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EMS Management

"Merger and Acquisition Opportunities in the Solar Energy Market"

Author: Chaim Lubin;

Abstract: Companies across all industries are looking to solar as an alternative source of energy and revenue, and are determining where they can participate effectively. EMS companies in particular have an opportunity to capture value in this market by applying existing expertise to solar module assembly. Development into solar can seem foreign or even daunting, considering the challenges facing EMS companies. However, by understanding the solar process and the existing business model dynamics, it becomes clear the future of solar involves electronics manufacturers. This connection between EMS and solar has been validated through several precedent transactions that have occurred over the past year, with more expected throughout 2009. These transactions are being driven both by EMS businesses that recognize the similarities between module assembly and existing electronics manufacturing processes, and existing solar companies that recognize the value of outsourcing this part of their business. This paper discusses this opportunity for EMS companies to enter the solar market through module assembly and why this is the appropriate path to pursue. The market for solar and its existing growth expectations are discussed, as is the solar value chain and how the similarities between solar module assembly and electronics manufacturing services provide a unique opportunity for EMS companies. Finally, an outline is given on two approaches for companies to pursue and the advantages and disadvantages of both. (SMTA International, October 2009)

Screen Printing

"iNEMI Solder Paste Deposition Project- First Stage Review Optimizing Solder Paste Printing for Large and Small Components"

Authors: Shoukai Zhang, et al.

Abstract: The widely recognized IPC-7525 has been used as the starting point for an experimental program that explores the effect of varying the keep-out distance for 0201 and 0402 chip components, CSP and SOP with pitches down to 0.4 mm, and larger components represented by CCGA. Other variables included in the experimental program to determine if they had an effect on the sensitivity of paste transfer to keep-out distance included stencil type, step height and solder type. In the first stage of the project, the printing to each pad was measured with automated 3-D SPI systems and optimum combinations of parameters identified by statistical analysis. Here, the authors explain the methodology chosen to achieve the project objectives and indicate the direction of likely future work. Early results indicate a key objective of the project, to provide evidence to support the case for a reduction in the keep-out distances below the current industry standard, might be achievable. (SMTA International, October 2009)

Quality Assurance

"Screening For Counterfeit Electronic Components"

Authors: Stephen Schoppe, Glenn Robertson and Fabian Morales;

Abstract: Counterfeit products have been a growing problem worldwide, and the electronics industry has been no exception. Authentication of electronic components by electrical and physical testing can provide a cost-effective means of risk management, aimed at keeping counterfeits out of the supply chain. This presentation reviews sources of counterfeit components, and discusses capabilities and limitations of test processes used for authentication. Examples of component authentication using these tools are presented. (SMTA International, October 2009)

"JCAA/JG-PP Lead-Free Solder Project: -20[degrees]C to +80[degrees]C Thermal Cycle Test"

Author: Thomas A. Woodrow, Ph.D.;

Abstract: Thermal cycle testing was conducted by Boeing Research & Technology for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Lead-Free Solder Project. The JCAA/JG-PP Consortium is the first group to test the reliability of Pb-free solder joints against the requirements of the aerospace/military community. Solder alloys selected for test were SnAg3.9Cu0.6 for reflow and wave soldering; SnAg3.4Cul.0Bi3.3 for reflow soldering; SnCu0.7Ni0.05 for wave soldering; and SnPb37 for reflow and wave soldering. Test vehicles were assembled using these solders and a variety of component types, and the test vehicles were thermally cycled from -20[degrees]C to +80[degrees]C. At the conclusion of the test, 27,135 thermal cycles had been accumulated. The component solder joints were electrically monitored using event detectors, and any solder joint failures were recorded on a Labview-based data collection system. The failures of a given component type attached with SnPb solder were compared to failures of the same component type attached with Pb-free solders by using Weibull analysis. (SMTA International, October 2009)

CIRCUITS ASSEMBLY provides abstracts from recent industry conferences and company white papers. With the amount of information increasing, our goal is to provide an added opportunity for readers to keep abreast of technology and business trends.
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Publication:Circuits Assembly
Date:Nov 1, 2009
Previous Article:Thermal process optimization.

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