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Humidity won't wilt this SLA resin. (Keeping Up with Materials).

A new epoxy resin for stereolithography (SLA) reportedly exhibits 50% better resistance to moisture than other rapid-prototyping resins as well as excellent tensile and flexural properties. Unlike existing grades that often lose strength and "wilt" in hot, humid conditions, this material provides extremely low water absorption--half that of competing materials--so that part dimensions and mechanical properties are reportedly unaffected by high humidity. WaterShed is recommended for new SLA equipment that can produce very thin-walled parts, which are even more susceptible to heat and humidity

Developed by DSM Somos, New Castle, Del., new WaterShed photopolymer is a strong and rigid resin that offers aesthetic appeal similar to the company's WaterClear family of transparent grades. Many of its physical properties match those of extrusion-grade PBT and transparent ABS. Tel: (302) 326-8100,
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Publication:Plastics Technology
Date:Feb 1, 2003
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