Heat sinks for low airflow conditions.
Advanced Thermal Solutions has introduced maxiFlow[TM] heat sinks for cooling BGAs and other hot components in restricted airflow conditions. MaxiFlow heat sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. According to the company, tests on maxiFlow heat sinks using an airflow rate of 100 lfm show that device junction temperatures can be reduced by more than 40 percent below the temperatures achieved using other heat sinks. These heat sinks are available in lengths and widths ranging from 10 mm X 10 mm to 60 mm X 60 mm, and heights starting at 2 mm.
* Advanced Thermal Solutions
enter InfoLINK 124-60301-125
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|Title Annotation:||PACKAGING & INTERCONNECTS|
|Publication:||ECN-Electronic Component News|
|Date:||Mar 1, 2006|
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