Printer Friendly

Materials, processes, integration and reliability in advanced interconnects for micro- and nanoelectronics; proceedings.

9781558999503

Materials, processes, integration and reliability in advanced interconnects for micro- and nanoelectronics; proceedings.

Materials, Processes, Integration and Reliability in Advanced Iinterconnects for Micro- and Nanoelectronics Symposium (April 2007, San Franc

Materials Research Society

2007

338 pages

$114.00

Hardcover

Materials Research Society Symposium Proceedings; v.990

TK7874

Proceedings from an international symposium held in San Francisco, California, in April 2007. Fifty-one contributions are organized into sections on dielectric materials, metallization and atomic layer deposition, interconnect reliability and packaging, and novel interconnect concepts and materials. A sampling of topics: formation of porous organosilicate glasses produced by PECVD and UV treatment, requirements and constraints on optimizing UV processing of low-k dielectrics, interface stability of metal barrier and low-k dielectrics, chemical routes to ultra thin films for copper barriers and liners, charging and aging effects in porous ULK dielectrics, influence of interfacial delamination on channel cracking of brittle thin films, assembly of fine-pitch carbon nanotube bundles for electrical interconnect applications, and dielectrophoresis-based assembly and high-frequency characterization of carbon nanotube bundles.

([c]20072005 Book News, Inc., Portland, OR)
COPYRIGHT 2007 Book News, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2007 Gale, Cengage Learning. All rights reserved.

Article Details
Printer friendly Cite/link Email Feedback
Publication:SciTech Book News
Article Type:Brief Article
Date:Dec 1, 2007
Words:175
Previous Article:Management of radionuclide therapy patients.
Next Article:AACN protocols for practice; creating healing environments, 2d ed.


Related Articles
Advanced metallization conference 2004; proceedings.
Materials, Technology and Reliability of Advanced Interconnects: Proceedings.
Advanced Metallization Conference 2005: Proceedings.
Stress-Induced Phenomena in Metallization: Proceedings.
Materials, technology and reliability of low-k dielectrics and copper interconnects; proceedings.
Advanced metallization conference 2006; proceedings.
Innovation in ceramic science and engineering; proceedings.
Research priorities for the electronics industry: the merger of micro and nano, chemical, and other sensors with micro- and nano-electronics could...
Advanced metallization conference 2007; proceedings.
Physics and technology of high-k gate dielectrics; proceedings.

Terms of use | Privacy policy | Copyright © 2020 Farlex, Inc. | Feedback | For webmasters