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FLIP CHIP PLACES REPEAT ORDER WITH AUGUST FOR NSX SYSTEMS.

August Technology Corporation (Nasdaq:AUGT), Bloomington, Minn., has received an order for two NSX Series bump inspection systems from Flip Chip Technologies, Phoenix, Ariz., one of the world's leading bumping companies. The two bump inspection systems will be the second and third systems installed at the company's facility in Phoenix. Valued at over $1 million, the systems are scheduled to ship by December 31, 2000.

"This order is further confirmation that the world's bumping industry leaders recognize August Technology and the NSX Series as market leaders in bump inspection," said Dan Nelson, NSX product manager. "With over 40 bump inspection systems installed worldwide, August Technology has unmatched applications expertise in providing superior inspection solutions to the world's bumping industry leaders."

"Because the NSX is a complete solution, performing accurate and consistent high-speed bump inspection on many different bump applications, the NSX Series is an excellent solution for Flip Chip Technologies and the licensees of their bumping technology," Nelson continued. "We are pleased that Flip Chip Technologies values the extensive applications experience August Technology offers and has chosen to order additional NSX bump inspection systems. We look forward to a continued relationship with them."

The NSX Series is a flexible solution for 100% inspection of gold bumps, solder bumps both pre- and post-reflow, Under Bump Metal (UBM), in addition to active die area of whole wafers, sawn wafers on film frames and discrete die. Over- and undersized, misplaced, bridged and satellite bumps, coplanarity, bump height, and gold bump nodules are just some of the defects that can be found with these systems. The NSX Series is capable of providing semiconductor manufacturers with defect information and process feedback for analysis of the post-fab process.

Flip Chip Technologies, a joint venture of Kulicke & Soffa Industries and Delphi Delco Electronics Systems, based in Phoenix, Arizona, is an innovative, high-volume wafer bumping resource providing IC packaging services and expertise to the semiconductor industry. Additional information can be found by visiting the Company's web site at www.flipchip.com.

August Technology Corporation, based in Bloomington, Minnesota, is a leading supplier of automated visual defect inspection equipment for the semiconductor industry. The inspection solutions designed, manufactured and marketed by August Technology, including the NSX Series for wafer, die and bump inspection, provide semiconductor device manufacturers with quality and process information. August Technology has established service and sales representation in all major semiconductor markets worldwide including the USA, Europe, Japan, Korea, Taiwan, Singapore, Thailand, Malaysia and others.

For more information, visit http://www.augusttech.com or call (952)259-1613.
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Publication:Electro Manufacturing
Date:Dec 1, 2000
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