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Enthone awarded OSP patent.

Enthone Inc. (West Haven, CT,, a Cookson Electronics company, has been awarded U.S. Patent 6,524,644 for its ENTEK PLUS CU-106A(X) organic solderability preservative (OSP). The OSP is part of the copper protective coating system that is used as an alternative to hot air solder leveling and other metallic printed wiring board (PWB) final finishes. The process is specifically formulated for mixed metal finishes, such as selective nickel-gold features on PWBs.

As part of the protective coating system, preconditioner is applied to the copper surface prior to applying the OSP to the PWB. According to the company, the final aqueous coating provides excellent solderability and withstands exposure to multiple heat cycles during surface-mount and mixed-technology PWB assembly. The surface finish offers no-clean assembly compatibility, co-planarity and good bond strength for flip chip applications.
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Title Annotation:Industry News
Publication:Circuits Assembly
Geographic Code:1USA
Date:Dec 1, 2003
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