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Four Semiconductor Manufacturers Agree to Unified Specifications for Stacked Chip Scale Packages.

TOKYO--(BUSINESS WIRE)--July 5, 1999--

Hitachi, Ltd., Intel Corporation, Mitsubishi Electric Corporation, and Sharp Corporation today announced an agreement to standardize specifications for stacked chip scale packages (S-CSP), a multiple memory module for mobile communications and hand-held computing applications.

With today's announcement, Intel and Hitachi join Sharp and Mitsubishi Electric, the two companies that first proposed the S-CSP specifications standardization in September 1998. In addition to the four companies entering into the agreement above, five other companies, including both semiconductor manufacturers and semiconductor assembly manufacturers, will support the unified S-CSP specifications.

The expansion of the unified specifications group will help meet the growing demand for S-CSP products in the worldwide market for mobile communications and hand-held computing devices. Although volume production of S-CSP devices has been underway since April 1998, the addition of two new members to the unified specification agreement will help speed its adoption as the de facto standard for the world semiconductor industry. In addition, the group will contribute to the diversification of S-CSP devices and will also support users by creating smaller, lighter and highly reliable advanced products in applications markets including mobile phones and hand-held computers. -0-

(Specifics of Unified Specifications)

Note: Specifications of S-CSP with Flash memory and SRAM chips stacked
in one package

1. Compatibility of Pin Assign
2. Unification of ball layout, ball pitch
 (64pin, 72pin, ball pitch: 0.8mm)
3. Unification of package size
 (Size: 8x8, 8x10, 8x11, 8x12 mm, Height: 1.4mm MAX)

(Additional Companies agreeing to support unified specifications of
S-CSP packages)

Semiconductor manufacturers

-- Seiko Epson Corporation (Japan)
-- Sanyo Electric Co., Ltd. (Japan)

Semiconductor Assembly Manufacturers

-- Mitsui High-tec Inc. (Japan)
-- Amkor Technology, Inc. (U.S.A.)
-- Power Technology, Inc. (Taiwan)
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Publication:Business Wire
Geographic Code:9JAPA
Date:Jul 5, 1999
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