Printer Friendly

HUGHES REVIEWS SUCCESS OF VLSIC PACKAGING TECHNOLOGY PROGRAM

 NEWPORT BEACH, Calif., June 14 /PRNewswire/ -- A team led by Hughes' Microelectronics Division has successfully completed a major manufacturing technology program in which materials and processes were developed for high density, high speed multichip modules capable of handling high thermal loads.
 Hughes, together with W.R. Grace (Columbia, Md.) and Coors CEPC (Chattanooga, Tenn.), its two subcontractors, conducted an End-of-Contract Demonstration at which results of the four-year program sponsored by the Naval Command Control and Ocean Surveillance Center (NCCOSC) Research, Development, Test and Evaluation Division, San Diego, were announced.
 The program successfully extended thin-film multilayer processes to large, six-inch diameter silicon wafers from which High Density Multichip Interconnect (HDMI/TM) substrates as large as 3.8-by-3.8 inches containing seven conductor layers and line densities of 500 per linear inch were fabricated, tested and assembled into multichip modules.
 Hot press processes for fabricating high thermal conductivity aluminum nitride already existing at Grace/Coors were applied in developing AlN packages. Fabrication of AlN packages up to 4-by-4 inches having 612 leads on 25-mil pitch was a first in industry. Packages were designed to be hermetic and to pass rigorous military screen tests. Hughes engineers reported almost a 60 percent improvement in thermal transfer for modules assembled in AlN packages over those assembled in alumina packages where gate array die dissipating up to 15 watts/cm2 were used. In addition, they reported clock speeds of 348 MHz for CMOS gate arrays assembled in the modules.
 Hughes Microelectronics Division Chief Scientist and Program manager James J. Licari, stated: "This study has resulted in numerous developments significant to meeting future requirements for both military and commercial VLSIC applications. Better communications systems, advanced radars and faster signal and data-processing will result from utilization of this program's findings and developments."
 High density multichip packaging is a means of getting the best performance out of high-speed integrated circuit chips. It is a systems-level approach in which the chips and the package are treated as a single entity, and is the key to overall performance and cost competitiveness.
 Dr. Licari cited several examples of technology transfer resulting from this program including implementation of both HDMI substrate and AlN package technologies at Hughes and at several other companies. Hughes has become an established production source for HDMI substrates and multichip modules. An all-American infrastructure for AlN packaging has also been established involving Grace/Coors as package manufacturers, Dow Chemical as an aluminum nitride powder supplier, HiRel as a supplier of lids, and F. Polesi Co. as a supplier of seal rings.
 Pat Reaves, the Navy's COTR, praised the findings of the ManTech Program and effectiveness of the work performed by Hughes and its team.
 The End-of-Contract Debriefing, held at Hughes Microelectronics Division in Newport Beach, was attended by 50 professionals representing 24 major corporations and government agencies. Further information may be obtained by contacting A.L. (Sandy) Edberg at Hughes Microelectronics Division, 500 Superior Avenue, Newport Beach, Calif. 92658-8903, 714-759-2145.
 -0- 6/14/93
 /EDITOR'S NOTE: Hughes Aircraft Company is a unit of GM Hughes Electronics Corporation./
 /CONTACT: David LeFort of Hughes Aircraft Company, 310-517-5541 or, fax, 310-517-5540/


CO: Hughes Aircraft Company ST: California IN: AIR SU:

BR-RA -- AT015 -- 1745 06/14/93 15:23 EDT
COPYRIGHT 1993 PR Newswire Association LLC
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 1993 Gale, Cengage Learning. All rights reserved.

Article Details
Printer friendly Cite/link Email Feedback
Publication:PR Newswire
Date:Jun 14, 1993
Words:537
Previous Article:AT&T ANNOUNCES ADDITION TO ITS NETPROTECT(SM) SERVICES
Next Article:SCIENTIFIC-ATLANTA INTRODUCES AUTOMATED TROUBLE CALL SYSTEM
Topics:


Related Articles
PERCEPTRONICS AND ITS CACE SOFTWARE ON WINNING HUGHES PROGRAM TEAM FOR IMPROVING IRFPA MANUFACTURING PROCESSES
PERCEPTRONICS AND ITS CACE SOFTWARE ON WINNING HUGHES PROGRAM TEAM FOR IMPROVING IRFPA MANUFACTURING PROCESSES
HUGHES NIGHT VISION SYSTEMS WINS TRP AWARD
DIRECTV(R) SETS SAIL WITH U.S. NAVY
Coors Ceramics Company Signs Major Contract With Hughes
Boeing Convenes Investigation Board Following Failed Delta III Launch.
TBN's New Network, The Church Channel, Launched on DIRECTV.
Council told to put social services house in order.
Hughes Distance Education Program in Amazon Receives IMS Learning Impact Award.

Terms of use | Copyright © 2017 Farlex, Inc. | Feedback | For webmasters