Investigation into applicable inspection and analysis techniques for flip chip devices.
Tenders are invited for: Investigation into applicable inspection and analysis techniques for flip chip devices - expro plus.
Objectives: Identification of new suitable methods to inspect flip chipped devices and Identification of suitable methods to carry out Destructive Parts Analysis on Flip Chip devices to determine the quality and suitability of flip chipped devices for flight applications. Description: Technology is currently being developed to use devices mounted in a flip chip configuration under ECI3. Whilst there are on-going activities that address the construction and mounting of these devices there is no current applicable inspection standard that addresses all the PA requirements for this type of construction. Given the small numbers and often very high costof the components used it is considered like in many space flight production applications unlikely that statistical process control methods will be satisfactory and that more typical verification methods will be applied. Specific areas of concern are the solder joints created during the mounting of the die to the package and the inspection of the active side of the die after the flip chip mounting process. Also concerning is the use of a heat spreader which is incorporated to dissipate the thermal energy from the devices. Whilst it is understood that real time X-Ray methods can be used for the inspection of solder joints the small dimensions will drive the requirement for high performing systems and careful examination of the imaged joints. Due to the large number of joints and the inevitably limited field of view (due to the zoom required) this will be a very slow and laborious process that may be difficult to accommodate in a production process. Inspection of the active side of the die does however raise some significant challenges. Current PA requirements are that the active areas of die are inspected for defects cleanliness and damage Immediately priorto permanent covering which prevents any subsequent inspection. In the case of flip chip it is anticipated that the die will be soldered cleaned (to remove fluxes) and then under filled after the final possible inspection of the active areas of the die. Given that there is a workable solution albeit time consuming to the inspection of the solder joints this study will primarily consider the issues of inspection of the die surface etc. post flip chip. Currently deployed methods of destructive analysis are designed and have been evolved over many years to address the analysis methods required to verify the quality of a product constructed withhermetic chip and wire technologies that would include mounting of discrete components with solders or adhesives. Methods such as die shear and pull testing are not applicable and traditional visual inspection methods are of limited value as it is not possible to see the active areas of the die surface or solder joints etc.
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