INSPUR REVEALS OPEN COMPUTING/NETWORKING INNOVATIONS.
The first high-density cloud-optimized four-socket platform for CSP market, jointly announced by Inspur and Intel at last yearas OCP Global Summit, the Inspur NF8260M5 delivers energy efficiency to enable the highest number of single rack cores while lowering TCO. This cloud optimized solution has been adopted by customers in hyperscale, Fintech Cloud, enterprise and other segments requiring high computing workloads.
This high-density 2U 4-socket Inspur NF8260M5 server is validated for the second-generation Intel Xeon Scalable processor, optimized with Intel Optane persistent memory, and certified for SAP HANAA[R].
The Inspur OCP Cloud Optimized Rack Solution for SAP HANA is a fully integrated rack solution combining OCP recognized hardware and validated software to provide database capacity that can be doubled for a lower price. Customers who have multiple SAP HANA older gen nodes, where memory capacity is the limiting factor, can upgrade multiple analytics nodes (scale out) into one consolidated analytics node (scale up) with more In Memory database capacity.
Additionally, Inspur has joined the SONiC community and will provide shared open networking solutions with Sonic through two switch offerings, the Inspur SC5630EL 25GE high-density TOR switch and the Inspur SC8661SL 100GE Spine-Leaf switch with interface cards supporting hot swap.
Artificial intelligence (AI) and other emerging technologies and applications are creating workloads in data centers that are growing ever more diverse and complex. Whatas more, Internet companies are struggling with AIas increasing hardware complexity, where integrating an AI accelerator typically takes 6 to 12 months, and there is a growing imperative to improve the flexibility of AI hardware. The OAI specificationaled by Baidu, Facebook and Microsoft in the OCP communityaunifies the technical specifications of the accelerator module and simplifies the design complexity of the AI accelerator system, thereby shortening time to market for the hardware system.
The recently launched OAI UBB system also delivers breakthrough efficiency, flexibility and management. The 21-inch Full-Rack OAI solution provides simplified inter- module communication to scale up and input/output bandwidth to scale out to support disparate network architectures through OAM direct connection. And, Inspur can feature two OCP interconnect topologies: Hybrid Cube Mesh (HCM) and Fully Connected (FC).
Inspur offers an open rack solution that extends the foundation of Intel Xeon Scalable processors with built-in AI acceleration from integrated Intel Deep Learning Boost with dual San Jose Nodes connecting 8xOAMs and supporting large cluster training. With flexible GPU pooling, both OAM and UBB modules are designed to universally support different types of AI accelerators and run various AI applications such as AI cloud, deep learning for training, and image recognition.
The new UBB system highlight Inspuras longstanding commitment to leadership in open computing technologies. Moreover, with these launches, Inspur is enabling its global internet customers to leverage OAI to bring their innovative new AI solutions to market quickly.
Inspur is a provider of data center infrastructure, cloud computing, and AI solutions, ranking among the worldas top 3 server manufacturers. Through engineering and innovation, Inspur delivers cutting-edge computing hardware design and extensive product offerings to address important technology arenas like open computing, cloud data center, AI and deep learning.
For more information, visit www.inspursystems.com.