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Laser direct structuring material.

U.S. Patent 9,074,070 (July 7, 2015), "Thermoplastic Composition for Use in Forming a Laser Direct Structured Substrate," Paul C. Yung and Rong Luo (Ticona LLC, Florence, Kentucky, USA).

Portable computers and handheld devices with wireless communication capabilities require built-in antennas. These are based on conductive networks formed in plastic by laser direct structuring (LDS). However, plastic compound ingredients such as flame retardants impede the LDS process. Thus a need exists for a laser-activated thermoplastic composition having a high dielectric constant but still maintaining excellent mechanical properties and processability.

Yung and Luo developed a material containing a thermotropic liquid crystalline polymer, a dielectric material, laser-activatable additives, and a fibrous filler. This material can be readily shaped into a thin substrate, and conductive networks readily formed on it by the laser process. This material consists of 20-80 wt% of the thermotropic liquid crystalline polymer, 0.1-30 wt% of the laser-activatable additive, 1-50 wt% dielectric material, and 5-50 wt% fibrous filler. The thermotropic liquid crystalline polymer is based on naphthenic polyesters; the laser activators are spinel crystals with two or more metal oxide clusters; and the dielectrics are ceramic fillers such as barium titanate or carbon particles.

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Title Annotation:INDUSTRY PATENTS; patent received
Author:Corneliussen, Roger
Publication:Plastics Engineering
Article Type:Brief article
Date:Oct 1, 2015
Words:197
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