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1-114 out of 114 article(s)
Title Author Type Date Words
IPC Annual Meeting keynote: avoiding commoditization. Sep 1, 2003 184
Unstable economy challenges fiber optic electronic components industry. Brief Article Sep 1, 2003 238
Study: CEM market grew 1% last year. Brief Article Sep 1, 2003 299
Integrated passives technology and economics: the latest from the recent NEMI roadmap. Dougherty, Joseph P. Sep 1, 2003 2542
The latest in underfill for advanced chip assembly: is a low-cost, surface-mount-compatible process possible? Baldwin, Daniel F. Sep 1, 2003 1755
Product and component traceability: a complete traceability system will minimize the cost of product recalls and help eliminate them in the future. Nelson, John Sep 1, 2003 1956
Depaneling: a study in yield and productivity: saw systems can provide a low stress and fast alternative to hand breaking methods. Duck, Allen Sep 1, 2003 1869
Understanding selective pallet soldering residue: proper heating can eliminate flux concerns. Munson, Terry Sep 1, 2003 624
Push or pull? Hamburg, Lisa Sep 1, 2003 643
The price is right. Hamburg, Lisa Aug 1, 2003 599
Web sites worth mentioning. Brief Article Aug 1, 2003 221
Feinfocus, Palomar collaborate. Brief Article Aug 1, 2003 155
Military/aerospace offers "unique hurdles, timely opportunities" for EMS. Brief Article Aug 1, 2003 227
Beware the jabberwocky: Phil answers some questions that have recently come his way. Zarrow, Phil Aug 1, 2003 964
Rework and repair. Aug 1, 2003 825
Exploring the nanoworld: nanotechnology is one ET that is too small to ignore. Gilleo, Ken Aug 1, 2003 859
Rework with lead-free solders: temperature differences between eutectic and lead-free solders mandate tighter processes, better profiles and precise rework systems. Wood, Paul Aug 1, 2003 2125
Next-generation laser rework: some applications for high-density and lead-free manufacturing process are explored. Wang, Paul P.E. Aug 1, 2003 2361
20/20 foresight: detecting bridges before they occur. Pham-Van-Diep, Gerald C. Aug 1, 2003 2301
Don't overlook the details: how to stop micro-etch disintegration and deal with global standards. Hymes, Les Aug 1, 2003 670
Odd form assembly challenges: improve productivity by increasing an application's MTBA and decreasing the MTTR. Earley, Stan Aug 1, 2003 476
Embracing those in our employ: does a company's differentiation lie in its products, or its workers? (ROI). Bigelow, Peter Aug 1, 2003 876
Misery loves company? Hamburg, Lisa Jul 1, 2003 886
U.S. demand for EMI/RFI shielding options to Exceed $600 million by 2008. Jul 1, 2003 392
Are embedded passives ready for prime time? Key players and innovations shape the future of embedded components. Vardaman, E. Jan Jul 1, 2003 984
Selecting the optimal test strategy: how to find the right balance among all the choices--ICT, AOI and AXI. Oresjo, Stig Jul 1, 2003 1679
Creating a more flexible manufacturing line: one company changed successfully from producing a few high-volume products to greater quantities of more diverse products. Kindness, Ken Jul 1, 2003 1187
Calculating the total costs of offshore outsourcing: is your product suited for offshore manufacturing? Mucha, Susan Jun 1, 2003 1168
Same old, same old. Hamburg, Lisa Jun 1, 2003 697
Asymtek marks 20 years in PCB assembly industry. Brief Article Jun 1, 2003 139
Bringing it all together at UIC's grand opening at Shekou, China. Luthra, Mukul Jun 1, 2003 1221
Plastic fantastic: conductive epoxies boldly go where no solder has gone before. Zarrow, Phil Jun 1, 2003 1021
Dry solder joints and assembly cleanliness: Les defines solderability and troubleshoots cleaning process problems. Hymes, Les Jun 1, 2003 688
The road ahead for board assembly: several process and equipment developments are needed to keep North America in pace with the changing nature of electronics manufacturing. Chen, Alex Jun 1, 2003 1729
The persistent problem of tombstoning: understanding this phenomenon and how to prevent it. Trip, Harry Jun 1, 2003 1746
Defense electronics outsourcing: EMS companies should think twice before entering the defense market. Gordon, Pamela J. Jun 1, 2003 680
Innovation and renovation at Isola: with a new president and a new (slimmer) look, many eyes are on Isola--and not just those of its suitors. (Cover Story). Buetow, Mike May 1, 2003 1293
Scares. Hamburg, Lisa May 1, 2003 736
Solderability and traceability: les addresses surface finish concerns and component identity tracking. Hymes, Les May 1, 2003 690
Investigating 0201 printing issues and stencil design: experimental results on printer settings, stencil design and stencil technology for 0201s. Yi, Sammy May 1, 2003 2505
The most important integrated passive R&D projects:a top five list. Ulrich, Richard May 1, 2003 2594
Elementary, my dear rework technician: uncovering the mysteries of 2-D x-ray inspection. Ferry, Jeff May 1, 2003 718
Solder paste handling: welcome to our newest series--Ten Timely Tips! Bimonthly, we'll provide you with 10 technology tips on a certain process aspect culled from the best suggestions received from readers. Apr 1, 2003 767
Reducing solder voids with copper-filled microvias: a study seeks to find out the frequency, location and size of voids with and without copper-filled vias. Nishu, Keisuke Apr 1, 2003 1912
Validating press-fit connector installation: a winning combination: press-fit technology and installation by PC-controlled servo-electric presses. Mitchell, Jack Apr 1, 2003 2127
Automating 0201 rework: automation and conductive heating are essential for effective rework of tiny 0201s--and beyond. Czaplicki, Brian Apr 1, 2003 1169
Through-hole automation challenges: new applications push the boundaries of mature technologies. Giangrieco, John Apr 1, 2003 485
Waste not, want not: simplify BGA rework by reusing leftover solder. Ferry, Jeff Apr 1, 2003 711
Desperate times ... Hamburg, Lisa Mar 1, 2003 700
IPC announces Electronics Assembly Scholarship Fund. Mar 1, 2003 297
Finding BGA opens in production: a new method using AXI compares reflowed BGA ball sizes to detect open solder joints. Leinbach, Glen Mar 1, 2003 1512
Don't give me what I ask for: give me what I need: a guide to creating accurate RFQs. Gordon, Pamela Mar 1, 2003 942
"Tool time" in rework: expect the unexpected: common tools can be put to good use during rework. Ferry, Jeff Mar 1, 2003 783
Solving a BGA footprint mismatch: daughter card to the rescue. Ferry, Jeff Feb 1, 2003 662
A mass measurement system for screen printing: several experiments have proven mass measurement's viability for monitoring the printing process. Lieske, Richard Feb 1, 2003 2403
Screen printing: welcome to our newest series--Ten Timely Tips! Bimonthly, we'll provide you with 10 technology tips on a certain process aspect culled from suggestions received from readers. Feb 1, 2003 872
No cleaning required? Use of a no-clean flux requires a well-controlled clean process. Hymes, Les Feb 1, 2003 605
Machine vision challenges: the key to success: flexibility with illumination and lens choice. Boulanger, Richard Feb 1, 2003 449
Visualizing and predicting solder paste flow--in real time: a unique method eliminates errors associated with typical post-print measurement systems. Andres, Frank Feb 1, 2003 2159
Be forewarned. Hamburg, Lisa Nov 1, 2002 563
Kapton[R] tape: the duct tape of the electronics industry. Yates, Phil Nov 1, 2002 305
SMTA. Nov 1, 2002 85
Flip chip packaging: a hot topic: flip chip technology appears to be one bright spot in the electronics industry after a difficult year. Vardaman, E. Jan Nov 1, 2002 963
Don't give me any static: resources and tips to help you avoid ESD problems. Hymes, Les Nov 1, 2002 660
Flip chip processing factors: implementing flip-chip process capability is not a simple task. Find out how to make the process less painful. Beddingfield, S. Craig Nov 1, 2002 696
Who's afraid of lead-free rework? The rules of rework change when dealing with lead-free assemblies. Ferry, Jeff Nov 1, 2002 655
The right tool for the job: determining the right-sized EMS provider for your high-mix, low-volume work. Bilbrough, Bob Nov 1, 2002 2360
Managing the OEM/EMS relationship: EMS companies must be dedicated to the fundamental traits originally attracting OEMs to the outsourcing business model. MaGee, Marvin Nov 1, 2002 1744
Managing the EMS value chain: to succeed in today's marketplace, EMS providers should focus on their core competencies, partner relationships and continuous improvement. Fargo, Mike Nov 1, 2002 1224
Real-time data collection and analysis: enterprise productivity software can be used to address numerous data collection and analysis problems faced by electronics manufacturers. Spera, Jason Nov 1, 2002 1414
From the shop floor to the top floor: a new data exchange method provides real-time, accurate data from the factory floor to a company's top decisionmakers. Motherway, Michael Brief Article Nov 1, 2002 1435
Hand soldering--the cause of the failure? Hand-soldered, no-dean flux residues may create electrical leakage failures. Munson, Terry Nov 1, 2002 613
Living large: building big, bad backpanels: how are these monsters produced? Phil explains the processes and the equipment. Zarrow, Phil Oct 1, 2002 797
The devil's in the details: tombstoning revisited: you've checked the oven, the oven profiles, the solder paste and the nitrogen levels--why are you still encountering tombstoning? Hymes, Les Oct 1, 2002 687
Searching for the perfect BOM: a NEMI team comprised of OEMs and EMS providers offers recommendations for improving bills of materials. McElroy, Jim Oct 1, 2002 2336
Linking the factory office to the factory floor: the correct documentation control system can increase productivity and quality while reducing costs. Spera, Jason Oct 1, 2002 1718
CSP and flip chip assembly using tacky flux: a recent research project found how placement accuracy of CSPs and flip chips is affected by the component pitch and board layout. Emmen, Hans Oct 1, 2002 1770
Computer-aided production planning: a new, free software program enables supervisors to quickly and accurately calculate production line requirements. Senawaitis, Anthony J. Oct 1, 2002 409
Coating removal methods: normally, removing a large QFF from a board would be easy, but what do you do with thick, clear, rubbery coatings? Ferry, Jeff Oct 1, 2002 832
Mexico versus China. Murray, Jerry Oct 1, 2002 506
All that's old is new again. Hamburg, Lisa Sep 1, 2002 761
The end of an era: manufacturing research and development appears to be a lost art--one that needs to be rediscovered. Vardaman, E. Jan Sep 1, 2002 700
Die skewing: due to the continued growth of flip-chip technology in next-generation products, avoiding die skew is essential. Lewis, Brian Sep 1, 2002 672
Component removal and attachment issues: this month, Les clarifies readers' assumptions concerning underfill material in rework and repair and reflow soldering. Hymes, Les Sep 1, 2002 680
Well, it sure didn't feel mild. Hamburg, Lisa Jul 1, 2002 596
Is it clean? Why do you want to know? Part I: do you sometimes battle with your customers over cleanliness? Hymes, Les Jul 1, 2002 672
Screening for errors: what's to blame? Stencil printer verification procedures allow production problems to be quickly isolated and corrected. O'Hanlon, Michael Jul 1, 2002 1850
Legend and markings repair: boards with damaged legends or markings aren't necessarily destined for the scrap bin--three IPC-approved methods can help. Ferry, Jeff Jul 1, 2002 679
MSD: What you don't know may be killing you: MSDs could be destroying your facility's yields at this very moment. Zarrow, Phil Jun 1, 2002 986
An ounce of prevention is worth a pound of cure: having problems with solderability issues? Les guides two readers through possible solutions. Hymes, Les Jun 1, 2002 708
Substrates for flip chip assembly: optimize substrate design and technology selection to reduce assembly defect levels and overall substrate costs--before the production phase. Westby, George Jun 1, 2002 623
ESD educational resources: excellent ESD resources do exist--if you know where to look. Brandt, Michael T. Jun 1, 2002 584
Conformal coatings for component protection: a new thick-film lacquer provides short process times and improved protection from climatic, chemical and mechanical loads. Suppa, Manfred Jun 1, 2002 1982
Recycling batch screen and stencil cleaner wastewater: closed-loop recycling offers an efficient, cost-effective alternative to evaporation. Volpe, Jack Jun 1, 2002 2926
Like Gulliver in Lilliput: reworking tiny components: rework of 0402 and 0201 chip components is not impossible. Ferry, Jeff Jun 1, 2002 649
Dross "Grabber" separates good solder from dross. Jun 1, 2002 684
The state of optoelectronics. Murray, Jerry May 1, 2002 730
Back to the basics: a reader asks Les to help with some basics of the assembly process. Hymes, Les May 1, 2002 759
A strategic approach to automating photonics manufacturing: full automation in manufacturing and assembly is the key to success in photonics industry. Campbell, Joe May 1, 2002 1259
Should you automate control of moisture-sensitive devices? Perhaps. A return-on-investment analysis confirmed the benefits of an automated control system for MSDs. Monette, Francois May 1, 2002 2784
Turning boards in hours instead of days: ready for improved communication, productivity and product quality? Try a Web-based data management system that links the production floor with other departments. Roche, James May 1, 2002 1245
Enhance your BGA x-ray inspection process: understanding x-ray signatures allows operators to rapidly diagnose the BGA assembly process and improve quality control. Zweig, Gil May 1, 2002 1517
A cure for BGA's warped sense of humor: rework can result in BGA warpage--find out how it can be prevented. Ferry, Jeff May 1, 2002 640
Finding residue sources: Part I: finding residue sources in PCBs using Six Sigma techniques. Munson, Terry May 1, 2002 462
The toxic release inventory: lead reporting thresholds have been reduced. Is your facility affected? Abrams, Fern May 1, 2002 792
CCA expands resources. Murray, Jerry Apr 1, 2002 464
Managing your ESD program: implementing an ESD control program is important, and the results can make a tremendous difference in a facility's success. Brandt, Michael T. Mar 1, 2002 685
New no-lead solder pastes and reflow techniques: a new study evaluated the performance of SnAgBi and SnAgCu alloys with bare copper and immersion tin pad finishes. Heller, David Mar 1, 2002 957
Optimizing printer-based solder paste inspection: a 2-D inspection system combined with SPC can improve PCB quality and increase profitability. O'Neal, Dennis Mar 1, 2002 2089
Through-hole rework of thermal dissipating assemblies: step-by-step instructions are given for a new method of reworking expensive through-hole heat sink assemblies. Wachter, Ronald Mar 1, 2002 1388
Improving the Flash value stream with new technologies: inline systems provide just-in-time programming of Flash memory devices, improving production line throughput and increasing yields. Boone, D. Judd Mar 1, 2002 2311
Used equipment vs. new asking the right questions: depending on your company's needs, used assembly equipment can often be a better buy than brand new equipment. O'Neil, Steve Mar 1, 2002 1970
The unkindest cut of all: performing etch cuts in external and internal connections can be simple or extremely complex. Ferry, Jeff Mar 1, 2002 788
Managing quick-turns: the prototype assembly stage doesn't have to riddle a project with delays. Hackathorn, Mark Mar 1, 2002 766

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