IRVINE SENSORS INTRODUCES 'MEMORY SHORT STACK'
IRVINE SENSORS INTRODUCES 'MEMORY SHORT STACK' COSTA MESA, Calif., May 7 /PRNewswire/ -- Irvine Sensors Corp.
(NASDAQ: IRSN) announced today that it has delivered prototype computer memory components which can immediately multiply the capacity of existing memory devices by a factor of four or more. The prototypes were built using a new form of Irvine's innovative chip-stacking technology which the firm believes can rapidly be brought to product status. James Alexiou, Irvine's president, said, "If our initial impressions prove out during the next few months, this latest advance, which we call 'Memory Short Stack,' has the potential for opening a near-term market for Irvine Sensors' manufacturing sales independent of licensees or strategic partners."
The recently delivered prototypes were built and successfully tested under an Air Force program called Memory Densification by Application of Z-Plane Lithography (MDAZL). Irvine's MDAZL component is a thin package of stacked memory chips which is physically interchangeable with a single-chip package while still providing multiple-chip performance. The individual memory chips in the stack are connected at the top by a "cap chip" which allows a variety of conventional manufacturing techniques such as wire bonding, tape-automated bonding or solder bumps to be used to interconnect the stack with higher levels of assembly. The recently completed MDAZL contract, funded through the Strategic Defense Initiative by the U.S. Air Force's Rome Laboratory and managed out of the U.S. Air Force's Phillips Laboratory, required Irvine Sensors to deliver Memory Short Stacks for integration and testing with General Electric Co.'s High-Density Interconnect multi-chip module. This module is a candidate for a secondary cache memory in a parallel processor being developed for the Air Force. Company officials said that the Memory Short Stack demonstrated on the MDAZL program offers an attractive transition technology for those users who want some of the benefits of closer chip-spacing, but who don't need or don't have the headroom to use the extra density achievable with the firm's "full-stack" technology. Government markets of interest to Irvine Sensors include a wide variety of product upgrades made possible with Memory Short Stacks designed to the Standard Electronics Module (SEM-E) format. The firm believes that the scale and variety of such uses will offer numerous government market entry possibilities. Irvine Sensors is also actively exploring potential commercial applications of its Memory Short Stack technology. One possible use would be in the emerging "memory card" marketplace. Irvine's approach would allow such cards to have a four-fold increase in capacity within their existing physical dimensions. Other commercial applications being examined are the packaging of cache memory in close proximity to processors to enhance overall speed and very-compact solid state memory components. Irvine Sensors, headquartered in Costa Mesa, is primarily engaged in the development of infrared devices and high-density packages of computer electronics which are intended to have broad applications in military and commercial systems. -0- 5/7/92 /EDITOR'S NOTE: Photos available upon request./ /CONTACT: John J. Stuart, CFO of Irvine Sensors, 714-549-8211; or Edda Brown or Harley R. Gleckman of The Wall Street Financial Corp., 310-552-1555, for Irvine Sensors/ (IRSN) CO: Irvine Sensors Corp. ST: California IN: CPR SU: PDT
DM-JL -- LA009 -- 7421 05/07/92 08:15 EDT
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|Date:||May 7, 1992|
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