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PCB Design Conference East: the premier conference and exhibition for PCB engineering, design and manufacture professionals.


Including Lead-Free, Embedded Components, High Speed, and PCB Design Fundamentals

Conference: October 4-8, 2004

Exhibition: October 5-6, 2004

Radisson Hotel Manchester (formerly Holiday Inn at the Center of New Hampshire) Manchester, New Hampshire


The PCB Design Conferences have always strived to provide you with education for your most pressing PCB design challenges. The ninth annual PCB East takes this mission a step further by featuring 12 technical courses that will prepare you to face a specific set of pressing challenges: designing for lead-free manufacture and assembly, utilizing embedded components, and solving high-speed design problems such as signal integrity and EMI. Please turn to pages 6-11 and check out the courses we've selected to cover these topics: DEC1, DEC2, DEC3, T2, T3, T5, 022, 032, 042, 043, 052, and 063.

Industry-leading conference courses

The PCB Design Conferences have earned a five-star reputation for providing attendees with a quality conference program filled with useful courses taught by industry experts. The PCB East 2004 conference program features over 35 Professional Development and Technical Conference courses--including the 12 courses listed above. Over 80% of this year's courses are NEW to PCB East and 20% are back due to popular demand. You won't find a better conference value in the PCB design industry.

Industry-leading exhibition

Thanks to an improving economy, the trade show industry has bounced back in a big way. We expect the PCB East 2004 show floor to sell out, and that this year's show will provide the East Coast with the kind of industry-leading product and service exhibition that you've come to expect from UP Media Group.

Industry-leading networking opportunities

Thanks to your answers on past show surveys, we know that networking is high on your list of things to do at our shows. PCB East 2004 will provide you with numerous opportunities to network with your peers, speakers and exhibitors at events ranging from the Keynote Address to the Opening Night Reception, the Brew-ha-ha Party and Giveway, and much more. See page 3 for descriptions of these and other special events at PCB East 2004.

See you in Manchester!

Pete Waddell President, UP Media Group


PCB Technology Forum and Welcome Luncheon

Sponsored by Printed Circuit Design & Manufacture Monday, October 4 * 12 PM-1:30 PM

The PCB Technology Forum and Welcome Luncheon will feature one or more experts who will discuss important issues facing the PCB design and manufacture industries. Free to all Monday Professional Development Certificate Program attendees and speakers, a plated luncheon will be served. Exhibit-only attendees, Technical Conference attendees, Exhibitors, and others who wish to attend may do so by paying a fee of only $25. The speaker(s) will be announced on the PCB East Web site at a later date.


Opening Night Reception Tuesday, October 5 * 5 PM-6:30 PM

After spending a long hard day in class, on the show floor or even at the office, you'll be ready to relax and unwind. Don't miss your opportunity to schmooze with exhibitors, chat with our speakers and catch up with your peers while enjoying complimentary hors d'oeuvres and beverages on the show floor.


Book Store and Book Signings Tuesday, October 5 and Wednesday, October 6

For the first time ever at PCB East, you'll be able to purchase books by industry authors and conference speakers at the PCB East Book Store. Come prepared to buy your new reference materials at the show, meet the author(s) and even get your new book autographed! Check the PCB East Web site for event updates and a list of authors who will sign their books during the two-day exhibition.


Brew-ha-ha Party and Giveaway Wednesday, October 6 * 7 PM-10:30 PM

This year's special evening event will be held at Jilians, 50 Phillipe Cote Street, in downtown Manchester. The Brew-ha-ha Party and Giveaway will provide you with a chance to win some fabulous prizes as you network and party the night away in a relaxed, music-filled atmosphere complete with pool tables, darts and more. Bring your dancing shoes and enjoy rock and blues standards kicked up by the Porch Dawgs--the infamous band of PCB industry professionals. To be eligible for the giveaway of prizes (all valued at $200 or more), visit the show floor on Tuesday and Wednesday and get your Gold Cards stamped by participating exhibitors. You must be present at the party to win. See you at Jillian's!


Keynote Address

Tuesday, October 5 9 AM-10 AM

The Keynote Address speaker and topic will be announced at a later date on the PCB East 2004 Web site. Visit for the latest information.


(As of 6/11/2004) Visit for the most current list of exhibitors.

Advanced Circuits

Advantage Plastic Products

Beta Layout

Century Circuits & Electronics

Cimmetry Systems


DownStream Technology

Dynamic Details


EMA Design Automation

Hallmark Circuits

Intercept Technology

Lazer-Tech Limited

Mentor Graphics

Metro/Speedy Circuits

Nationwide Circuits

Polar Instruments

Selective Sourcing/Ohmcraft

Sovereign Circuits

Tech Circuits



Valor Computerized Systems

Vermont Circuits

Zuken USA


7 AM-5 PM
On-Site Registration

9 AM-5 PM

Professional Development Certificate Courses (see page 6)
 DEC1--EMI and EMC for the Design Engineer Robert Hanson
 DEC2--High Speed Design--Signal Integrity,
 EMI and Crosstalk Rick Hartley
 DEC3--HDI/Microvias and Embedded
 Passives Design Challenges Happy Holden and Mike Fitts
 T1--An Overview of IC Packaging and
 Assembly William Greig
 T2--Signal Integrity Issues in PCB
 Design Doug Brooks

12 PM-1:30 PM

PCB Technology Forum and Welcome Luncheon (see page 3)


8 AM-6 PM
On-Site Registration

9 AM-10 AM
Keynote Address

10 AM-6:30 PM
Exhibits Open

10 AM-5 PM
Professional Development Certificate Courses (see page 6)
 DEC1, DEC2 and DEC3 continued

10 AM-11 AM

Technical Conference Courses (see page B)

 010--Bottom up RF Design: From Layout to Schematic John Cecere
 011--Parallel Design Techniques Charles Pfeil
 012--Aligning Design and Supply Chains Ken Stanvick
 013--Implementing Large FPGAs Lisa Hamaker
 014--Improving EMS Efficiency Doug Voiland

1:30 PM-5 PM

Technical Conference Courses (see pages 8-9)

 020--Insertion and Return Loss: The Universal
 Performance Metrics for all Interconnects Eric Bogatin
 021--Partitioning and Layout of a Mixed-Signal PCB Henry W. Ott
 022--Life Cycle Assessment of Lead-Free Solder Maria Leet Socolof
 023--Let's Get Smaller, Better and Cheaper:
 CSP, Flip Chip and 3DTechnologies William Greig
 024--Transmission Lines: Theory, Simulation
 and Control Doug Brooks
 025--Flexible Printed Circuit Technology:
 Characteristics and Applications Tom Stearns

5 PM-6:30 PM
Opening Night Reception (see page 3)


8 AM-4 PM
On-Site Registration

9 AM-4 PM
Exhibits Open

9 AM-11 AM

Technical Conference Courses (see pages 9-10)

 030--Dipoles for Dummies Henry W. Ott
 031--Impedance Analysis and Specifications Happy Holden
 032--Best Practices in Implementing Lead-Free
 Assembly, Part I Ron Lasky

1:30 PM-5 PM

Technical Conference Courses (see page 10)

 040--Design Optimization of Single-Ended and
 Differential Impedance PCB Transmission Lines Gary Brist
 041--A Non-Threatening Introduction to FPGAs for
 PCB Guys and Gals Clive "Max" Maxfield
 042--Best Practices in Implementing Lead-Free
 Assembly, Part II Ron Lasky
 043--Embedded Passives Workshop Richard Snogren

7 PM--10:30 PM

Brew-ha-ha Party and Giveaway (see page 3)

8 AM-4 PM
On-Site Registration

9 AM-11 AM

Technical Conference Courses (see page 10).

 050--The Fundamentals of Design for Test Gary Ferrari
 051--Differential Traces and Impedance Doug Brooks

9 AM-12:30 PM

Technical Conference Courses (see pages 10-11)

 052--The Real Cost of Lead-Free SMT
 Manufacturing Phil Zarrow
 053--Basic Basic: Enhancing Your Design Tool
 With Visual Basic Bruce Fihe

1:30 PM-5 PM

Technical Conferences Courses (see page 11)

 060--Analysis for Through-Hole to HDI Conversion Gary Ferrari
 061--Technical Roadmap of HDI; Flexible Substrates
 in Portable Electronics Dominique Numakura
 062--Thermal Management of High Current in Printed
 Circuits Mike Jouppi
 063--Designing With Embedded Passives Rick Hartley

8 AM-10 AM

On-Site Registration

9 AM-5 PM

Professional Development Certificate Courses (see page 7)

 T3--PCB and System-Level Grounding for Signal
 Integrity, EMC, and Analog to Digital Conversion Lee Hill
Maintaining Your Edge Gary Ferrari
 T5--New Test Methods for High-Speed, High-Density
 PCBs Robert Hanson
 T6--PCB Design 101: A Foundation to Build on Bruce Fihe
 T7--RF and Microwave PCB Design and Base Materials Rick Hartley

Professional Development Certificate Program

PCB Design Conference East 2004 is pleased to offer 10 courses--a great selection of two-day Design Excellence Curriculum courses (DEC1-DEC3) and one-day tutorials (T1-T7)--in this year's Professional Development Certificate Program. These integrated, technical courses of study are taught by industry experts who will provide you with the technology, theory, application and best-practice information that you need to achieve meaningful professional growth and development. Following the show, you'll receive a certificate of completion for each Professional Development course that you complete, but the real benefit is the knowledge you'll gain and be able to apply to your career--long after this year's conference has ended.



DEC 1--EMI and EMC for the Design


Speaker: Robert Hanson, AmeriCom Test

Attendees: PCB design engineers and engineering managers with an interest in EMI and EMC.

If you're a PCB design engineer, it pays for you to know how and why EMI testing is conducted, as well as the typical causes of failure. This course offers all of the EMI information you'll need--including design considerations at CAE and CAD levels--for you to provide a compliant radiation/susceptibility product. You'll examine ways to prevent common EMI/EMC problems regarding power supplies, cables, connectors, slots, discontinuity of ground planes and more. This two-day class will focus on EMI and RFI issues regarding PCBs, computers, analog designs and systems, along with relevant EMI regulations in the U.S., the European Union and Asia. Highlights include PCB radiation basics, radiation and bypass on PCBs, PCB radiation suppression techniques, grounding designs/filtering, crosstalk/termination, power and ground planes, antenna loops, spread spectrum clocking, and differential-mode and common-mode radiation.



DEC 2--High Speed Design--Signal Integrity, EMI and Crosstalk

Speaker: Rick Hertley, L-3 Communication, Avionics Systems

Attendees: PCB designers, engineers and managers interested in learning and applying high-speed concepts to electronic products.

This two-day course is a compete introduction to the high-speed design concepts needed for designs utilizing ultra-fast ICs. The course will cover circuit parasitics, high-frequency currents, signal and wave propagation, propagation time and velocity, PCB properties, transmission line impedance, impedance models, trace routing and termination, and the effects of vias and trace corners. Highlights will include high-speed PCB materials, connectors in high-speed circuits, differential pairs, control of signal crosstalk, control of EMI, split planes and plane islands, PCB layer stackups, filters and filtering techniques, system RF shielding and grounding, slots in enclosures, and conducted EMI filters. Attendees will learn about interfacing with the fabricator, PCB fabrication drawings, impedance testing, test coupons and cost differential of controlled impedance PCBs.



DEC 3--HDI/Microvias and Embedded Passives Design Challenges

Speakers: Happy Holden. Westwood Associates, and Mike Fitts, Mentor Graphics Corp.

Attendees: PCB design engineers, designers, managers and others interested in utilizing HDI and embedded passives.

Day 1: Design Challenges With HDI/Microvias and Embedded Passives--Overcoming the Obstacles by speaker Happy Holden. This full-day session examines design techniques for the interconnection of area array components, from ASIC packaging and telecom to dense multi-chip modules and more. PCB design rules, materials and selection of PCB structures (blind, buried, and microvias) will be examined and compared. The tutorial will define HDI technologies, circuit routing guidelines and materials required to permit the use of widely accepted fine-pitch and BGA components. Channel routing techniques using blind vies will show how layers can be reduced by as much as 3X. The second half of the day is devoted to embedded passive technologies, including planar capacitance, buried resistors and capacitors, materials, properties, processes, cost tradeoff examples, and the electrical performance of power supplies with various materials.

Day 2--Design Challenges with HDI Microvias--Embedded Passives--Applied by speaker Mike Fitts. This hands-on full-day session will take principles learned in the previous day's session and give the attendee the opportunity to apply them to real-world designs. The tutorial will start with a discussion of CAD toolsets and will continue with attendees using an actual toolset to strengthen their understanding of how HD[ can be used to solve everyday design challenges. Includes a case study of the implementation of embedded passives. Previous toolset experience is required and the ability to work as part of a team is mandatory.



T1--An Overview of IC Packaging and Assembly

Speaker: William Greig, Greig Associates

Attendees: Anyone involved with electronics design, including someone new to the industry, who wants to learn about IC packaging.

This course will address IC packaging and the interconnect technology that supports electronics manufacturing. The course also will focus on chip and wire, flip chip and tape automated bonding for chip attachment, and will evaluate each for its relevance and applicability. Attendees will discuss HDI packages and substrates supporting single-chip packaging (SCP), chip-scale packaging (CSP), chip-on-board (COB), multichip modules (MCM), system-in-package (SIP), and PCBs. The course will also review recent developments in the stacking and 3D packaging. This course can serve as an introduction to the various technologies, or as an update of their current status.



T2--Signal Integrity Issues in PCB Design

Speaker: Doug Brooks, UltraCAD

Attendees: PCB designers, design managers, layout technicians and design engineers interested in understanding signal integrity.

This full day tutorial will look at a variety of layout practices that can lead to signal degradation, noise and radiation, as well as explaining why those practices cause problems, and showing attendees how to control or eliminate noise and EMI in board designs. Particular emphasis will be given to transmission lines, loop areas, bypass capacitors, and crosstalk. Results from commercially available signal analysis tools will be used as an aid to understanding transmission lines and crosstalk.



T3--PCB and System-Level Grounding for Signal Integrity, EMC, and Analog to Digital Conversion

Speaker: Lee Hill, Silent Solutions

Attendees: Circuit and PCB designers who have an interest in learning precise design and debug techniques, as well as proper terminology for describing and taming electronic circuit grounding. A basic knowledge of PCB design and/or electronics theory is required.

This one-day course will provide a unique blend of theory, applications and numerous hardware demonstrations to describe effective and not-so-effective PCB design advice that we often hear from electrical engineers and EMC "experts" The real-time demonstrations use a spectrum analyzer, oscilloscope and signal generator to illustrate inductance, common-impedance coupling and ground loops in PCBs, cables and systems. Specific examples of single-point, multipoint, good and bad grounds will be discussed. This course emphasizes "how and why things work" and how to apply precise technical concepts to new designs. The key benefits of this course include: 1) developing the skills to recognize and understand grounding issues in electronic design; 2) establishing a knowledge base to improve new designs during schematic capture, component placement and signal routing; 3) improving first-pass PCB designs to avoid common mistakes and assist the circuit designer with valuable circuit design input; and 4) developing and fostering concurrent engineering design practices from initial design to final PCB design release.



T4--Maintaining Your Edge

Speaker: Gary Ferrari, Ferrari Technical Services

Attendees: PCB designers and design managers.

As more design jobs are outsourced, maintaining your edge is more important than ever. The best way to accomplish this is by learning more about manufacturing processes and new materials, and by communicating effectively. The result will become of greater value to your company. This session will focus on cost-effective design and manufacture techniques. The class will be broken into separate interactive discussion groups to look at material issues such as high performance, HDI and surface finishes for lead-free assembly. The groups will further explore challenges presented by current and future fabrication and assembly processes. Lastly, the groups will look at new and innovative ways to test and verify a product's integrity.



T5--New Test Methods for High-Speed, High-Density PCBs

Speaker: Robert Hanson, AmeriCom Test

Attendees: PCB designers, design managers and others interested in testing high-speed HDI boards.

The testing of high-speed, high-density PCBs is fast evolving, and traditional methods such as bed-of-nails and ICT may not provide you the test capability you need. This class will explain why traditional high-speed testing methods are less applicable from a quality, throughput and capability perspective, and define newest methods that overcome these restrictions and provide you with cost-effective solutions. Highlights of the course include testing characteristic impedance at bare board level using TDR or VNA, as well as new flying probe techniques; TDR/VNA software; coupons, airlines, and instrumentation; and open trace and Cu plane shorting requirements. You also will learn much more, including the answers to these questions: What is microsectioning testing and what does it accomplish when testing blind and buried vias? Why is vision testing (AOI, X-ray and laser) becoming more popular for testing blind vias? Will 45-degree and 90-degree angles cause signal integrity problems at high-speed edges/frequencies? What does Boundary SCAN testing accomplish and how is it conducted? Etcetera. We also will focus on the results of controlled test studies.



T6--PCB Design 101: A Foundation to Build on

Speaker: Bruce Fihe, Premier Technology Training

Attendees: Anyone who needs a broad understanding of PCB design and manufacturing processes.

Beginning PCB designers are often taught their new skills by senior members of the design staff as they have time for training. Those who work closely with designers, from engineers to buyers, often have little or no understanding of the overall process needed to design and manufacture a PCB. Having a broad understanding of the PCB design and manufacturing process helps all of those involved make better decisions that can help reduce the overall design cycle time and eliminate costly design spins. This one-day tutorial is designed to provide a strong foundation of knowledge about PCB design and manufacturing. The course covers fundamental concepts such as laminate materials, board construction, component placement, routing, photoplotting, bare board fabrication, assembly, testing, and documentation. It also includes several hands-on exercises in placement, routing and split planes. Attendees will receive a comprehensive list of references useful in further building their knowledge of PCB design and manufacturing.



T7--RF and Microwave PCB Design and Base Materials

Speaker: Rick Hartley, L-3 Communication. Avionics Systems

Attendees: PCB designers, engineers and managers interested in learning how to apply PCB layout techniques for RF circuits.

Ultra-high signal integrity and noise control are the keys to full functionality when designing very high frequency analog applications. One area of paramount importance is the design and structure of the PCB. This tutorial will help you understand the "whets" and "whys" of PCB layout and the effect of PCB materials in high-frequency analog circuits. The course also will cover impedance matching and balance, signal wavelength, propagation delay, critical trace length, noise, reflections, skin effect, loss tangent, waveguides and other RF transmission lines, and microstrip vs. stripline vs. co-planar waveguides. Attendees will focus on RF equations and methods to resolve impedance, wavelength couplers and filters designed into the board copper, layout techniques and strategies, optimum component placement, critical routing and circuit isolation, proper grounding, mismatched loads, signal splitters, tuning transmission lines, power bus and decoupling for RF circuits. Other highlights include PCB stackups for RF circuits, shields and shielding, RF PCB base material properties, choosing RF base materials, RF PCB fabrication, and RF PCB assembly.

Tuesday-Thursday Courses



010--Bottom up RF Design: From Layout to Schematic

Speaker: John Cecera, Intercept Technology Inc.

Attendees: PCB designers, design managers and design engineers.

Most PCB designers are accustomed to using the schematic to drive the physical layout process. But in today's RF design environment there are still times when you may need to drive your design process from the board layout to schematic. This presentation will address the "bottom up" design process of creating a schematic from your physical layout.



011--Parallel Design Techniques

Speaker: Charles Pfeil, Mentor Graphics

Attendees: PCB designers, design managers and layout technicians

This course will focus on methods for applying parallel design techniques to layout, autorouting, integration, circuit and board design, and system design. Unlike the "divide and conquer" methods that break down a design into pieces and operate on them independently, the parallel design process allows multiple designers to work on the same design simultaneously without partitioning the design in any manner, logical or otherwise. The problems associated with partition boundaries and managing the data integrity during split-and-join operations are eliminated. By applying multiple designers on the same design in a parallel fashion without restrictions, the total time for completing the design can be greatly reduced. Each design has an associated design team and the members of the team are given access permission to the design data.



012--Aligning Design and Supply Chains

Speaker: Ken Stanvick, Design Associates

Attendees: Anyone interested in learning mere about aligning your design chain with your supply chain.

Supplier and component selection for new product development must be, by necessity, a multi-discipline endeavor. Not only are manufacturing and procurement (and often design itself) outsourced, but increased global competition is driving shorter product lifecycles, which in turn drives still shorter component lifecycles, as well as a broader variety of potential solutions for any given design problem. Not only is the old "throw it over the wall" approach no longer a successful or even viable strategy, but collaboration outside your company's walls is a must. Ignoring or avoiding this drives greatly increased supply chain risk. This lecture will show you how to cut your time-to-market while reducing downstream product risk with nine effective, and proven, business processes that together will align your design chain with your supply chain, and ensure that both reflect and support your company's product strategy.



013--Implementing Large FPGAs

Speaker: Lisa Hamaker, Mentor Graphics

Attendees: Anyone interested in a more efficient process for using FPGAs in a board design.

Many large FPGAs now have in excess of 1,000 pins, making it difficult or impossible to put a graphical symbol of the whole part on one page era schematic. Even if the part could fit on one page, it would be difficult to understand the design flow because of the large number of connections. Pre-built FPGA symbols, in addition to being large, have the disadvantage of not containing any design- specific pin names. To address these issues, designers would like to swap pins on the FPGA to optimize the layout. However, once pins are swapped, the schematic, original symbols, and FPGA layout need to be updated, if these changes are handled manually, it can be a tedious and error-prone process to update the data. In this class, you will learn how you can automatically generate design-specific symbols from your FPGA layout information. In addition, you will learn how to take advantage of pin swapping on large FPGAs so that you can optimize board routing. We also will demonstrate how you can update your design data automatically, reducing errors and saving design time.



014--Improving EMS Efficiency

Speaker: Doug Voiland, Milford Manufacturing Services

Attendees: Anyone interested in streamlining their company's manufacturing process.

The introduction of efficiencies into today's decentralized electronics manufacturing chain can have significant cost-saving implications for EMS providers. Attendees will learn how to streamline the manufacturing process to help tighten production cycles, as well as how to utilize information technology for online remote view and management of line operations, production simulation, supply chain and schedule management. Highlights also include "outsourcing without outsourcing."



020--Insertion and Return Loss: The Universal Performance Metrics for all Interconnects

Speaker: Eric Bogatin, Synergatix

Attendees: All engineers and designers wishing to advance their skills.

If you have ever encountered the terms "insertion loss" and "return loss" and you really want to understand them, this course is for you. Interconnects--the IC packages, the circuit board traces and the connectors between boards--are no longer transparent to signals. But how can we know if a component--a package, a backplane channel, a connector, or even a test socket --is going to work in the system? How do we take their electrical performance into account without a detailed, time-consuming, expensive, system-level simulation? Two new metrics are gaining acceptance for characterizing the performance of any interconnect component based on how sine wave signals interact with it: insertion loss and return loss. This half-day course will explain these terms, how they are measured, and what you can deduce about the performance of a component from a glance at these two entities. We will look at several examples of the insertion and return loss of interconnect structures. These metrics are not perfect; some underlying assumptions may not always apply. We also will touch on some of the potential minefields to watch for.



021-Partitioning and Layout of a Mixed-Signal PCB

Speaker: Henry W. Ott, Henry Ott Consultants

Attendees: PCB designers and design engineers who are involved with the layout of mixed-signal PCBs.

Preventing digital logic ground currents from contaminating low-level analog signals on a mixed-signal PCB can be a difficult problem. This is especially true on boards with multiple ADCs. Many people suggest splitting the ground plane in order to isolate the digital ground from the analog ground. Although the split-plane approach can be made to work, it has many potential problems. The pitfalls and benefits of splitting ground planes are examined in this half-day seminar. This presentation demonstrates that component placement, partitioning, and proper PCB topology, combined with routing discipline, are the keys to success in laying out a mixed-signal PCB. By understanding how and where high-frequency ground currents flow, and by using some basic EMC principles, we will develop a way to control these currents while still maintaining a single contiguous ground plane.



022--Life Cycle Assessment of Lead-Free Solder

Speaker: Maria Lest Socolof, University of Tennessee

Attendees: Anyone interested in implementing a life cycle assessment of lead-free solders.

Ready or not, lead-free solders are poised to become the primary solders used in exported electronics within a decade. But what effects will these new solders have on your assembly processes, end-of-life reclamation and recycling efforts? This course will review the fundamentals of environmental life cycle assessment (LCA) and present the uses, benefits and limitations of LCA for comparing alternative solders. Details of collecting life cycle inventory data and conducting environmental life cycle impact analyses will be demonstrated through a case study of the EPA's voluntary Design for the Environment Lead-Free Solder Partnership. This program--a partnership with the University of Tennessee Center for Clean Products and Clean Technologies and several industry partners--uses a life cycle assessment approach to examine the environmental impacts of tin-lead, tin-copper, tin-silver-copper, and tin-silver-copper-bismuth solders. This course also will look at the regulatory context driving much of the conversion to lead-free solders within the electronics industry.



023--Let's Get Smaller, Better and Cheaper: CSP, Flip Chip and 3D Technologies

Speaker: William Greig, Greig Associates

Attendees: Anyone involved in electronic/microelectronic assembly and packaging, including direct and indirect support personnel.

This course is provides an overview of those enabling technologies that address requirements for "smaller, better and cheaper" end-products. Attendees will discuss packaging technologies that address miniaturization, including chip scale, flip chip and 3D. This half-day course will focus on the latest developments in the assembly of active components. Technical issues and reliability concerns will be presented where appropriate. The course will highlight the current status of each of the technologies, and discuss compatibility with current and future IC requirements, as well as end-product size, performance and cost objectives.



024--Transmission Lines: Theory, Simulation and Control

Speaker: Doug Brooks, UltraCAD

Attendees. Engineers, PCB designers, layout technicians and others.

Signals propagating down traces reflect, and reflections cause distortions that can lead to serious logic errors. This course will cover why this is so and what can be done about it. Reflections can be controlled if our traces look like transmission lines. Transmission line theory will be discussed, and then the results from a commercially available simulation tool will be presented to show what reflection noise looks and how it can be controlled. PCB design requirements for controlling transmission line impedance will be covered, as will various termination techniques and values. The attendee will leave this course with a good understanding of proper PCB design techniques.



025--Flexible Printed Circuit Technology: Characteristics and Applications

Speaker: Tom Stearns, Brander International Consultants

Attendees: Anyone interested in learning more about flex technology and implementation.

Flexible printed circuitry (FPC) provides cost-effective solutions to a wide range of electronic packaging problems. FPC has the design versatility and application flexibility that is needed to reduce assembly cost while improving reliability and performance. Long regarded as an expensive curiosity found only in military or space applications, FPC has matured over the past 10 years and is now the preferred interconnector for high volume, high density electronics. This practical-oriented half-day course will walk attendees through the basics of FPC materials and fabrication methods, their impact on design and the cost-performance tradeoffs that are needed to get the greatest benefit from FPC. The course assumes no starting knowledge and is aimed at engineers, managers and support functions involved in the design, procurement or application of FPC.



030--Dipoles for Dummies

Speaker: Henry W. Ott, Henry Ott Consultants

Attendees: PCB designers, engineers (electrical or mechanical), and anyone else who wants to learn about dipole antennas and common-mode radiation. No specialized background required.

This two-hour workshop is a simple, insightful and intuitive discussion of how a dipole antenna operates, and how this relates to the common-mode radiation from a product. All of this will be accomplished without using any mathematics or writing a single equation. Once antenna theory is understood, controlling or eliminating common-mode radiation becomes a much easier task. If you would like to understand how antennas radiate, but lack the time to study the intimidating mathematics associated with electromagnetic field theory, this workshop is for you. Attendees will gain an understanding of antenna theory, and know why antenna theory is so important to EMC engineering.



031--Impedance Analysis and Specifications

Speaker: Happy Holden, Westwood Associates

Attendees: PCB engineers, designers, managers and others.

The need for higher information throughput and speed has promoted the increasing use of controlled impedance multilayers. This two-hour workshop is an introduction to controlled impedance. It will explain in simple terms why controlled impedance is required. The various equations will be presented, as well as numerical solutions and field solvers. These will be compared with "as-measured" TDR readings. Resources for impedance analysis on the World Wide Web will be detailed and the variability of impedance due to manufacturing tolerances will be explained. Finally, how controlled impedance should be documented on fabrication drawing will be illustrated.



032--Best Practices in Implementing Lead-Free Assembly, Part I

Speaker: Ron Lasky, Indium Corp,

Attendees: Anyone interested in learning how to implement a lead-free assembly process.

This may be the only workshop that focuses on the "how to" of implementing lead-free at a factory. It covers all of the relevant issues: PCB finishes, components, alloys and SMT processes. It also reviews actual implementations of lead-free assembly processes by Motorola and Hewlett-Packard. The workshop will finish with a section on establishing your lead-free implementation plan. This course, Part I, includes a review of current legislation and practices in lead-free electronics assembly. We'll review the current alloys in use and why and how they were selected, as well as PCB finishes for lead-free assembly and component concerns in lead-free assembly. This is a complete class that can be taken with or without Part II on Wednesday afternoon.



040--Design Optimization of Single-Ended and Differential Impedance PCB Transmission Lines

Speaker: Gary Briar, Intel Corp.

Attendees: System and hardware engineers, PCB designers, managers and others.

This course will describe the effects of PCB material imperfections and PCB fabrication tolerances on localized impedance control and frequency dependent loss. Electrical material properties such as the effective Er variation due to design and material selection will be reviewed, and the interaction of trace spacing and fiberglass cloth weave on differential to common-mode conversion will be discussed in detail, along with the impact of copper foil and copper surface preparation on transmission fine design. Additionally, the fabrication tolerances will be reviewed including supplier-supplier and lot-lot variation, sources of variation, and techniques for minimizing the variation across suppliers.



041--A Non-Threatening Introduction to FPGAs for PCB Guys and Gals

Speaker: Clive "Max" Maxfield, TechBites Interactive

Attendees: Anyone interested in learning more about FPGAs.

Most non-design engineering folks tend to think of FPGAs as being relatively simple devices containing large numbers of "islands" of simple programmable logic blocks surrounded by a "sea" of programmable interconnect. In reality, however, the complexity of these devices has increased dramatically over recent years. Modern FPGAs can feature one or more soft or hard embedded processors, high-speed (gigabit) serial interfaces, and the list goes on. In fact, around the beginning of 2004, Xilinx announced a new FPGA containing more than 1 billion transistors. Based on Maxfield's book "The Design Warrior's Guide to FPGAs," the course will consider a generic architecture and talk about the various underlying technologies such as antifuse vs. SRAM-based components. In addition to considering the latest and greatest FPGA design tool and design flow concepts, we'll also take a peak at topics ranging from virtual prototyping to formal verification, and we'll plunge just deep enough into subjects like gigabit serial interfaces to make us dangerous.



042--Best Practices in Implementing Lead-Free Assembly, Part II

Speaker: Ron Lasky, Indium Corp.

Attendees: Anyone interested in learning how to implement a lead-free assembly process.

In this half-day seminar, you will learn the best practices in SMT processes for lead-free assembly, printing, placement, reflow and wave soldering. Case studies will be reviewed, including a Motorola study on implementing a lead-free process to assemble 9 million cell phones, and a Hewlett-Packard study on large board implementation. You will also learn how to establish your company's lead-free implementation plan. This is a complete class that can be taken with or without Part I on Wednesday morning.



043--Embedded Passives Workshop

Speaker: Richard Snogren, Coretec Inc.

Attendees: All engineers and designers wishing to advance their skills and capabilities to include designing embedded resistors and capacitors.

This is a practical workshop on how to implement embedded passives today. This course presents the state-of-the-art of embedded passive resistor and capacitor materials and processes with associated guidelines to enable designers to implement embedded passives now. It includes specific techniques and design guidelines for designing resistors and capacitors directly into multilayer boards using the currently available embedded passive material sets.



050--The Fundamentals of Design for Test

Speaker: Gary Ferrari, Ferrari Technical Services

Attendees: PCB designers, design managers, layout technicians and others.

The term "DFT" (i.e., design for test) has a different meaning depending on whether you are dealing with a bare printed board, a final assembly, or a board in the field. This course will help you define DFT issues as they relate to design and cost in the fabrication and assembly processes. The discussions will focus on fabrication and assembly issues that affect the design of a product. Some of the materials presented in this course will utilize existing and/or proposed IPC standards. These "snapshots" will fortify the discussion, as well as provide you with guidelines for applying IPC standards to your designs in order to more easily produce cost-effective, right-the-first-time PCBs.



051--Differential Traces and Impedance

Speaker: Doug Brooks, UltraCAD

Attendees: Engineers, designers end layout technicians seeking a better understanding of differential traces and impedance.

Many people are confused over the terms even mode and odd mode, and differential and common mode, and when they apply or even if they apply, in this two-hour workshop, we will look at the difference between single-ended and differential signaling, and between what are conventionally called differential- and common-mode signals. Common mode will be defined in a manner that is easy to understand. Then we will look at why common-mode signals are usually a "bad" thing. We will look at the advantages of using differential signaling, what design rules apply for differential traces and when they apply, and when and how differential impedance comes into play. Several simulation and calculational tools will be used to illustrate these concepts.



052--The Real Cost of Lead-Free SMT Manufacturing

Speaker: Phil Zarrow, ITM Inc.

Attendees: PCB designers, design engineers, process engineers, quality engineers and management who wish to become comfortable with lead-free SMT assembly.

The drive towards lead-free electronic assembly is inevitable. But this ecologically "greener" material change comes at a price. Lead-free assembly brings myriad equipment, material and process implications. This course will give the attendee an in-depth understanding of SMT assembly with lead-free solder alloys. Various aspects of no-lead solder will be examined--including what's driving lead-free electronics manufacturing, as well as what lead-free alloys are being considered and by whom. The pros and cons of candidate solder alloys will be discussed and put into an applications-specific perspective. The second part of the course will contend with the implications of lead-free on the SMT assembly process. Interactions with substrate finishes and components will be discussed, along with the far-reaching implications and process adaptations necessary to accommodate no-lead soldering. The impact upon printing, placement, reflow and inspection will be examined, as well as the adaptations that will have to be made by the purchasing, quality assurance and product development groups. Situations confronted by OEMs and CEMs using lead-free processes will also be examined.



053--Basic Basic: Enhancing Your Design Tool With Visual Basic

Speaker: Bruce Fihe, Premier Technology Training

Attendees: PCB designers, design engineers, technicians and others.

Tap into one of the most powerful features of your PCB design tools: writing and adding Visual Basic scripts. This course will cover the fundamentals of Visual Basic programming and demonstrate the construction of a reasonably complex program in a series of easy-to-understand steps. Attendees will be able to take these concepts back to their jobs and create software solutions for some of their design tasks. This course is intended for designers with little or no programming experience. Attendees will be introduced to the fundamentals of programming and how to extract data from a PCB design database to use in their programs. Participants will receive a Web link to download all program source code covered during this course.



060--Predictive Analysis for Through-Hole to HDI Conversion

Speaker: Gary Ferrari, Ferrari Technical Services

Attendees: PCB designers and design managers.

Often designers are faced with the challenge of estimating how many conductive layers a particular board design will require. How many times have we run out of routing channels only to have to add an additional layer pair? We use past experience to come up with an estimate, but it's still only an estimate. The situation worsens if we have to continue adding layer pairs until the design is complete and a complete disaster if we have to resort to HDI at the end to complete the project. This session looks at variables that are analyzed to predict routing requirements of a design as well as alternative HDI structures. Design rules, performance gains and cost comparisons are the highlights of this session. You'll gain a clear understanding of the critical identifiers that lead you to an HDI design that is a cost-effective alternative to adding additional layers to a current through-hole design.



061--Technical Roadmap of HDI: Flexible Substrates in Portable Electronics

Speaker: Dominique Numakura

Attendees: PCB designers, design managers and anyone with an interest in the future direction of HDI with flexible substrates.

The extreme miniaturization of portable electronics such as cellular phones and digital cameras demands the use of high-density flexible circuits as the means of packaging. This seminar will focus on the trends of high-density interconnects with flexible substrates for the packaging of modern portable electronics, as well as the future direction of the technology. Many new termination technologies are now being used for flexible circuits in modern portable electronics. Attendees will learn about permanent termination technologies including microsoldering with lead-free solder, wire bonding, direct bonding of the flying leads, flip-chip mounting, anisotropic conductive materials and more. Non-permanent termination technologies such as microbump arrays with gold plating, dimple arrays, small pitch connectors and pair connectors will also be covered. The advantages and disadvantages of these termination technologies will be highlighted and the direction of future applications will be discussed.



062--Thermal Management of High Current in Printed Circuits

Speaker: Mike Jouppi, Thermal Man

Attendees: Senior designers, design engineers, PCB designers and purchasing managers.

Applying high current in copper planes and managing the "Swiss cheese" effect is an age-old problem. This workshop will provide solutions and techniques for determining current carrying capacity in traces, vias and copper planes. Attendees will learn to use these techniques--the result of the efforts of key players within IPC Task Group 1-10b--to determine the voltage field in odd-shaped trace geometries, copper planes and vias. The voltage fields are then used to determine the power (watts) dissipated in each segment of those planes, traces and vias. Attendees will discover how to use this wattage to determine the temperatures resulting from the current applied in their PCB applications, as well as how to take advantage of new tools that allow designs to be evaluated at a level not possible in the past.



063--Designing With Embedded Passives

Speaker: Rick Hartley, L-3 Communication, Avionics Systems

Attendees: PCB designers, design engineers, systems engineers, technicians and managers interested in learning how to design PCBs with embedded resistors and capacitors.

Many seminars discuss the basics of embedded technology, but how to design with embedded passives has not been covered well, especially for CAD systems not designed to work with components on inner layers. This course will discuss practical, easy-to-use information for designing PCBs with embedded devices, using any CAD system. Attendees will begin with the basics on how embedded passives are produced (both additive and subtractive processes), some seldom discussed advantages, when to use and when not to use embedded passives, realistic tolerances, calculating values and basic design flow. Highlights will include handling embedded devices in the schematic, designing the device footprint, placement and routing of embedded passives, balancing the PCB, design rule checking and CAD output file generation and documentation.


GARY BRIST is staff PCB technologist, working within the Materials Organization of Intel Corp. He received a BSEE from Montana State University (1990) and his MSEE from Purdue [1992). Prior to joining Intel, Brist held various engineering and engineering management positions within the PCB fabrication industry. E-mail:

DR. ERIC BOGATIN is CTO of Synergetix. He has been active in the signal integrity and interconnect design field for over 25 years, and he spent years working at AT&T Bell Labs, Raychem Corp, Sun Microsystems and Ansoft. Bogatin has published over 150 papers and four books on signal integrity, including the recently published "Signal Integrity--Simplified." He also writes the "No Myths Allowed" column for Printed Circuit Design & Manufacture magazine, and is a member of that magazine's Editorial Review Board. E-mail:

DOUGLAS BROOKS has a BSEE and MSEE from Stanford University and a Ph.D. from the University of Washington. During his career he has held positions in engineering, marketing and general management with such companies as Hughes Aircraft, Texas Instruments and ELDEC. In 1992 he formed UltraCAD Design Inc., a service bureau in Bellevue, WA, that specializes in large complex, high-density, high speed designs, primarily in the video and dale processing industries. Brooks has written numerous articles, including articles and a column for Printed Circuit Design magazine, and has been a frequent speaker at various conferences. He is the author of "Signal Integrity Issues and Printed Circuit Board Design." Email:

JOHN M. CECERE, global account manager for Intercept Technology, has been involved in printed circuit board and hybrid design for ever 25 years. Throughout his career, he has worked in EDA training, EDA application technical and environmental support, miniaturization, electronic packaging and project management Email:

GARY FERRARI is the owner of Ferrari Technical Services, a consulting firm specializing in technical support and customized training. He is the past the executive director and cofounder of the IPC Designers Council. He has more than 38 years of experience in electronic packaging with an emphasis on PWB design and manufacturing. Ferrari has chaired a number of IPC technical committees, written numerous technical articles, and provided design for manufacture consulting services to the industry. Ferrari received the IPC "President's Award" in 1990, which recognized his contributions to the electronic interconnection industry and the association. E-mail:

BRUCE FIHE has ever 35 years of experience in the electronics industry. For the last 18 years he has focused on printed circuit design and design automation. He received his initial electronics training whoa serving in the Navy as an Aviation Electronics Technician. He then worked for several Silicon Valley companies and several EDA companies, including Personal CAD Systems [P-CAD] CAB Solutions ACCEL Technologies, and PADS/Innoveda. With his transition into EDA, he became even more involved in training, creating and delivering some of the very first courses using desktop EDA tools. He is currently CEO of Premier Technology Training, a company specializing in skills and tools training for PCB design professionals throughout North America E-mail:

MICHAEL FITTS is product marketing manager for layout products at Mentor Graphics. He has been involved in the design of HDI substrates since 1992. Since 1995, he has been lecturing to and consulting with OEMS, users groups and CAD companies on advanced technology end design. He is a regular speaker at numerous conferences worldwide and has written technical articles for various publications on advanced technology Fitts was formerly president of The Solution Fitts Inc., an electronic engineering consulting firm located near Boulder, CO. E-mail:

WILLIAM GREIG, owner of Greig Associates, has been an independent consultant for 13 years. He previously walked for RICA Semiconductor, General Electric Reentry Systems, Lockheed Electronics and NASA. His experience covers both front-end and back end semiconductor manufacturing, and hybrid circuit (ceramic) and printed wiring board (organic] substrate manufacturing and component parts assembly. Greig specializes in advanced microelectronic packaging, assembly and reliability including HDI interconnects (MSMs, PWBs), and chip-on-board assembly technology (chip and wire, flip chip, chip-scale packaging). He holds six U.S. patents and has published extensively. Greig is a member of SMTA and IMAPS and is the president of the Garden State Chapter and a Society Fellow. Email:

LISA HAMAKER is a product manager at Mentor Graphics, where she is responsible for working with ViewDraw and the other DxDesigner customers. She has been involved in the EDA industry since 1990 and in the electronics world since 1978. Hamaker worked with PSpice at MicroSim and also with design definition products at PADS and Innoveda. She began her career as an electronic design engineer working an systems integration and motherboards and in the early 1980s was involved in implementing a Mentor workstation for her group Email:

ROBERT HANSON, MSEE, is president of AmeriCom Test and BMT Technology Inc. As a digital design engineer at Boeing, Rockwell, Honeywell and Loral, Hanson designed and provided prototype operational analysis on many high-speed designs, including PCBs, for the AWACS, B1-B, 747-400, missiles and ground support test equipment. He currently teaches high-speed digital design courses throughout the United States, Europe and Asia Email:

RICK HARTLEY is a senior design engineer and PCB specialist at L-3 Communication, Avionics Systems. His background is in the design of printed circuits for computers aircraft avionics and telecommunications. Rick has 39 years of experience in the electronics industry and has dedicated the past 79 years to PCB and circuit development with emphasis on control of signal integrity and control of EMI, in both digital and RF PCBs. He is a past member of the Editorial Review Board of Printed Circuit Design magazine. Email:

LEE HILL is an EMC consultant with 15 years of experience in the design and retrofit of complex electronic systems. He is a founding partner of Silent Solutions, a private consulting firm established in 1992 that specializes in design for EMC, EMC troubleshooting, RF design, and training in the computer, telecommunications, industrial scientific and automotive industries. Previously, Hill was principal EMC and systems engineer at Digital Equipment Corporation's Workstation Systems Engineering Group in Palo Alto, CA. Hill received a M.S. in electrical engineering and electromagnetics with highest honors from the University of Missouri-Rolla (UMR) in 1994. He holds on U.S. patent for EMI control in portable electronics. Hill consults and teaches nationwide E-mail:

HAPPY HOLDEN is the manager of Advanced Technology for Westwood Associates. Westwood is the sales and engineering arm for N. and S. America and Europe for NanYa PCB of Taiwan and China. He is responsible for next-generation printed circuit manufacturing strategies, advanced design tools, packaging systems and competitive analysis. Prior to joining Westwood, Holden was a senior consultant at TechLead Corp. and Merix. He retired from Hewlett-Packard after over 28 years in 1935. Holden holds a B.S. from Oregon State University in chemical engineering and an M.S. in computer science. He has published over 80 technical papers and contributed to three books Email:

MIKE JOUPPI is president of Thermal Man Inc. He has 22 years of experience as a mechanical engineer and specializes in electronics thermal management His company has developed a database containing trace-heating information in circuit boards. Jouppi is chairman of IPC Task Group 1-10b, which is creating a new standard for current carrying capacity in printed circuits. Since 1993, he has been personally involved with performing testing and thermal analysis that is being used to characterize the temperature response of current applied to conductors in printed circuits Email:

DR. RON LASKY is a senior technologist at Indium Corp. and a visiting professor at Dartmouth College. Prior to these assignments, he had over 20 years of experience in electronic and optoelectronic packaging at IBM, Universal Instruments add Cookson Electronics. Lasky holds numerous patent disclosures and is the developer of the several new concepts in SMT processing software related to cost estimating, line balancing and process optimization. He has four college degrees, including a Ph.D. in materials science from Cornell University. Lasky is the recipient of the 2003 SMTA Founder's Award. Email:

CLIVE "MAX" MAXFIELD is founder of TechBites Interactive, a marketing consultancy firm specializing in high-tech, and co-editor/co-publisher of the online electronics and computing hobbyist magazine EPE Online. In addition to writing numerous magazine articles, Maxfield is the author of several books, including "Bebop to the Boolean Boogie (An Unconventional Guide to Electronics)" and "The Design Warrior's Guide to FPBAs." He was once referred to as a "semiconductor design expert" by someone famous who wasn't prompted, coerced, or remunerated in any way. Maxfield has a bachelor's degree in control engineering from Sheffield Polytechnic (now Sheffield Hallam University), England.. Email:

DOMINIQUE NUMAKURA is founder and president of DKN Research, and publisher of EPT Newsletter. He is a 25-year veteran of the PCB and packaging material industries Numakura has spent much of the last decade developing advanced technologies for high-density substrates and materials. He has written more than 80 articles for major conferences and magazines, and has authored several books on electronics packaging technologies. Numakura has a master's degree in physical chemistry and nuclear chemistry. Email:

HENRY W. OTT is president and principal consultant of Henry Ott Consultants, an EMC training and consulting firm. He is the author of the popular EMC technical book "Noise Reduction Techniques in Electronic Systems," which has been published in Japanese, Russian, Bulgarian, Polish, Italian and Chinese. He has over 30 years of experience in the field of EMC. Prior to starting his own company, Ott worked at AT&T Beg Laboratories for 30 years, where he was a Distinguished Member of the technical staff. He is a Life Fellow of the IEEE, and an Honorary Life Member of the IEEE EMC Society. Ott holds a BSEE from New Jersey Institute of Technology and an MSEE from New York University. Email:

CHARLES PFEIL is product marketing director for the Systems Design Division of Mentor Graphics. He has worked in the PCB industry since 1966, as a designer, service bureau owner and marketing and/or engineering manager at the following companies: Racal Redac, ASI, Cadence Design Systems, Intergraph, VeriBest, PADS and Mentor. Along with a focus on PCB layout, he has been involved in the specification and development of autorouters at each of these companies. Email:

RICHARD SNOGREN has a B.S. in chemistry and biology and over 35 years of experience in engineering and management. During that period, he developed and patented ablative materials for military and aerospace use; authored numerous papers and articles on structural and dielectric materials for electronic applications; and wrote a compressive technical book entitled "Handbook of Surface Preparation for Adhesion." Snogren has authored numerous papers and conducted many workshops on embedded passive technology. Snogren was cofounder and president of SAS Circuits (now Coretec Denver), a supplier to the aerospace and defense sectors of the PCB industry. Currently, he is senior staff engineer for Coretec Inc., an interconnection manufacturing service (IMS) provider. His responsibilities include implementation of embedded passives and high reliability aerospace product development. E-mail:

MARIA LEET SOCOLOF is a senior research associate at the University of Tennessee's Center for Clean Products and Clean Technologies, where her work focuses on environmental life-cycle assessment and evaluating alternative technologies for their environmental impacts. As a principal investigator and project manager, she leads environmental life-cycle assessments and works in the areas of design for environment, cleaner production, pollution prevention, industrial ecology, human health risk assessment and exposure assessment. Socolof has 16 years of experience in the environmental field. She holds a BA cum laude in human ecology/environmental studies from Connecticut College and an MS in environmental health management from the Harvard School of Public Health. Email:

KEN STANVICK is a senior vice president at Design Chain Associates. He has over 25 years of experience in high tech electronics He has served as a design engineer, group manager quality assurance manager and independent consultant at companies such as Western Electric, Raytheon, Digital Equipment and Compaq. He is qualified in all aspects of design and supply chains, with thorough knowledge of best practices, processes and requirements of design, systems manufacturing, test, quality and reliability engineering Email:

THOMAS H STEARNS is the president of Brander International Consultants, a 10-year old Nashua, NH firm specializing in electronic interconnections technology, including design, materials and methods of fabrication used. He previously designed and developed connectors and flex circuit products for Miraco Inc, InterFlex Corp., Lockheed-Sanders Interconnect Products and the Raytheon Co., among others. A noted engineer and inventor in the field of Flexible and rigid-flex circuitry, Stearns is the innovator of rigid-flex manufacturing techniques, controlled impedance flex circuits, specialized flex circuit connectors and materials systems. He has written more than 25 technical articles for trade publications, as well as the 1996 McGraw-Hill textbook "Flexible Printed Circuitry." Stearns has taught at Humorous conferences. E-mail:

DOUG VOILAND is vice president and general manager of Milford Manufacturing Services, responsible for managing the day-to-day operations of the organization. During his more than 15 years in public accounting Voiland has worked with numerous mid-market business owners, providing transactional advice, as well as helping them solve their most complex business and financial problems. Voiland is also the founder of Abacus Associates, a firm providing contract operations, financial and sales management services to a variety of early stage and mid-sized companies. He is a graduate of Suffolk University and a CPA. Email

PHIL ZARROW has been involved with hybrid and PCB assembly for more than 26 years. In addition to his background in automated assembly and cleaning, he co-authored "The SMT Glossary Terms and Definitions" and is currently writing a book on sMT manufacturing. Zarrow is a member of SMTA, IPC and IMAPS, and is founder and president of ITM Consulting and a past officer and national director of the Surface Mount Technology Association (SMTA). He has served on the editorial board for Circuits Assembly. E-mail:

Headquarters Hotel

RADISSON HOTEL MANCHESTER 700 Elm Street Manchester, NH 03101 Tel: 603-625-1000 Fax: 603-625-4595 Single/double: $139 *

* To reserve your room at the special rate of $139, you must call the hotel directly (603-625-1000) and identify yourself as being with PCB East. The group rate cutoff deadline is September 11, 2004.

The Radisson Hotel Manchester is known for its hospitality, graciousness, and friendly, personal service. Hotel amenities include: 250 newly remodeled guest rooms and suites, wi-fi high-speed Internet access throughout the hotel, an executive business center, a specialty gift shop, a health club with indoor pool, whirlpool and saunas, and two restaurants--JD's Tavern and Cafe on the Park. Parking: $1 per day

Exhibition Center

The PCB East 2004 exhibition will be held in The Armory at the Radisson Hotel Manchester. The address is the same as shown above for the hotel. Parking is $1 per day.


Car Rental Information

AVIS is the official rental agency for PCB East. Call 800-331-1600 or go online at to rent a car. Refer to AVIS Worldwide Discount (AWD) #D900888 when making your reservation in order to receive a special conference rate.

Other Transportation

The Radisson Hotel Manchester is located 5 miles from Manchester Airport and approximately 1 hour from Logan International Airport in Boston. Complimentary shuttle service is available from the Manchester Airport. Use the courtesy phone in the Manchester Airport baggage claim area to let the operator know you need transportation.

Driving Directions


Take route 93 North to route 293 North (left hand exit off route 93). After the Brown Avenue exit, stay to the right, as route 293 bears right. Stay on route 293 to the second exit (Exit #5 Granite Street). Take Exit #5 Granite Street and turn right off the exit ramp. Go through two sets of lights. The Radisson Hotel garage will be on your left.


Take route 95 North to New Haven, then route 91 North to Hartford. From Hartford, take route 84 to route 90 (Mass Pike).Take Mass Pike to route 290 (Worcester) to route 495 (Lowell) to route 3N (Nashua). Stay on route 3 following the signs to Manchester. Just sourth of Manchester, route 3 becomes route 293 North. Take exit #5 Granite Steet. Turn right at the end of the exit ramp. Go through two sets of tights. The Radisson Hotel garage will be on your left.

For additional driving directions and a map, visit or utilize

Registration Package Information

After you look through the list of Professional Development and Technical Conference courses on pages 6-11, you'll need to decide which registration package best fits your needs and your budget. You'll also have to register for specific courses.

To help you make this decision, each package is described in detail below. For pricing, see the Registration Form on page 15. If you have questions about our packages, discounts or policies, please contact the Registration Desk at 1-918-496-1476.

Professional Development Packages

* One-Day Tutorial--includes a one-day tutorial, plus admission to the PCB Technology Forum (if taking a Monday tutorial), two-day Exhibition, Keynote Address, Opening Night Reception, and Brew-ha-ha Party and Giveaway. See page 15 for pricing. Alumni and Association/User Group discounts do not apply for this package.

* Two-Day DEC--Includes a two-day Design Excellence Curriculum course, plus admission to the PCB Technology Forum, two-day Exhibition, Keynote Address, Opening Night Reception, and Brew-ha-ha Party and Giveaway. See page 15 for pricing. Alumni and Association/User Group discounts do not apply for this package.

Technical Conference Packages

* One-Day Technical Conference--Includes one morning session and one afternoon session during the Tuesday through Thursday Technical Conference, plus admission to the two-day Exhibition, Keynote Address, Opening Night Reception, and Brew-ha-ha Party and Giveaway. See page 15 for pricing.

* Full Technical Conference--Includes your choice of sessions during the Tuesday through Thursday Technical Conference, plus admission to the two-day Exhibition, Keynote Address, Opening Night Reception, and Brew-ha-ha Party and Giveaway. See page 15 for pricing.

Special Value Packages

* Lecture and Workshop Package (our must affordable package)--Includes any three morning sessions during the Tuesday through Thursday Technical Conference, plus admission to the two-day Exhibition, Keynote Address, Opening Night Reception, and Brew-ha-ha Party and Giveaway. See page 15 for pricing. Early Bird, Alumni and Association/User Group discounts do not apply for this package.

* 4-Day Special (a terrific value for your money)--Includes any combination of Professional Development courses and Technical Conference sessions taken four days in a row (choose from Monday through Thursday or Tuesday through Friday), plus admission to the two-day Exhibition, Keynote Address, Opening Night Reception, and Brew-ha-ha Party and Giveaway. See page 15 for pricing.

* 5-Day Special (the most bang for your buck and our best value)--Includes any combination of Professional Development courses and Technical Conference sessions--you decide--plus admission to the PCB Technology Forum, two-day Exhibition, Keynote Address, Opening Night Reception, and Brew-ha-ha Party and Giveaway. See page 15 for pricing.


PCB East 2004 is pleased to offer the following discounts to qualifying attendees. See the Registration Packages listed on this page for discount restrictions.

Early Bird Discount--Anyone who registers by September 10 for the Registration Packages shown at left (except for the Lecture and Workshop Package) will receive $100 off regular tuition pricing.

Alumni Discount--Alumni of a previous PCB Design Conference (West, East or Road Series) are eligible for a discount of $50 US off conference tuition, depending on the package selection.

Association/User Group Discount--A member of IPC Designers Council and/or another recognized industry user group is eligible for a discount of $50 US off conference tuition, depending on the package selection.

Group Discount--Register 4 attendees and the 5th registration is FREE. The free package must be of equal or lesser value than the least expensive paid package. All five registration forms must be received together. Please note: group discounts are not available through online registration. Call 918-496-1470 for more information.

Registration Instructions

Registration--Complete one Registration Form for each registrant. All 5 sections must be completed.

Payment--Payment must be made by credit card, check or U.S. government Purchase Order. Registrations without complete payment information will not be processed. If paying by PO, please include a $25 US processing fee per PO number in addition to the registration fee. PO payment must be received in full prior to the show for your registration to be processed. For more information about our payment policies, call 918-496-1476.

Refunds and Cancellations--All refund requests must be made in writing by fax or mail to PCB Design Conference East no later than Sept. 13, 2004. Mail refund requests to: PCB East, Attn. AS, 2018 Powers Ferry Road, Suite 600, Atlanta, GA 30339. Fax to 678589-8850 or e-mail your request to "No shows" who have not made a written request by Sept. 13, 2004, are fully liable for conference tuition/fees.

Program Changes--The technical program of PCB Design Conference East is subject to change should unforeseeable circumstances arise with respect to individual speakers. Check the PCB East Web site for the latest updates on sessions and speakers.

ADA Accommodations--If you require special accommodations as outlined under the ADA, please contact Alyson Skarbek, Show Operations Manager, at 678-589-8865 by Sept. 13, 2004.
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Title Annotation:2004 Conference Brochure
Publication:Printed Circuit Design & Manufacture
Geographic Code:1USA
Date:Jul 1, 2004
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