In case you missed it.
"Smart, Safe, Sustainable Manufacturing: A New U.S. Industrial Strategy for Competitiveness"
Author: Keith D. Nosbusch
Abstract: Control, communications, information and power technologies are converging to enable the next industrial renaissance. At the heart of this renaissance are advanced, smart manufacturing technologies that blend the best in people, physical assets, business processes and data, and seamlessly connect the plant floor to the enterprise, supply chain and the customer. With smart manufacturing, an entire plant can be optimized. Real-time information flows from machine to machine and across production lines. Plant-floor data are networked into enterprise business systems and connected with suppliers or linked to customers. Smart manufacturing is a growth engine for a sustainable economy. Rockwell Automation's CEO here makes the case that a $50 billion investment in retooling factories would generate up to $120 billion in. (Rockwell Automation, July 2009)
Passive Intermodulation Distortion
i"Electro-Thermal Theory of Intermodulation Distortion in Lossy Microwave Components"
Authors: Jonathan R. Wilkerson, Kevin G. Gard, Dr. Alexander G. Schuchinsky and Michael B. Steer
Abstract: A recently completed three-year study into the mechanisms of PIM generation in PCBs and passive microwave components attempted to understand how the PIM performance of PCB laminates, circuit interconnects and ICs affects the signal integrity of systems with distributed wave interactions. An analytic formulation of dynamic electro-thermally induced nonlinearity is developed for a general resistive element, yielding a self-heating circuit model based on a fractional derivative. The model explains the 10 dB/decade slope of the intermodulation products observed in two-tone testing. Two-tone testing at 400 MHz of attenuators, microwave chip terminations, and coaxial terminations is reported with tone spacing ranging from 1 to 100Hz. (IEEE Transactions on Microwave Theory and Techniques, vol. 56, no. 12, December 2008)
"Spin Injection/Detection Using an Organic-Based Magnetic Semiconductor"
Authors: Jung-Woo Yoo, Chia-Yi Chen, H. W. Jang, C. W. Bark, V. N. Prigodin, C. B. Eom and A. J. Epstein
Abstract: "Spintronics" promises to extend the functionality of information storage and processing in conventional electronics. The principal spintronics device, the spin valve, consists of two magnetic layers decoupled by a spin-transporting spacer, which allows parallel (on) and antiparallel (off) alignment of the magnetizations (spins) of the two magnetic layers. The device resistance then depends on the spin alignment controlled by the external magnetic field. In pursuit of semiconductor spintronics, there have been intensive efforts devoted to develop room-temperature magnetic semiconductors and also to incorporate both inorganic semiconductors and carbon-based materials as the spin-transporting channels. Molecule/organic-based magnets, which permit chemical tuning of electronic and magnetic properties, are a promising new class of magnetic materials for future spintronic applications. Here, we report the realization of an organic-based magnet as an electron spin polarizer in the standard spintronics device geometry. A thin non-magnetic organic semiconductor layer and an epitaxial ferromagnetic oxide film were employed to form a hybrid magnetic tunnel junction. The results demonstrate the spin-polarizing nature of the organic-based magnetic semiconductor, vanadium. (Nature Materials, Aug. 13, 2010)
"A Novel Approach to Experimentally Create and Mitigate Head-in-Pillow Defects"
Authors: Guhan Subbarayan, Scott Priore and Sundar Sethuraman
Abstract: The theory investigated here presumes that had BGA spheres maintained contact with the main PCB's solder paste, head-in-pillow defect would not. Therefore, it is during SMT reflow that package warpage raises the BGA sphere(s) off the applied solder during flux activation and reflow. The BGA sphere only returns to contact the melted/coalesced solder paste during cooling when the package has begun to return to its initial flatness. At this point either the flux is exhausted and is unable to form the joint, or the flux itself has created a barrier between the two solder features: BGA sphere and PCB solder bump created from the reflow paste on pad. This study devised a method to create HiP defect in a controlled lab environment. This method eliminates the use of expensive, problematic BGA components and instead applies control over reflow conditions and timing of the contact between the solder ball and the melted solder paste. A baseline process was established using a solder paste common to multiple production lines exhibiting HiP defects. Using these same programmed parameters, eight other no-clean solder pastes from different vendors were evaluated. (IPC Apex, April 2010)
This column provides abstracts from recent industry conferences and company white papers. With the amount of information increasing, our goal is to provide an added opportunity for readers to keep abreast of technology and business trends.