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High-performance ball grid array sockets.

Ironwood Electronics (Eagan, MN) recently introduced its new high-performance ball grid array socket for 1 mm pitch, 121 pin BGA integrated circuits. The SG-BGA-6457 socket is designed for a 1 2x12 mm integrated circuit package size. It operates at bandwidths up to 27 GHz with less than IdB of insertion loss. The contact resistance is typically 20 milliohms per pin.

* Socket connects all pins with 27 GHz bandwidth on all connections

* Socket is mounted on the target printed circuit board with no soldering

* Construct with open-top lid for access to the center of the IC package

* Capacitance to ground is 0.01 pF

* Current capacity is 2 amps per pin

Why Would I Specify?

* Works with devices like 121 BGA, 12 mm square package with 11x11 array and 1 mm pitch

* Constructed with high-performance and low-inductance elastomer contactor

* Comes with ball guide for the precise alignment of BGA balls to printed circuit board pads

www.ironwoodelectronics.com

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Title Annotation:First Look
Publication:Product Design & Development
Date:Apr 1, 2017
Words:157
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