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Kulicke & Soffa Announces a Major Order From Nantong Fujitsu For Nu-Tek Ball Bonders.

Business Editors/High-Tech Writers

WILLOW GROVE, Pa.--(BUSINESS WIRE)--June 5, 2003

Kulicke & Soffa Industries, Inc. (Nasdaq:KLIC) today announced that the company has received a purchase order from Nantong Fujitsu Microelectronics Co., Ltd. (NFME) of Nantong City, China. The order quantity is an additional 50 Nu-Tek(TM) ball bonders to be delivered in accordance with the production needs of Nantong Fujitsu. In addition, Nantong Fujitsu also expressed their intention that K&S will be their major supplier of wire bonders over the next 12 month time period.

Mr. Mingda Shi, Chairman of the Board & General Manager of Nantong Fujitsu, commented, that they are currently running the K&S Nu-Tek machines in their production department. Those machines, along with the K&S local support and their production people, have created a winning team they believe is superior. With the current Nu-Tek's success in mind, they decided to expand their wire bonding capacity with more K&S Nu-Tek machines.

K&S Vice President of Marketing, Christian Rheault, said he was very pleased to receive the 50 machine follow-on order from Nantong Fujitsu. "Furthermore, we are quite honored to be selected as the major supplier for Nantong Fujitsu's wire bonders. Of course we must continue to earn their business going forward, but it is quite gratifying to establish this kind of solid relationship with a relatively new wire bonder model now entering the large transistor packaging market in China."

About Nantong Fujitsu

Nantong Fujitsu Microelectronics Co., Ltd is the largest Chinese enterprise in the integrated circuit (IC) packaging and testing industry in China. With its large manufacturing capability, great variety in product offerings, and the best technology in test and assembly in China, Nantong Fujitsu is specialized to provide services for wafer test, IC assembly and final test. Today, Nantong manufactures more than 100 series of IC products, leading in MCM, MEMS and BCC. It also leads technology in the 8 inch, 150um wafer back-grinding, Pd/Sn electroplating process, computer aided testing and multi-head testing. At full capacity, the company is now able to assemble one billion parts, package test half billion parts and wafer test 0.4 billions parts per year.

About Kulicke & Soffa

Kulicke & Soffa (Nasdaq:KLIC) is the world's leading supplier of wire bonding equipment in the semiconductor assembly market. K&S is the only equipment supplier that also develops and manufactures the products that touch a semiconductor chip's wire bonding pad surfaces, starting with electrical testing and ending with specially formed wire interconnections that remain as a part of the chip's package. These products include: test probes; bonding wire; and capillaries, which provide an all-inclusive interconnect process when used with the company's wire bonding equipment. In addition, the company offers wafer dicing equipment and cutting blade solutions as well as Flip Chip wafer bumping services and technology. Chip scale and wafer level packaging solutions include Ultra CSP(R) technology. Test interconnect products include standard and vertical probe cards, ATE interface assemblies and ATE boards for wafer testing, as well as test sockets and contactors for all types of packages. Kulicke & Soffa's web site address is http://www.kns.com.

Caution Concerning Forward Looking Statements

This press release contains forward-looking statements which are found in various places throughout the press release. While these forward-looking statements represent our judgments and future expectations concerning the development of our business, a number of risks, uncertainties and other important factors could cause actual developments and results to differ materially from our expectations. These factors include, but are not limited to, those listed or discussed in Kulicke & Soffa Industries' 2002 Annual Report on Form 10-K and: the risk of failure to successfully manage our operations; the risk that anticipated orders may not materialize or that orders received may be postponed or canceled, generally without charges; the risk that anticipated cost savings will not be achieved; the volatility in the demand for semiconductors and our products and services; acts of terrorism and violence; overall global economic conditions; risks, such as changes in trade regulations, currency fluctuations, political instability and war, associated with a substantial foreign customer and supplier base and substantial foreign manufacturing operations; potential instability in foreign capital markets; and other key factors that could adversely affect our businesses and financial performance contained in past and future filings and reports, including those with the SEC. Kulicke & Soffa Industries is under no obligation to (and expressly disclaims any obligation to) update or alter its forward-looking statements whether as a result of new information, future events or otherwise.
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Publication:Business Wire
Geographic Code:9CHIN
Date:Jun 5, 2003
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