Printer Friendly

IBM TECHNOLOGY PRODUCTS, IRVINE SENSORS, ANNOUNCE OPENING OF THE CUBE PRODUCTION LINE

 ESSEX JUNCTION, Vt., June 25 /PRNewswire/ -- IBM Technology Products and Irvine Sensors Corp. (NASDAQ: IRSN) today announced the opening of the Cubing Process Development Center, a pilot manufacturing line for the production of an innovative semiconductor packaging technology at the IBM facility here.
 This "cube" package -- based on Irvine Sensors' chip-stacking technology -- allows building of three-dimensional semiconductors from stacks of memory or logic chips, or both, resulting in packages that are faster, denser and use less power in the same footprint as a traditional semiconductor module.
 "With the dedication of this pilot line, we're on track to meet our goals of commercializing cube technology," said Dr. Douglas A. Grose, senior location executive for IBM Technology Products' Essex Junction facility. "Right now we're starting up the line. We'll deliver some parts to Irvine Sensors later this year, and our plan is to deliver engineering samples to them and our IBM customers early next year. We see potential application for cube technology across the IBM product line. What is exciting to us is that we've been able to use current generation manufacturing equipment to produce 21st century semiconductor components."
 IBM and Irvine Sensors have signed licensing and joint development agreements to commercialize chip-stacking technology, develop cube products and the manufacturing technologies required to produce them in volume. IBM will also provide components and manufacturing services to Irvine Sensors.
 "We believe our chip-stacking technology really represents a paradigm shift in semiconductor design and packaging," said James Alexiou, chief executive officer of Irvine Sensors. "The products resulting from our collaboration with IBM will have a pervasive impact in the industry, and I am especially pleased by the dual-use potential for cube applications, both commercial and government applications."
 Irvine Sensors, headquartered in Costa Mesa, Calif., is primarily engaged in the development of high-density packages of computer electronics and infrared devices which are intended to have broad applications in military and commercial systems.
 -0- 6/25/93
 /EDITOR'S NOTE: Photos available upon request./
 /CONTACT: John Stuart, CFO of Irvine Sensors, 714-549-8211; or Les Szabo of IBM, 802-769-2483; or Edda Brown of Richmont Consulting Group, 213-658-8088, for Irvine Sensors/
 (IRSN)


CO: Irvine Sensors Corp.; IBM Technology Products ST: California, Vermont IN: CPR SU: JVN

MF-JL -- LA007 -- 5595 06/25/93 08:01 EDT
COPYRIGHT 1993 PR Newswire Association LLC
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 1993 Gale, Cengage Learning. All rights reserved.

Article Details
Printer friendly Cite/link Email Feedback
Publication:PR Newswire
Date:Jun 25, 1993
Words:376
Previous Article:KAWASAKI IS FIRST MANUFACTURER TO RECEIVE CALIFORNIA AIR RESOURCES BOARD CERTIFICATION FOR TWO-STROKE ENGINE
Next Article:SUCCESSFUL TAKEOVER BID OF SOFTFUND BY EQUITY
Topics:


Related Articles
IBM AND IRVINE SENSORS TEAM UP TO COMMERCIALIZE 3-D SEMICONDUCTOR "CUBING" TECHNOLOGY
IRVINE SENSORS RECEIVES NASA CONTRACT
Irvine Sensors Announces New Division's First Order
Irvine Sensors Receives $1M in Add-Ons From Boeing; Wearable Computer Neo-Stack Cubes Moving to Production Prototype Stage.
Irvine Sensors Participating in Optical Storage Consortium; Neo-stack Technology Being Used to Develop Removable Media for Future DVDs.
Irvine Sensors Receives Patent For Neo-Stack; Allows Different Chips to Be Stacked Together for Embedded Systems.
Irvine Sensors Receives $750K Contract for Stacked Computing Module; Air Force Award Part of $1.8 Million in Pending SBIR Contracts.
Irvine Sensors Developing New Type of Stacked Memory; First Order Received for TSOP Packages Converted to Low-Profile BGAs.
Irvine Sensors Announces New Line of Stacked Memory Products; First Ball Grid Array (BGA) Product Is Stack of Double Data Rate Parts.
Irvine Sensors Receives $1.3M Contract to Enhance Thermal Viewers.

Terms of use | Copyright © 2017 Farlex, Inc. | Feedback | For webmasters