Printer Friendly

ISSYS Receives Phase I SBIR Grant from NSF for Development of Wafer-Scale, Hermetic Packaging of Intelligent MEMS-Based Systems.

YPSILANTI, Mich. -- Integrated Sensing Systems, Inc. (ISSYS) announced today that it has won a Small Business Innovation Research contract from the National Science Foundation (NSF). The six-month project, entitled "Wafer-Scale, Hermetic, Packaging of MEMS-Based Systems" is aimed towards development of a novel packaging method which will greatly simplify the packaging of MEMS and their associated electronics. This simplification allows the commercialization of a variety of MEMS-based products that are currently not possible due to high cost of manufacturing or packaging problems. ISSYS' method can be used for a wide variety of MEMS based devices, in particular, for applications where the MEMS device needs to be in direct contact with the media and the electronics need to be isolated from the environment.

Ms. Sonbol Massoud-Ansari, project's Principal Investigator and Vice President of ISSYS, stated that, "Our packaging method will allow a low-cost, robust, and manufacturable solution for hermetic hybrid integration of MEMS and electronics which is one of the most challenging and important problems in commercialization of MEMS devices. We greatly appreciate the support from NSF, which will allow us to expedite the development of this novel packaging solution."

ISSYS Background: ISSYS is a leader in advanced micromachining technologies for medical devices, microfluidic and scientific analytical sensing applications used in the development of drug infusion pumps and wireless, implantable sensing systems. Founded in 1995 by world-renowned leaders in MEMS technology, ISSYS is one of the oldest independent MEMS companies in the United States. An ISO 9001:2000 certified organization, ISSYS operates an "everything under one roof" multi-million-dollar, state-of-the-art Bio-MEMS fabrication facility located near Ann Arbor, Michigan. For more company, product and service information, please visit http://www.mems-issys.com/.
COPYRIGHT 2005 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2005, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

Article Details
Printer friendly Cite/link Email Feedback
Publication:Business Wire
Geographic Code:1USA
Date:Nov 30, 2005
Words:278
Previous Article:VNU Launches Video Game Web Destination & Blog; Sites Target Booming Video Game Market.
Next Article:TimeSys Introduces LinuxLink Subscriptions for Freescale's ColdFire(R) MCF547x and MCF548x Processor Families.
Topics:


Related Articles
MEMS for mobile communications: packaging systems for MEMS have very specific requirements, hermetic sealing thermal and mechanical stability.
Asia upswings with MEMS R&D and microsystems assembly.
MEMS packaging is still a challenge; opportunities exist, though, for innovative service providers.
National Science Foundation awards Invistics with Phase II-B grant.
What quiet packaging revolution? The drive for low-cost packages is pushing thermoplastics into the mainstream.
New technology for proteomics and glycomics (SBIR/STTR).
An all-silicon package? It would permit the perfect match of identical materials. So, why not?
Modeling and simulation at system level: technology goes forward, but modeling and simulation--from design through manufacture--face many bottlenecks.
SEMI debuts specs covering MEMs, masks.

Terms of use | Privacy policy | Copyright © 2018 Farlex, Inc. | Feedback | For webmasters