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 NEW YORK, Feb. 15 /PRNewswire/ -- IBM (NYSE: IBM) and Unisys (NYSE: UIS) today announced an agreement for design and manufacture of new, advanced-generation semiconductor chips. Under the agreement, IBM's Microelectronics Division will make advanced CMOS (complementary metal oxide semiconductor) silicon chips designed by Unisys. The effort is expected to yield major cost/performance benefits, to be delivered by early 1995 in Unisys second generation of CMOS-based open enterprise servers providing mainframe-class performance.
 Under the agreement, Unisys will provide chip design using its advanced design and simulation technology. IBM Microelectronics, in turn, will fabricate 0.5-micron silicon chips based on its high- performance CMOS technology. The devices will be made at the IBM Microelectronics Division fabrication facility in Burlington, Vt.
 Today's announcement signals the completion of Unisys migration from ECL (emitted coupler logic) to advanced CMOS-based technology in its enterprise servers. The breakthrough to sub-micron CMOS has allowed delivery of new levels of speed, density and cost effectiveness in new- generation systems.

The formal transition from ECL-based architectures to the more compact, lower cost sub-micron CMOS began with Unisys 1993 shipment of its new 2200/500 enterprise server. With this agreement, Unisys will use IBM's world-class CMOS process technology to develop systems that will advance Unisys CMOS offerings and bring even more dramatic cost performance benefits to its future systems.
 "We are delighted that Unisys has selected us as a supplier. It demonstrates that IBM's leading silicon and packaging technology capability has great value to major systems manufacturers like Unisys," said Jim Picciano, general manager, applications and solutions development, IBM Microelectronics. "This agreement is consistent with our strategy as a merchant market supplier. It leverages our world- class process technology with the design expertise of Unisys."
 "This agreement with IBM is a major step in advancing our strategic commitment to evolve from an ECL-based mainframe architecture to an enterprise server architecture that employs sub-micron CMOS." said Frank Brandenberg, Unisys vice president and deputy president, Computer Systems Group. "The Unisys hardware-independent approach to systems implementation frees us to select the best available supplier of increasingly dense silicon and advanced chip packaging. IBM represents an ideal supplier. By merging IBM's recognized leadership in silicon technology and packaging with Unisys advanced chip and system design technology, we can continue to quickly deliver lower-cost, higher- performance servers to the marketplace."
 Unisys will design the logic for the new chips at its plants in Mission Viejo, Calif.; Roseville, Minn., and Tredyffrin, Pa. Chip physical design will be performed at the Unisys Rancho Bernardo, Calif., facility. The enterprise servers incorporating the IBM chips will be manufactured at the Unisys Roseville facility.
 IBM Microelectronics is a trademark of the IBM Corporation.
 Unisys is a trademark of Unisys Corporation.
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 /CONTACT: Martin Krempasky, 215-986-4788, or Brian Daly, 215-986-2214, both of Unisys Public Relations, or Jim Smith of IBM Microelectronics, 914-892-5389/

CO: IBM; Unisys Corporation ST: Pennsylvania, Vermont, California, Minnesota IN: CPR SU: JVN

MK -- PH005 -- 3313 02/15/94 09:11 EST
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Publication:PR Newswire
Date:Feb 15, 1994

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