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Philips Fab Shows Yield Gain Using Applied Materials' New RTP Centura System.

SANTA CLARA, Calif.--(BUSINESS WIRE)--Dec. 7, 1995--After using Applied Materials' new RTP Centura system in its production fab line in Albuquerque, New Mexico, Philips Semiconductors has found that the system offers significant yield improvements over the RTP (rapid thermal processing) technologies previously used.

Klaus Pfeifer, etch section head at Philips, said, "Based on the preliminary testing we did with Applied Materials before the RTP Centura system's introduction, we expected very high within-wafer and wafer-to-wafer uniformity. The 0.4% within-wafer uniformity we achieved during start-up proved to be considerably better than our specification of 1%. More importantly, the system's immediate yield improvement over our installed RTP technology in split lot testing should mean that the RTP Centura pays for itself very quickly in increased output and profitability."

Philips' first RTP Centura was delivered in June 1995, and was processing wafers nine days after the facility installation. The system is performing a titanium silicide anneal in a salicide process for Philips' logic devices, as well as platinum silicide and implant anneal processes for Philips' BiCMOS devices. An additional RTP Centura system was delivered in October. A third system is scheduled for delivery in March 1996.

James Dodsworth, global product manager for Applied Materials' RTP group, said, "Using the RTP Centura, our customers can easily integrate RTP processing into their advanced designs, with demonstrated yield benefits in many cases. We think this new system is now the industry benchmark for RTP."

The RTP Centura was introduced in June 1995 with many advanced technical capabilities aimed at enabling new semiconductor device manufacturing technologies and increasing chipmakers' productivity. The unique radial design of its light source offers unprecedented control of light intensity, and is linked in real-time to multiple non-contact optical temperature probes for uniformity and repeatability of temperature, dopant diffusion and sheet resistivity.

Applied Materials, Inc. is a global growth company and the world's largest supplier of wafer fabrication systems and services to the global semiconductor industry. Applied Materials is traded on the Nasdaq National Market under the symbol, "AMAT."

CONTACT: Applied Materials, Inc.

Charles Lewis, 408/748-5819 (editorial/media)

Bill Ong, 408/235-6232 (financial community)
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Publication:Business Wire
Date:Dec 7, 1995
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