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HITACHI AND TEXAS INSTRUMENTS ANNOUNCE ALTERNATE SOURCE AGREEMENT ON ADVANCED BiOMOS BUS INTERFACE FAMILY

 HITACHI AND TEXAS INSTRUMENTS ANNOUNCE ALTERNATE SOURCE
 AGREEMENT ON ADVANCED BiOMOS BUS INTERFACE FAMILY
 TOKYO, April 23 /PRNewswire/ -- The growing importance of high- performance bus interface logic functions to electronic system design was underscored today in a joint announcement made by Hitachi, Ltd. (ADRs - NYSE: HIT), and Texas Instruments ("TI") (NYSE: TXN). Under an alternate source agreement, both companies will offer advanced BiOMOS logic families with matching specifications, performance and features.
 Designated "74ABT Series" for advanced BiOMOS TTL interface logic, the products will be optimized for high-performance bus interface applications that require a combination of high-speed, high-output current and low-power consumption. Typical applications are found in high-speed computing, data and voice communications and a variety of complex digital systems based on advanced microprocessor technology.
 The product families will consist initially of 18 bus interface logic functions including 8-, 9-, 10- and 16-bit buffers, transceivers, latches and flip-flops. The products will be fabricated with 0.8-micron advanced BiOMOS process technology. The products will be available in several versions of space-efficient surface-mount packages.
 "Fundamental changes in system design are driving the demand for high-performance bus interface logic," said Dwain Chaffin, TI Semiconductor group vice president and manager of general purpose logic products. "The new systems emerging today are increasingly faster, require wider data and address paths, and in general pack more functions and performance into smaller systems. As a result, the basic equation for system design now requires that a designer give careful consideration not only to the choice of microprocessor and memory devices, but to the choice of bus interface as well. These new logic devices must be equipped to implement the high-speed data transmission between the microprocessor unit (MPU), the network memory and other system boards while providing a low-power interface solution."
 "This agreement ensures that there will be multiple sources for the type of logic devices that will be critical to the next generation of high-performance systems," said Tokumasa Yasui, deputy general manager, Semiconductor Design & Development Center, Hitachi, Ltd. "Moreover, Hitchachi and TI have already established a working relationship with our joint development agreements in 16- and 64-megabit dynamic random- access memory (DRAM) integrated circuits. This ongoing relationship underscores our ability to work cooperatively in meeting future needs of customers."
 TI is currently in volume production on seven 74ABT logic devices covered under the agreement. TI is also sampling three additional devices. Hitachi will begin sampling its first 74ABT devices in May 1992. The TI ABT devices will be manufactured in Freising, Germany; the Hitachi ABT devices will be manufactured in Takasaki, Japan.
 MAJOR FEATURES OF 74ABT SERIES
 1. Very high-speed octal buffers: Tpd equals 2.6 ns typ.; 4.6 ns max.
 2. Realization of CMOS level low-power consumption by BiOMOS process: Static Icc: IccH equals IccZ equals 250 microamps; IccL equals 30 Ma max.
 3. High-drivability: source current -32 mA
 sink current 64 mA
 4. Low switching noise: ground-bounce equals under 0.8 v (typical)
 5. Hot-line-card-insertion: Integrating a circuit to prevent the power from leaking into the power source through the input or output terminal when the power switch is off, and being designed free from influence on the systems in operation. Even if the card board with this interface IC is plugged on/off, it can be used in the systems that require power management or non-stopping operation capability.
 6. Operating temperature range: from -40 degree Celsius through 85 degree Celsius
 7. Package lineup: DIP, SOP, SSOP, TSOP (Thin-SSOP)
 Hitachi and TI plan to extend their alternate source program in the Advanced BiOMOS bus interface area to include 18- and 20-bit devices.
 Texas Instruments Incorporated, headquartered in Dallas, is a high- technology company with sales and manufacturing operations in more than 30 countries. TI develops, manufactures and markets semiconductors, defense electronics systems, software productivity tools, computer systems and peripheral products, custom engineering and manufacturing services, electrical controls, metallurgical materials and consumer electronic products.
 Hitachi, Ltd., headquartered in Tokyo, is one of the world's largest electronic and electrical equipment manufacturers, with operations extending to computers, semiconductors, household appliances, power generating equipment and industrial machinery. Hitachi's 1990 sales totaled $54.9 billion.
 -0- 4/23/92
 /NOTE TO EDITORS: Please refer all reader inquiries to: Texas Instruments Incorporated, Semiconductor Group (SC-92043), P.O. Box 809066, Dallas, TX 75380-9066, 1-800-336-5236, Ext. 3990 (U.S./Canada), 1-214-995-6611, Ext. 3990 (Outside U.S.); Hitachi America, Ltd., Semiconductor & I.C. Division, 2000 Sierra Point Parkway, Mail Station No. 080, Brisbane, CA 94005-1819, 1-800-HITACHI/
 /CONTACT: Martha Brounoff of TI, 214-997-5469; or Osamu Naito, 914-333-2902, or Jeff Muscatine, 415-244-7195, both of Hitachi/
 (HIT TXN) CO: Hitachi, Ltd.; Texas Instruments Incorporated ST: Texas IN: CPR SU:


GK-HM -- NY041 -- 1842 04/23/92 11:44 EDT
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