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Japan : ASE, Infineon team up for assembly of auto products.

Advanced Semiconductor Engineering (ASE) has declared a joint development and product agreement for assembly services of automotive products with Infineon Technologies. The association will concentrate on facilitating copper wirebonding for QFP packages in automotive microcontrollers and manufacturing.

ASE mentioned that it has shipped above 25 billion units of copper wire IC packages to date.

Peter Schaefer, VP and GM of Infineon's automotive microcontroller business unit in a statement said, "We trust in ASE with their strong manufacturing background to fulfill the stringent automotive market quality requirements and build on the long existing partnership to enlarge our current QFP portfolio for future microcontrollers .

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Publication:Mena Report
Date:Nov 8, 2013
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