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IBM Demonstrates Kopin CyberDisplay-Enabled Wearable PC at IBM Fair `98.

TAUNTON, Mass.--(BUSINESS WIRE)--Oct. 6, 1998--At the recent IBM Fair '98 in Tokyo, Japan, IBM Corporation, one of the world's leading technology companies, demonstrated to attendees a breakthrough in wearable computers and display technologies by showing a working prototype of a Kopin CyberDisplay-enabled clip-on personal computer.

The prototype IBM Wearable PC, a ThinkPad 560X shrunk to the footprint of a Palm Pilot complete with 340MB of storage and 64MB of EDO RAM, weighed only 10.5 ounces, including battery. This new product concept is envisioned by IBM as an ultra-convenient information tool for maintenance, repair and system installation personnel to use to display wiring diagrams, inventory lists, schematics and video. The 233 MHz PC is powerful enough to run IBM's Via Voice speech software. The Wearable PC's high quality optical image is provided by the Kopin Corporation CyberDisplay 320 which produces a high-resolution image on a small-format .24 inch diagonal AMLCD (the same display technology used in high-end notebook PC screens). Through the use of optics with the CyberDisplay, the images seen by the user appear like those seen on a typical desktop PC monitor.

About Kopin

Kopin is a leading developer and manufacturer of high resolution, flat panel display products and Wafer-Engineered(tm) device wafers for telecommunications and high resolution portable applications. Founded in 1984 with initial technology developed at Massachusetts Institute of Technology, Kopin holds over 125 patents and patent applications for technological breakthroughs in flat panel display and device wafer technology. These technologies have enabled Kopin to market display products and device wafers that enhance the delivery and presentation of video, voice and data. The Company has combined advanced AMLCD and integrated circuit technology to produce its CyberDisplay family of ultra-small, high-density imaging devices. Telecommunication providers are using Kopin's device wafers for high-performance integrated circuits used primarily in advanced cellular phones and other communications devices.

Wafer-Engineered and CyberDisplay are trademarks of Kopin Corporation

Forward-looking statements contained in this press release are made under "safe harbor" provisions of the Private Securities Litigation Reform Act of 1995 and involve a number of risks and uncertainties that could materially affect future results. Among these risk factors are general economic and business conditions and growth in the flat panel display and GaAs integrated circuit and materials industries, the impact of competitive products and pricing, availability of third-party components, availability of integrated circuit fabrication facilities, cost and yields associated with the production of the Company's CyberDisplay imaging devices and Wafer-Engineered device wafers, loss of significant customers, acceptance of the Company's products, continuation of strategic relationships and the other risk factors and cautionary statements listed from time to time in the Company's periodic reports and registration statements filed with the Securities and Exchange Commission, including but not limited to, the Company's Annual Report on Form 10K for the fiscal year ended December 31, 1997.
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Publication:Business Wire
Geographic Code:1USA
Date:Oct 6, 1998
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