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Fujikura develops multi-layer FPC.

Fujikura Ltd. (Tokyo, Japan, has developed and introduced a multi-layer FPC for use in mobile phones, PDAs and other new products that offer wide-ranging functions in compact packages. The multi-layer FPC is thinner and lighter than most multi-layer circuit boards and also boasts improved electrical characteristics and supports the use of lead-free solder.

The new FPC features polyimide film in all layers and polyimide bonding material in the insulation layers. Polyimide resin is highly heat resistant and has a low dielectric constant, allowing the FPC to achieve improved reliability and reduced transmission losses. The resin also assures sufficient heat-resistance to allow the use of lead-free solder, which has a higher reflow temperature than conventional solder.
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Title Annotation:Flexible printed circuits; Asia Watch
Author:Shedd, John
Publication:Circuits Assembly
Article Type:Brief Article
Geographic Code:9JAPA
Date:Oct 1, 2002
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