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Browse Encapsulation (Electronics) topic


1-14 out of 14 article(s)
Title Author Type Date Words
Acoustic verification of mold compounds. Adams, Tom Oct 1, 2017 1546
Modelling and solution of contact problem for infinite plate and cross-shaped embedment. Kozin, O.B.; Papkovskaya, O.B.; Kozina, M.O. Report Jul 1, 2016 2201
Pathological organisations and psychic encapsulation in eating disorders: a contemporary consideration. Kadish, Yael A. Report Dec 22, 2015 9500
Hydroxypropyl betacyclodextrin. Dusautois, Cecile May 1, 2009 3101
Encapsulation specialist. Brief article May 1, 2009 126
Yield stress and rheological characterization of the low shear zone of an epoxy molding compound for encapsulation of semiconductor devices. Yoshii, Masaki Technical report Apr 1, 2008 4037
De-embedding using a vector network analyzer including calibration and measurement techniques. Reyes, Steve Mar 1, 2005 4764
Portable electronics threaten embedded electronics. Hansen, Paul Dec 1, 2004 695
Encapsulants for Board-Level Assembly -- New encapsulants are being developed that provide faster cure rates tosupport lower manufacturing costs. Carson, George Apr 1, 2001 2432
Not A Simple Shell Game. Fredricks, John Brief Article Mar 1, 2000 347
Measurement and modeling of solvent removal for spin coating. Gu, J.; Bullwinkel, M.D.; Campbell, G.A. Apr 15, 1996 4314
New plastics for electronics. May 1, 1992 538
Plastics; the sine qua non of electronics packaging. Moskowitz, P.A.; Kovac, C.A. Jun 1, 1990 1850
MMIC packaging with Waffleline. Perry, Robert W.; Ellis, Tim.T.; Schineller, E.Ronald Jun 1, 1990 2855

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