

Engineering-Grade PET. 23

Reinforced PET. 23

Electronic/Electrical Applications 24

Producers and Capacities. 25

Specific PET Products Used to Mold Electronic

Components. 25

New Developments. 25

Indorama Bought Several Eastman Units 25

Japanese Firms Merge Their Respective PET

Businesses 26

DAK Americas Completed the Eastman

Withdrawal from the PET Business. 26

DAK Americas Also Purchased Wellman's

PET Business. 26

M&G Group is Planning a new PET Plant 26

Polycyclohexyldimethylene Terephthalate (PCT) 26

Background. 26

Properties 27

Ticona Engineering Polymers. 27

Market Estimates and Forecasts. 28

TABLE 5 GLOBAL PBT ELECTRONIC COMPONENT MARKET,

THROUGH 2017 (MILLION POUNDS) 28

TABLE 6 GLOBAL PET/PCT ELECTRONIC COMPONENT MARKET,

THROUGH 2017 (MILLION POUNDS) 29

POLYPHENYLENE SULFIDE (PPS) . 29

Background 29

Properties. 29

Advantages and Disadvantages 30

Applications. 31

Other Technology Considerations. 31

Producers. 31

New Developments 32

Chinese Company Claims Large PPS Capacity 32

Low-Chlorine PPS Geared for E/E Applications. 32

PPS Grades for Thin-Walling and High-Flow

Characteristics. 33

Dainippon Ink (DIC) Acquires Solvay's PPS

Compounding Business in Europe 33

Market Estimates and Forecasts 33

TABLE 7 GLOBAL PPS ELECTRONIC COMPONENT MARKET,

THROUGH 2017 (MILLION POUNDS) 34

POLYIMIDES/PEI/PAI 34

Background 34

Properties. 35

Early E/E Applications 35

Vespel Parts. 36

A Major Electric/Electronic Application-Dielectric

Interlayers 36

Polyimide Films. 37

Polyetherimides (PEIs) 38

Background. 38

Properties 38

Applications. 39

Polyamide-imides (PAIs) . 39

Background. 39

Properties 39

Applications. 40

Producers. 40

New Developments. 40

Polyetheramides Used to Produce Fiber-Optic

Connectors. 40

Sabic Increases Ultem Production in Spain 41

New Thermoplastic Polyimide Blends. 41

Market Estimates and Forecasts 41

TABLE 8 GLOBAL POLYIMIDE ELECTRONIC COMPONENT

MARKET, THROUGH 2017 (MILLION POUNDS) . 41

POLYCARBONATES. 42

Background 42

General Grades 42

Properties. 42

Overview 42

Property Advantages and Disadvantages 43

Polyester Carbonates. 43

Impact of Bisphenol A on Polycarbonate Usage. 44

Processing 44

Applications. 44

Alloys/Blends. 44

Marketing 45

Fiber-Reinforced Polycarbonates. 45

Producers and Capacities 45

Producers and Capacities (Continued) 46

TABLE 9 MAJOR POLYCARBONATE PRODUCERS AND TRADE

NAMED PRODUCTS 47

A New Development-Thinnest Commercial

Polycarbonate. 47

Market Estimates and Forecasts 47

TABLE 10 GLOBAL POLYCARBONATE ELECTRONIC COMPONENT

MARKET, THROUGH 2017 (MILLION POUNDS) 48

POLYPHTHALAMIDES (PPA) . 48

Background 48

Properties and Applications 49

Producers. 50

Market Estimates and Forecasts 50

TABLE 11 GLOBAL POLYPHTHALAMIDE ELECTRONIC

COMPONENT MARKET, THROUGH 2017 (MILLION POUNDS) 50

New Developments 51

New Grades of Polyphthalamide Have High Flow

and Reflectivity 51

Improved Corrosion-Resistant PPA Grades 51

LIQUID CRYSTAL POLYMERS (LCP) 51

Background 51

Properties. 51

Applications. 52

Background. 52

Electrical/Electronics 52

LCP Fiber-Reinforced Products 53

Producers. 53

New Developments and Products. 54

New Reinforced Grades 54

LCP Finds Growth in Smaller and Thinner

Connectors. 54

MIDs Using LCPs. 54

LCPs Provide High Heat Resistance 54

Ticona Now Producing LCPs in China. 54

Market Estimates and Forecasts 55

TABLE 12 GLOBAL ELECTRONIC COMPONENT MARKET,

THROUGH 2017 (MILLION POUNDS) 55

POLYSULFONES 56

Background 56

Types of Polysulfones 56

Overview 56

Polyarylsulfones 57

Grades 57

Properties. 57

Applications of Polysulfones 57

Electrical/Electronic Applications. 58

Producer Scenario 58

Solvay 58

RTP 59

Sumitomo Chemical 59

Polysulfone Producers and Trade Named Products. 59

Recent Developments 59

BASF Low-Friction Wear Polysulfone Grades 59

BASF to Build Plant in Asia. 59

Market Estimates and Forecasts 60

TABLE 13 GLOBAL POLYSULFONE ELECTRONIC COMPONENT

MARKET, THROUGH 2017 (MILLION POUNDS) 60

ALLOYS/BLENDS. 60

Background 60

PPO/HIPS 61

Background. 61

Properties 61

Grades. 61

Applications. 62

PPO/Nylon. 62

Background and Properties 62

Grades and Applications. 63

Use of PC/PBT Blends. 63

Recent Alloy/Blend Developments 63

New LCP/PPS Alloys Aim for Complex Parts. 63

PEEK/PBI Blends for High Heat Applications 64

Market Estimates and Forecasts 64

TABLE 14 GLOBAL POLYMER ALLOY/BLEND ELECTRONIC

COMPONENT MARKET, THROUGH 2017 (MILLION POUNDS) 64

FLUOROPOLYMERS 65

Background 65

Properties and Applications 65

Producers. 65

Market Estimates and Forecasts 65

TABLE 15 GLOBAL FLUOROPOLYMER COMPONENT MARKET,

THROUGH 2017 (MILLION POUNDS) 66

POLYKETONES 66

Background 66

Properties. 66

Polyketone Composites 67

Applications. 67

Producers. 67

Recent Developments 68

Daicel-Evonik Joint Venture 68

Victrex Activities. 68

New Polyketones Can Provide Lower Cost and/or

Higher Performance 68

Market Estimates and Forecasts 68

TABLE 16 GLOBAL POLYKETONE ELECTRONIC COMPONENT

MARKET, THROUGH 2017 (MILLION POUNDS) . 69

THERMOPLASTIC MARKET ESTIMATES AND FORECASTS

SUMMARY 69

TABLE 17 GLOBAL TOTAL THERMOPLASTIC RESIN MARKET FOR

ELECTRONIC COMPONENTS, THROUGH 2017 (MILLION

POUNDS) . 70

THERMOSET RESINS 70

OVERVIEW 70

FIBER-REINFORCED GRADES 71

GENERAL PROPERTIES. 71

TABLE 18 FIBER-REINFORCED THERMOSET PROPERTIES AND

MANUFACTURING PROCESSES 71

EPOXY RESINS. 71

Background 71

Chemistry. 72

Chemical Epoxy Types 72

Processing 72

Technology. 73

Epoxy Systems. 73

Background. 73

Non-Molded. 73

Laminating Systems. 73

Molded Epoxies. 74

Advanced Epoxy Composites 74

General Applications. 74

Electronic Applications 75

Molded Epoxies. 76

Important Epoxy Grades and Producers 76

Market Estimates and Forecasts 76

TABLE 19 GLOBAL EPOXY RESIN ELECTRONIC COMPONENT

MARKET, THROUGH 2017 (MILLION POUNDS) . 77

POLYURETHANES. 77

Background 77

Polyureas 78

RIM Products. 78

RRIM Products 78

SRIM Products. 79

Additional Details 79

Applications. 79

Key Polyurethane Suppliers. 79

Market Estimates and Forecasts 80

TABLE 20 GLOBAL POLYURETHANE ELECTRONIC COMPONENT

MARKET, THROUGH 2017 (MILLION POUNDS) . 80

PHENOLICS 80

Background 80

Grades 81

Molding Compounds 81

Background. 81

Typical Applications for Phenolic Molding

Compounds 82

Electric/Electronic Applications 82

Producers. 83

Market Estimates and Forecasts 83

TABLE 21 GLOBAL PHENOLIC ELECTRONIC COMPONENT

MARKET, THROUGH 2017 (MILLION POUNDS) . 83

UNSATURATED POLYESTERS 84

Background 84

Ingredients of Unsaturated Polyester Formulations. 84

TABLE 22 INGREDIENTS OF UNSATURATED POLYESTER

FORMULATIONS IN DESCENDING ORDER OF COMMERCIAL

USE. 85

Applications. 85

Overview 85

Electrical/Electronic 86

Market Estimates and Forecasts 86

TABLE 23 GLOBAL UNSATURATED POLYESTER COMPONENT

MARKET, THROUGH 2017 (MILLION POUNDS) . 87

DIALLYL PHTHALATE (DAP) . 87

Overview 87

Background and Applications. 87

Producers. 88

Market Estimates and Forecasts 88

TABLE 24 GLOBAL DAP ELECTRONIC COMPONENT MARKET,

THROUGH 2017 (MILLION POUNDS) 88

BT-EPOXY RESINS AND CYANATE ESTERS. 88

COMPOSITES 89

THERMOSET MARKET ESTIMATE AND FORECAST

SUMMARY 90

TABLE 25 GLOBAL TOTAL THERMOSET RESIN ELECTRONIC

COMPONENT MARKET, THROUGH 2017 (MILLION POUNDS) 90

CHAPTER FOUR: RECENT RESIN DEVELOPMENTS RELATED TO

ELECTRONIC COMPONENTS 91

DUPONT ACTIVITIES. 91

CHAPTER FIVE: TICONA ADVANCES. 92

BAYER MATERIAL SCIENCE DEVELOPMENT. 92

CHAPTER SIX: ELECTRONIC COMPONENT PRODUCTS 93

INTRODUCTION. 93

ACTIVE DEVICES. 93

ACTIVE/PASSIVE DEVICES 93

PASSIVE DEVICES 93

FOCUS OF THIS REPORT 94

DIELECTRIC PROPERTIES OF PLASTICS 94

OVERVIEW 94

BACKGROUND. 94

TABLE 26 DIELECTRIC CONSTANTS OF SELECTED MATERIALS

(DK) . 95

TABLE 27 DIELECTRIC CONSTANTS FOR SELECTED

THERMOPLASTICS (DK) 95

RESIN CONSUMPTION 96

BACKGROUND. 96

MARKETS 96

GROWTH 96

TECHNOLOGIES 97

REINFORCED PLASTICS MOVE AHEAD IN ELECTRONICS 97

PRINTED CIRCUIT BOARDS (PCBS) 97

BACKGROUND. 97

OVERVIEW 98

PROPERTY REQUIREMENTS. 98

Electrical 98

Mechanical. 99

Other Property Requirements. 99

PHYSICAL COMPOSITION. 99

ASSEMBLY TECHNOLOGIES. 99

ISSUES FACING PLASTICS USAGE 100

PCB SUBSTRATES. 100

TABLE 28 IMPORTANT TECHNICAL FACTORS TO CONSIDER

WHEN SELECTING PCB SUBSTRATE MATERIALS 100

RIGID SUBSTRATES 101

Overview 101

Standard FR-4 Epoxy Resin 101

SPECIFIC MATERIALS USED IN PCBS 102

Higher-Performance Epoxies 102

Polyimides 102

Cyanate Esters 102

Silicon-Carbon. 103

PTFE 103

BT Resins. 103

Phenolics 103

Melamine. 103

Other Materials. 103

Copper Foils 103

Glass Cloth 104

Types of Reinforcements. 104

OTHER DEVELOPMENTS. 104

Impact of Lead-Free Soldering 104

Aramid Fibers 105

Production of Rigid PCBs 105

NEW DEVELOPMENTS. 106

ENVIRONMENTAL ISSUES 106

Overview 106

Some Recycling Technologies for PCBs. 106

FLEXIBLE PRINTED CIRCUIT BOARDS 107

Background 107

Technology. 107

Standards. 107

Advantages 107

Materials Used. 108

Overview 108

Polyimides. 108

Polyesters 108

Liquid Crystalline Polymers. 108

Aramids. 109

Epoxy Resins. 109

Adhesiveless Laminates. 109

Rigid-Flex Circuits. 109

Comparison Between Rigid and Flexible Circuit Boards 109

TABLE 29 COMPARISON BETWEEN RIGID AND FLEX CIRCUIT

BOARDS. 110

SOLDERING 110

Background 110

Some Technologies. 110

Lead-Free Electronic Soldering 111

PRODUCTION STATISTICS 111

INDUSTRY TRENDS 112

MARKET SIZES. 112

MARKET ESTIMATES AND FORECASTS. 113

TABLE 30 TOTAL GLOBAL PCB MARKET BY RESIN TYPE

THROUGH 2017 (MILLION POUNDS) 113

TABLE 31 GLOBAL PCB MARKET BY THERMOSET RESIN

THROUGH 2017 (MILLION POUNDS) 114

TABLE 32 GLOBAL PCB MARKET BY THERMOPLASTIC RESIN,

THROUGH 2017 (MILLION POUNDS) 114

ELECTRONIC PACKAGING. 114

OVERVIEW 114

BACKGROUND. 115

THROUGH-HOLE TECHNOLOGY- A TYPE OF PCB

ASSEMBLY. 115

WIRE BONDING. 116

TAPE AUTOMATED BONDING (TAB) . 116

Overview 116

Advantages 116

CHIP-ON-BOARD (COB) . 117

Background 117

Advantages 117

Substrate Materials. 118

FLIP CHIP BONDING 118

DUAL-IN-LINE 119

SURFACE-MOUNT TECHNOLOGY (SMT) 119

Background 119

The Process 119

Additional Details 120

Design and Manufacturing Process 120

Advantages Versus Through-Hole 121

Wave Soldering Moving to Vapor Phase/IR 121

Resin and Material Usage. 122

More Details on the Competitive Resin Scenario with

SMT and Previously Discussed Electronic Packaging

Technologies. 122

OTHER KEY, SELECTED ELECTRONIC

PACKAGING/INTERCONNECTION TECHNOLOGIES 123

Multichip Modules (MCMs). 123

Definitions. 123

Background. 123

Rationale for Use 123

Types of MCMs 124

Materials Used 124

Problems for MCMs 124

Pin Grid Arrays (PGAs) 125

Overview 125

DGA Versus BGA 125

High-Density Chips. 125

Background. 125

Technology. 126

Materials Used. 126

Background. 126

Epoxy Alternatives. 126

Alternatives with Polyimides. 127

MOLDED/3D PCBS. 127

Background 127

Technology. 128

Manufacturing. 128

History 128

How Do They Differ From PCBs? . 129

Materials Used. 129

Market Target 129

Process Technologies. 129

Impact of MIDs 130

New Plastics for MIDs. 130

Lanxess 130

BASF. 131

Ticona 131

Evonik 131

ENCAPSULANTS 131

Definitions and Background. 131

Primary Purposes of Encapsulation. 132

Organic Encapsulants. 133

Overview 133

Background. 133

Impact of Thermoplastics. 133

Background. 133

Types and Application Modes. 134

TABLE 33 ENCAPSULANTS - APPLICATION MODE, ADVANTAGES

AND DISADVANTAGES. 134

Epoxy Encapsulation Formulations 134

TABLE 34 EPOXY ENCAPSULANT FORMULATIONS. 135

Encapsulated Electrical Components. 135

Background. 135

Specific Encapsulant Applications. 136

Epoxy Encapsulant Systems 136

Specifications and Standards 137

Overview 137

UL 1694 Looks at Circuit Boards. 137

Silicone Encapsulants. 138

Major Selected Encapsulant Producers and Their Product

Lines. 139

Huntsman 139

Lord Chemical. 139

Loctite 139

TABLE 35 SELECTED ENCAPSULANT SUPPLIERS. 140

A New Development 140

Market Estimates and Forecasts 140

TABLE 36 GLOBAL ELECTRONIC ENCAPSULATION MARKET BY

RESIN TYPE, THROUGH 2017 (MILLION POUNDS) . 141

TABLE 37 GLOBAL ENCAPSULANT MARKET BY THERMOSET

RESIN, THROUGH 2017 (MILLION POUNDS) . 141

TABLE 38 GLOBAL ENCAPSULATION MARKET BY

THERMOPLASTIC RESIN, THROUGH 2017 (MILLION POUNDS) 142

CHAPTER SEVEN: MOLDED ELECTRONIC PRODUCTS. 143

OVERVIEW. 143

BACKGROUND. 143

RESINS USED. 143

DEMAND 144

TABLE 39 DEMAND FOR PASSIVE ELECTRONIC COMPONENTS (%) 144

MARKET DRIVERS. 144

CONNECTORS 145

Background 145

Trends 145

Materials and Applications for Electronic Connectors 145

Industrial Applications 146

Function of Connectors 146

The Industry 146

Electronic Connector Types. 146

Resin Selection. 146

Resin Selection (Continued) . 147

Standards. 148

NEMA AND ANSI 148

Manufacturers. 148

TABLE 40 SELECTED MANUFACTURERS OF HIGH DENSITY,

MULTIPIN CONNECTORS 149

End-Use Markets. 149

Background. 149

Communications Industry 150

Automotive Industry. 150

Background. 150

Resin Scenario. 150

Other Markets. 151

New Resin Developments 151

New Polyester Advantages. 151

Nylon Activities. 151

Market Estimates and Forecasts 152

TABLE 41 GLOBAL CONNECTOR MARKET BY RESIN THROUGH

2017 (MILLION POUNDS) 152

TABLE 42 GLOBAL CONNECTOR MARKET BY THERMOPLASTIC

RESIN THROUGH 2017 (MILLION POUNDS) 153

TABLE 43 GLOBAL CONNECTOR MARKET BY THERMOSET RESIN,

THROUGH 2017 (MILLION POUNDS) 153

SWITCHES. 154

Background 154

Market Estimates and Forecasts 154

TABLE 44 GLOBAL SWITCH MARKET BY RESIN, THROUGH 2017

(MILLION POUNDS) 155

TABLE 45 GLOBAL SWITCH MARKET BY THERMOPLASTIC

RESINS, THROUGH 2017 (MILLION POUNDS) 155

TABLE 46 GLOBAL SWITCH MARKET BY THERMOSET RESIN,

THROUGH 2017 (MILLION POUNDS) 156

BOBBINS 156

Background 156

TABLE 47 SELECTED BOBBIN MOLDERS. 157

Market Estimates and Forecasts 157

TABLE 48 GLOBAL BOBBIN MARKET BY RESIN, THROUGH 2017

(MILLION POUNDS) 157

TABLE 49 GLOBAL BOBBIN MARKET BY THERMOPLASTIC RESIN,

THROUGH 2017 (MILLION POUNDS) 158

TABLE 50 GLOBAL BOBBIN MARKET BY THERMOSET RESINS,

THROUGH 2017 (MILLION POUNDS) 158

RELAYS 159

Background 159

Market Estimates and Forecasts 159

TABLE 51 GLOBAL RELAY MARKET BY RESIN THROUGH 2017

(MILLION POUNDS) 159

TABLE 52 GLOBAL RELAY MARKET BY THERMOPLASTIC RESIN,

THROUGH 2017 (MILLION POUNDS) 160

TABLE 53 GLOBAL RELAY MARKET BY THERMOSET RESIN,

THROUGH 2017 (MILLION POUNDS) 160

CAPACITORS. 160

Background 160

Applications. 161

Dielectric Materials. 161

Capacitor Types. 161

Consumption by Market Segment 162

Market Estimates and Forecasts 162

TABLE 54 TOTAL GLOBAL CAPACITOR MARKET BY

THERMOPLASTIC RESIN THROUGH 2017 (MILLION POUNDS) 163

OTHER MOLDED ELECTRONIC COMPONENTS 163

Resistors. 163

Background. 163

Applications. 164

Inductors/Transformers. 164

Plastic Usage. 165

Market Estimates and Forecasts (Other Molded

Electronic Components) . 165

TABLE 55 OTHER GLOBAL ELECTRONIC COMPONENT MARKET

BY RESINS, THROUGH 2017 (MILLION POUNDS) . 165

TABLE 56 GLOBAL OTHER ELECTRONIC COMPONENT MARKET

BY THERMOPLASTIC RESIN, THROUGH 2017 (MILLION

POUNDS) . 166

TABLE 57 GLOBAL OTHER ELECTRONIC COMPONENT MARKET

BY THERMOSET RESIN, THROUGH 2017 (MILLION POUNDS) . 166

CHAPTER EIGHT: RECENT PATENTS RELATED TO THE INDUSTRY. 167

RECENT PATENTS RELATED TO THE INDUSTRY. 167

RECENT PATENTS RELATED TO...(CONTINUED) . 168

RECENT PATENTS RELATED TO...(CONTINUED) . 169

SUMMARY OF MARKET ESTIMATES AND FORECASTS FOR

ELECTRONIC DEVICES. 170

TABLE 58 TOTAL GLOBAL RESIN ELECTRONIC COMPONENT

MARKET BY APPLICATION, THROUGH 2017 (MILLION POUNDS) 170

TABLE 59 TOTAL THERMOPLASTIC RESIN ELECTRONIC

COMPONENT MARKET BY APPLICATION, THROUGH 2017

(MILLION POUNDS) 171

TABLE 60 TOTAL GLOBAL THERMOSET PLASTIC ELECTRONIC

COMPONENT MARKET BY APPLICATION, THROUGH 2017

(MILLION POUNDS) 172

CHAPTER NINE: CHANGES IN ELECTRONIC COMPONENT

MANUFACTURE WHICH COULD IMPACT RESIN CHOICES 173

CHANGES IN ELECTRONIC COMPONENT... 173

CHANGES IN ELECTRONIC COMPONENT...(CONTINUED) 174

CHAPTER TEN: APPLICATIONS AND INDUSTRY TRENDS 175

OVERVIEW. 175

SNAPSHOT OF THE ELECTRONIC DEVICE MARKET. 175

EXAMPLES OF STATIONARY ELECTRONIC DEVICES 176

COMPUTERS. 176

Overview 176

Desktops. 177

ELECTRONIC DISPLAYS 177

Background 177

Flat-Panels Displays. 178

The Future of CRT Technology. 178

PRINTERS 179

Overview 179

Ink Jet printers 179

Monochrome Laser Printers 179

Color Laser Printers 179

Manufacturers. 179

Printer Market Matures 180

"ALL-IN-ONE" MACHINES 180

PHONES. 180

Corded 180

Cordless 180

FACSIMILE MACHINES (FAX MACHINES) . 181

Overview 181

Background 181

SCANNERS 181

Background 181

EXAMPLES OF MOBILE ELECTRONIC DEVICES. 182

CELLULAR PHONES. 182

History 182

Overview 182

Producers. 182

Current Market Update 182

NOTEBOOKS/NETBOOKS. 183

Overview 183

Netbooks. 183

TABLETS/I-PADS 184

E-READERS. 184

I-PODS/MP3 . 185

COMBINATION-TYPE MOBILE ELECTRONIC

ENCLOSURES 185

SPECIAL END-USE MARKET FOR PLASTIC ELECTRONIC

COMPONENTS -AUTOMOTIVE UNDER-THE HOOD. 185

OVERVIEW 185

TABLE 61 HISTORICAL, CURRENT AND PROJECTED U.S.

AUTOMOTIVE SALES (MILLION UNITS) 185

TABLE 62 ESTIMATED HYBRID SALES FOR THE U.S. (THOUSAND

UNITS) . 186

CAFE ISSUES 186

OVERVIEW OF ELECTRONIC COMPONENTS 187

FLEXIBLE CIRCUITRY 188

MATERIAL USAGE. 189

EXPANDED USE OF ENCAPSULATED COMPONENTS. 190

BOBBINS/CONNECTORS 190

SWITCHES/SOCKETS 191

IGNITION COMPONENTS. 191

CHAPTER ELEVEN: TECHNOLOGY TRENDS RELATED TO

ELECTRONIC COMPONENTS 192

BACKGROUND 192

IMPORTANCE OF MINIATURIZATION. 192

PACKAGING. 193

CONCEPT OF MICROMOLDING. 193

REPLACEMENT OF CERAMICS WITH PLASTICS. 194

THIN-WALLING ELECTRONIC COMPONENTS. 195

BACKGROUND. 195

THIN-WALLING IS NOT A NOVEL CONCEPT. 195

EFFECTS ON PERFORMANCE REQUIREMENTS AND

DESIGN. 195

APPLICATION REQUIREMENTS. 196

MATERIAL AND PROCESS SELECTION 196

PROPERTIES REQUIRED. 197

CHALLENGES IN DOWNSIZING. 198

SOFTWARE THAT AIDS THIN-WALL DESIGN 198

PRINTED ELECTRONICS 198

FLEXIBLE ELECTRONICS 199

Overview 199

Concept of Plastic Electronics. 199

Concept of Plastic Electronics (Continued) 200

Advantages 201

Potential Market Size 201

CHAPTER TWELVE: ELECTRONIC COMPONENT INDUSTRY

OVERVIEW 202

TOP ELECTRONIC INDUSTRY MANUFACTURERS 202

TABLE 63 TOP GLOBAL SEMICONDUCTOR COMPANIES-2010 ($

BILLIONS) . 202

MARKETING ASPECTS 203

OUTSOURCING 203

WHAT PLASTIC MOLDERS ARE DOING 203

UPSTREAM MANUFACTURING 204

CONTRACT MANUFACTURING. 204

CHAPTER THIRTEEN: RESIN PRODUCERS 205

OVERVIEW. 205

TABLE 64 TRADE NAMES OF SELECTED, KEY RESINS USED IN

ELECTRONIC COMPONENTS AND RELATED ELECTRONIC

PRODUCTS 205

TABLE 64 (CONTINUED) . 206

TABLE 64 (CONTINUED) . 207

TABLE 64 (CONTINUED) . 208

MAJOR RESIN PRODUCERS SUPPLYING PRODUCT TO THE

ELECTRONIC COMPONENT MARKET 208

THERMOSETS. 208

Epoxies. 208

Polyurethanes 208

Phenolics 208

Polyesters. 209

DAP 209

THERMOPLASTICS 209

Nylons 209

Polyesters. 209

PPS. 210

Polyimides 210

Polycarbonates. 210

LCPs. 210

Polysulfones. 210

Fluoropolymers 211

Polyphthalamides 211

Polyketones 211

Polymer Alloys/Blends. 211

New Developments 211

DuPont Sells Several Resins to Ticona 211

DuPont Resumes Delayed Chinese Expansion

Plans. 211

Solvay Advanced Polymers Moves Further into the

Electronics Market 212

Ticona to Produce LCPs in China 212

Dow Chemical Merges its Plastic Unit 212

Styron to Become Trineseo. 212

BASF and Ineos Combine Styrenics Business 212

BASF Introduces New Grades for Electronic

Components. 213

CHAPTER FOURTEEN: PRICING. 214

TABLE 65 LIST PRICES FOR SELECTED RESINS USED TO MOLD

ELECTRONIC COMPONENTS ($/LB) . 214

CHAPTER FIFTEEN: MOLDERS OF ELECTRONIC COMPONENTS. 215

TABLE 66 TOP ELECTRICAL/ELECTRONIC INJECTION MOLDERS

($ MILLIONS) 215

CHAPTER SIXTEEN ENVIRONMENTAL ISSUES. 216

OVERVIEW. 216

PRINTED CIRCUIT BOARD DISPOSAL. 216

HALOGEN-FREE PRINTED CIRCUIT BOARDS 216

RECYCLING. 217

ELECTRONIC INDUSTRY INTERFACE. 217

OVERVIEW 217

REASONS FOR INCREASED ENVIRONMENTAL

REGULATIONS FOR ELECTRONIC EQUIPMENT. 218

THE EUROPEAN UNION'S ROHS DIRECTIVE 219

THE WEEE DIRECTIVE. 220

CHAPTER SEVENTEEN: TESTING AGENCIES AND REQUIREMENTS

RELATED TO ELECTRONIC COMPONENTS 221

OVERVIEW. 221

FIRE PROTECTION STANDARDS FOR ELECTRONIC

COMPONENTS. 221

UNDERWRITERS LABORATORIES (UL) . 221

BACKGROUND. 221

FLAMMABILITY STANDARDS. 222

Definitions 222

Flammability Tests 223

Overview 223

UL 94 Vertical Burn Tests. 223

TABLE 67 CRITERIA FOR UL 94V CLASSIFICATIONS

(INCHES/MINUTE) . 224

UL Horizontal Burn Test (UL 94 HB) . 224

Summary of UL 94 Material Ratings. 224

TABLE 68 BURN SPECIFICATION FOR UL 04 MATERIAL RATINGS 224

UL 1950 . 225

CHAPTER EIGHTEEN: SELECTED COMPANY PROFILES 226

AOC, INC. 226

ASAHI KASEI CHEMICAL. 226

ASHLAND SPECIALTY CHEMICALS. 226

BASF 227

BAYER MATERIAL SCIENCE 227

CHEVRON PHILLIPS CHEMICAL 228

CYTEC INDUSTRIES, INC. 228

DSM ENGINEERING PLASTICS. 229

DUPONT, INC. . 229

EMS GRIVORY, INC. . 230

HUNTSMAN ADVANCED MATERIALS 230

INTERPLASTIC CORPORATION. 231

LOCTITE, INC. . 231

MITSUBISHI ENGINEERING PLASTICS. 232

QUANTUM COMPOSITES 232

ROGERS CORPORATION. 233

SABIC INNOVATIVE PLASTICS. 233

SOLVAY ADVANCED POLYMERS LLC 234

SUMITOMO BAKELITE NORTH AMERICA 234

TICONA, INC. . 235

TORAY PLASTICS. 236

VICTREX, USA, LTD. 236

CHAPTER NINETEEN: ACRONYMS 237

ACRONYMS 237

ACRONYMS (CONTINUED) 238

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