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Intel Extends Embedded Offerings With Intel(R) Core(TM)2 Duo Processors.

Intel[R] Core[TM] Microarchitecture Sets New Standard for Low Power, Scalability in the Embedded Market

SANTA CLARA, Calif. -- Intel Corporation today announced expanded life cycle support for the Intel[R] Core[TM]2 Duo E6400 and T7400 processors for embedded applications, ranging from bank ATMs to point-of-sale cash registers.

Based on the revolutionary Intel[R] Core[TM] microarchitecture, these two Intel dual-core processors expand the portfolio of high-performance, power efficient solutions with long life cycle support for 5 to 7 years for its embedded customers.

The Intel Core 2 Duo embedded processors meet the demands of a wide range of performance-intensive, low-power embedded applications that require smaller form factors. Beyond ATMs and point-of-sale terminals, the processors are ideal for interactive computers such as gaming platforms, industrial control and automation, digital security surveillance, medical imaging and communications applications.

The Intel Core 2 Duo E6400 and T7400 processors offer a range of performance and performance-per-watt capabilities to provide embedded customers with the design flexibility to create new solutions and to solve small form factor design challenges typical of embedded market segments. Taking advantage of the Intel Core microarchitecture, these new products offer a power-sensitive blueprint design providing enhanced energy-efficient performance to help equipment manufacturers balance processing capabilities within power and space constraints.

System-enhancing hardware innovations such as Intel[R] Virtualization Technology (Intel VT) are also supported in the E6400 and T7400 processors. With Intel VT, embedded applications running on separate platforms can be consolidated onto a single platform, helping to fuel cost savings and improve reliability and manageability.

"For decades Intel has been a leader in embedded products, and today we have raised the bar for embedded performance while maintaining the low thermals and long life cycle support that are critical to embedded applications," said Joe Jensen, general manager, Marketing and Platform Programs, Intel Communications Infrastructure Group. "The remarkable performance and energy efficiency that Intel Core 2 Duo processors offer desktop and laptop PCs are significant benefits now available to our embedded customers."

Intel is also announcing extended lifecycle support for the latest chipset to pair with the Core 2 Duo E6400, the Intel[R] Q965 Express chipset. This innovative chipset provides Intel[R] Active Management Technology capabilities, which allows for remote management and minimizes productivity loss due to system down-time. The Intel Core 2 Duo T7400 processor has been validated with the Intel[R] Q945 Express chipset, an extended lifecycle chipset announced earlier this year.

"Intel's continued innovation in multi-core processors delivers the increased performance and capabilities needed by our customers for distributed real-time systems," said Dr. James Truchard, president, co-founder and CEO of National Instruments. "With the new Core 2 Duo processor platform, Intel has taken another step forward in delivering high performance, while also providing a platform for our customers to quickly design, prototype and deploy systems that are critical to the digital factory."

The Intel Core 2 Duo E6400 and T7400 processors are currently available and priced at $224 and $423 respectively, in 1,000-unit quantities.

The Intel Core 2 Duo E6400 and T7400 processors for embedded applications will be demonstrated at Intel's booth (#801) at the Embedded Systems Conference, Sept. 25-28, at the Hynes Convention Center in Boston.

Intel, the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at

Intel, Intel Core, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others.
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Publication:Business Wire
Date:Sep 26, 2006
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