Enthone awarded OSP patent.
As part of the protective coating system, preconditioner is applied to the copper surface prior to applying the OSP to the PWB. According to the company, the final aqueous coating provides excellent solderability and withstands exposure to multiple heat cycles during surface-mount and mixed-technology PWB assembly. The surface finish offers no-clean assembly compatibility, co-planarity and good bond strength for flip chip applications.
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|Title Annotation:||Industry News|
|Date:||Dec 1, 2003|
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